品牌是'Microchip' (873)
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![]() | M2S050TS-1FG484 | Microchip Technology | 数据表 | 2968 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 56340 LE | 有 | 4695 LAB | 60 | 267 | Tray | 微芯片技术 | M2S050 | 活跃 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 30 | 1.14 V | 5.87 | 1.26 V | MICROSEMI CORP | 活跃 | SQUARE | BGA | M2S050TS-1FG484 | 无 | 85 °C | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | 现场可编程门阵列 | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050T-VF400I | Microchip Technology | 数据表 | 2539 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | ARM Cortex M3 | 4695 LAB | 90 | 207 | Tray | 微芯片技术 | M2S050 | 活跃 | LFBGA, BGA400,20X20,32 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 30 | 1.14 V | 无 | M2S050T-VF400I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.81 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 56340 LE | 有 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 207 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | 现场可编程门阵列 | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010TS-1VF256 | Microchip Technology | 数据表 | 26 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | VFPBGA-256 | YES | 256-FPBGA (14x14) | 256 | ARM Cortex M3 | 有 | 1007 LAB | 119 | 138 | Tray | 微芯片技术 | M2S010 | 活跃 | VFBGA-256 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA256,16X16,32 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S010TS-1VF256 | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.87 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 12084 LE | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B256 | 138 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050T-FGG484 | Microchip Technology | 数据表 | 2233 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | - | 64 kB | 56340 LE | 有 | 4695 LAB | 60 | 1.2000 V | 267 | 微芯片技术 | Tray | M2S050 | 活跃 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M2S050T-FGG484 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.76 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | 0 to 85 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | 现场可编程门阵列 | STD | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025TS-FGG484 | Microchip Technology | 数据表 | 2824 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | 60 | 2308 LAB | 有 | 27696 LE | 64 kB | - | - | 166 MHz | Details | This product may require additional documentation to export from the United States. | 1.2000 V | 1.14 V | 1.26 V | 267 | Tray | M2S025 | 活跃 | 0 to 85 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150TS-FC1152I | Microchip Technology | 数据表 | 2726 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FCBGA-1152 | YES | 1152-FCBGA (35x35) | 1152 | ARM Cortex M3 | 有 | 12177 LAB | 24 | 574 | Tray | 微芯片技术 | M2S150 | 活跃 | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 1.2 V | 30 | 1.14 V | 无 | M2S150TS-FC1152I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.83 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 146124 LE | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | 现场可编程门阵列 | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010TS-1VFG256T2 | Microchip | 数据表 | 44 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 256-LBGA | 256-FPBGA (17x17) | 微芯片技术 | M2S010 | 活跃 | 40 | 有 | M2S010TS-1VFG256T2 | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.8 | 1.2000 V | 138 | Tray | 0 to 85 °C | Automotive, AEC-Q100, SmartFusion®2 | e1 | 有 | 100 ppm/K | 28 Ohm | Tin/Silver/Copper (Sn/Ag/Cu) | 0.5 W | 250 | 通用型 | compliant | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 现场可编程门阵列 | 1 | 1 | FPGA - 10K Logic Modules | 256KB | 3.2 | 2.5 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090T-1FG676I | Microchip | 数据表 | 2897 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 676-BGA | 676-FBGA (27x27) | 微芯片技术 | - | 166 MHz | 86316 LE | SMD/SMT | - | 64 kB | 1.2000 V | 425 | Tray | M2S090 | 活跃 | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 90K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F200M3F-1PQG208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 208-BFQFP | 208 | 208-PQFP (28x28) | 铁粉 | 微芯片技术 | Tray | A2F200 | 活跃 | Thru-Hole | 8542310000/8542310000/8542310000/8542310000/8542310000 | 113 | Compliant | -55°C to +105°C | SmartFusion® | 0.1 | 85 °C | 0 °C | 100 MHz | 1.5 V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575 V | 1.425 V | Pb | 4.5 kB | 7 mA | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | 400 kbps | MCU, FPGA | 2500 | ARM | 200000 | 100 MHz | 1 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050T-VFG400I | Microchip | 数据表 | 2716 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 400-LFBGA | 400-VFBGA (17x17) | 微芯片技术 | SMD/SMT | - | 64 kB | 207 | Tray | M2S050 | 活跃 | - | 166 MHz | 56340 LE | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 50K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150T-1FC1152 | Microchip | 数据表 | 2797 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | 1 | 微芯片技术 | - | 574 | Tray | M2S150 | 活跃 | 64 kB | - | SMD/SMT | 146124 LE | 166 MHz | 0°C ~ 85°C (TJ) | SmartFusion®2 | No Stopper | 166MHz | 64KB | Cam | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | Zinc-Plated | 1 Core | 512KB | 45.0 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S005-1VFG256I | Microchip | 数据表 | 116 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 256-LBGA | 256-FPBGA (17x17) | 微芯片技术 | 活跃 | MSL 3 - 168 hours | 161 | Tray | M2S005 | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 191Kbit | FPGA - 5K Logic Modules | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S005-VF256I | Microchip | 数据表 | 38 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 256-LFBGA | YES | 256-FPBGA (14x14) | 256 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | 微芯片技术 | BGA256,16X16,32 | 1.2 V | 30 | 1.14 V | 无 | M2S005-VF256I | LFBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.84 | 161 | Tray | M2S005 | 活跃 | - | 166 MHz | 6060 LE | SMD/SMT | - | 64 kB | VFBGA-256 | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B256 | 161 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 161 | 1.56 mm | 现场可编程门阵列 | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150T-1FC1152M | Microchip | 数据表 | 510 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | 微芯片技术 | 无 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.81 | NC16 | Cully-Minerallac | 574 | Tray | M2S150 | 活跃 | FBGA-1152 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -55 °C | 1.2 V | 30 | 1.14 V | 125 °C | -55°C ~ 125°C (TJ) | SmartFusion®2 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | 现场可编程门阵列 | FPGA - 150K Logic Modules | 146124 | 512KB | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150-1FCVG484 | Microchip | 数据表 | 2756 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BFBGA | YES | 484-FBGA (19x19) | 484 | GRID ARRAY, FINE PITCH | 4 | PLASTIC/EPOXY | 微芯片技术 | BGA484,22X22,32 | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M2S150-1FCVG484 | FBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.77 | 273 | Tray | M2S150 | 活跃 | - | 166 MHz | 146124 LE | - | 64 kB | VFBGA-484 | 0°C ~ 85°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B484 | 273 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 273 | 3.15 mm | 现场可编程门阵列 | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060T-FCS325I | Microchip | 数据表 | 2983 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 325-TFBGA, FCBGA | 325-FCBGA (11x11) | Polystyrene | 微芯片技术 | 166 MHz | 56520 LE | - | 64 kB | US | EAR99 | 200 | Tray | M2S060 | 活跃 | - | -40°C ~ 100°C (TJ) | SmartFusion®2 | Facility Identification | 166MHz | 64KB | ARM® Cortex®-M3 | 不发光 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | English | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010-1FGG484 | Microchip | 数据表 | 22 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | 64 kB | FBGA-484 | 网格排列 | 3 | 微芯片技术 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M2S010-1FGG484 | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.77 | 233 | Tray | M2S010 | 活跃 | - | 166 MHz | 12084 LE | SMD/SMT | - | 0°C ~ 85°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 233 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS250T-1FCG1152EES | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | 微芯片技术 | MCU - 136, FPGA - 372 | Tray | 活跃 | 0°C ~ 100°C | PolarFire™ | - | 2.2MB | RISC-V | DMA, PCI, PWM | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS160TLS-FCVG784I | Microchip Technology | 数据表 | 2855 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-784 | 784-FCBGA (23x23) | RV64GC, RV64IMAC | 微芯片技术 | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | 0 C | SMD/SMT | 312 I/O | 161000 LE | Tray | 活跃 | This product may require additional documentation to export from the United States. | - | 1 | 4 x 32 kB | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 5 Core | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS160TS-1FCSG536I | Microchip Technology | 数据表 | 2288 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-536 | 536-LFBGA | RV64GC, RV64IMAC | 微芯片技术 | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | 0 C | SMD/SMT | 312 I/O | 161000 LE | Tray | 活跃 | This product may require additional documentation to export from the United States. | - | 1 | 4 x 32 kB | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 5 Core | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS250T-1FCG1152I | Microchip Technology | 数据表 | 2142 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-1152 | 1152-FCBGA (35x35) | RV64GC, RV64IMAC | 微芯片技术 | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | 0 C | SMD/SMT | 372 I/O | 254000 LE | Tray | 活跃 | This product may require additional documentation to export from the United States. | - | 1 | 4 x 32 kB | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS095TS-1FCVG484I | Microchip Technology | 数据表 | 2524 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-484 | 484-FCBGA (19x19) | RV64GC, RV64IMAC | 微芯片技术 | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | - 40 C | SMD/SMT | 276 I/O | 93000 LE | Tray | 活跃 | This product may require additional documentation to export from the United States. | - | 1 | 4 x 32 kB | -40°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS160T-FCSG536E | Microchip Technology | 数据表 | 2791 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FCSG-536 | 536-LFBGA | RV64GC, RV64IMAC | 微芯片技术 | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 161000 LE | 312 I/O | 0 C | + 100 C | 1 | Tray | 活跃 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 0°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 5 Core | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS160TL-FCVG484E | Microchip Technology | 数据表 | 2954 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-484 | 484-FCBGA (19x19) | RV64GC, RV64IMAC | 微芯片技术 | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 161000 LE | 312 I/O | 0 C | + 100 C | 1 | Tray | 活跃 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 0°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 5 Core | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS095TS-1FCSG325I | Microchip Technology | 数据表 | 2977 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-325 | 325-LFBGA (11x14.5) | RV64GC, RV64IMAC | 微芯片技术 | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 93000 LE | 276 I/O | - 40 C | + 100 C | 1 | Bulk | 活跃 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | -40°C ~ 100°C | Tray | - | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128KB |
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