品牌是'Microchip' (873)

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产品型号

品牌

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库存

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Rohs

生命周期状态

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表面安装

引脚数

供应商器件包装

材料

终端数量

型芯材料

包装数量

Core

厂商

操作温度

包装

系列

容差

JESD-609代码

无铅代码

ECCN 代码

温度系数

电阻

端子表面处理

最高工作温度

最小工作温度

应用

附加功能

HTS代码

子类别

额定功率

技术

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

样式

电阻器类型

Reach合规守则

频率

JESD-30代码

输出的数量

资历状况

工作电源电压

电源

温度等级

界面

最大电源电压

最小电源电压

终端类型

内存大小

工作电源电流

速度

内存大小

配件类型

核心处理器

照明

周边设备

程序内存大小

连接方式

数据率

建筑学

输入数量

座位高度-最大

可编程逻辑类型

逻辑元件/单元数

核心架构

总 RAM 位数

阀门数量

最高频率

速度等级

电阻公差

主要属性

逻辑单元数

完成

核数量

闪光大小

语言

凸轮长度

产品长度

产品宽度

长度

宽度

无铅

M2S050TS-1FG484
M2S050TS-1FG484
Microchip Technology 数据表

2968 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

FPBGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

56340 LE

4695 LAB

60

267

Tray

微芯片技术

M2S050

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

1.14 V

5.87

1.26 V

MICROSEMI CORP

活跃

SQUARE

BGA

M2S050TS-1FG484

85 °C

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

FPGA - 50K Logic Modules

56340

1 Core

256KB

23 mm

23 mm

M2S050T-VF400I
M2S050T-VF400I
Microchip Technology 数据表

2539 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

VFPBGA-400

YES

400-VFBGA (17x17)

400

ARM Cortex M3

4695 LAB

90

207

Tray

微芯片技术

M2S050

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

M2S050T-VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

207

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

207

1.51 mm

现场可编程门阵列

FPGA - 50K Logic Modules

56340

1 Core

256KB

17 mm

17 mm

M2S010TS-1VF256
M2S010TS-1VF256
Microchip Technology 数据表

26 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 1 month ago)

VFPBGA-256

YES

256-FPBGA (14x14)

256

ARM Cortex M3

1007 LAB

119

138

Tray

微芯片技术

M2S010

活跃

VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

30

1.14 V

85 °C

M2S010TS-1VF256

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.87

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B256

138

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

FPGA - 10K Logic Modules

12084

1 Core

256KB

14 mm

14 mm

M2S050T-FGG484
M2S050T-FGG484
Microchip Technology 数据表

2233 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

-

64 kB

56340 LE

4695 LAB

60

1.2000 V

267

微芯片技术

Tray

M2S050

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

1.14 V

85 °C

M2S050T-FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.76

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

0 to 85 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

STD

FPGA - 50K Logic Modules

56340

1 Core

256KB

23 mm

23 mm

M2S025TS-FGG484
M2S025TS-FGG484
Microchip Technology 数据表

2824 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

484-BGA

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

60

2308 LAB

27696 LE

64 kB

-

-

166 MHz

Details

This product may require additional documentation to export from the United States.

1.2000 V

1.14 V

1.26 V

267

Tray

M2S025

活跃

0 to 85 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 25K Logic Modules

1 Core

256KB

M2S150TS-FC1152I
M2S150TS-FC1152I
Microchip Technology 数据表

2726 In Stock

-

最小起订量: 1

最小包装量: 1

FCBGA-1152

YES

1152-FCBGA (35x35)

1152

ARM Cortex M3

12177 LAB

24

574

Tray

微芯片技术

M2S150

活跃

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

30

1.14 V

M2S150TS-FC1152I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.83

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

146124 LE

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B1152

574

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

574

2.9 mm

现场可编程门阵列

FPGA - 150K Logic Modules

146124

1 Core

512KB

35 mm

35 mm

M2S010TS-1VFG256T2
M2S010TS-1VFG256T2
Microchip 数据表

44 In Stock

-

最小起订量: 1

最小包装量: 1

256-LBGA

256-FPBGA (17x17)

微芯片技术

M2S010

活跃

40

M2S010TS-1VFG256T2

Microsemi Corporation

活跃

MICROSEMI CORP

5.8

1.2000 V

138

Tray

0 to 85 °C

Automotive, AEC-Q100, SmartFusion®2

e1

100 ppm/K

28 Ohm

Tin/Silver/Copper (Sn/Ag/Cu)

0.5 W

250

通用型

compliant

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

现场可编程门阵列

1

1

FPGA - 10K Logic Modules

256KB

3.2

2.5

M2S090T-1FG676I
M2S090T-1FG676I
Microchip 数据表

2897 In Stock

-

最小起订量: 1

最小包装量: 1

676-BGA

676-FBGA (27x27)

微芯片技术

-

166 MHz

86316 LE

SMD/SMT

-

64 kB

1.2000 V

425

Tray

M2S090

活跃

-40 to 100 °C

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 90K Logic Modules

1 Core

512KB

A2F200M3F-1PQG208
A2F200M3F-1PQG208
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

208-BFQFP

208

208-PQFP (28x28)

铁粉

微芯片技术

Tray

A2F200

活跃

Thru-Hole

8542310000/8542310000/8542310000/8542310000/8542310000

113

Compliant

-55°C to +105°C

SmartFusion®

0.1

85 °C

0 °C

100 MHz

1.5 V

EBI/EMI, Ethernet, I2C, SPI, UART, USART

1.575 V

1.425 V

Pb

4.5 kB

7 mA

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

400 kbps

MCU, FPGA

2500

ARM

200000

100 MHz

1

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

无铅

M2S050T-VFG400I
M2S050T-VFG400I
Microchip 数据表

2716 In Stock

-

最小起订量: 1

最小包装量: 1

400-LFBGA

400-VFBGA (17x17)

微芯片技术

SMD/SMT

-

64 kB

207

Tray

M2S050

活跃

-

166 MHz

56340 LE

-40°C ~ 100°C (TJ)

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 50K Logic Modules

1 Core

256KB

M2S150T-1FC1152
M2S150T-1FC1152
Microchip 数据表

2797 In Stock

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

1152-FCBGA (35x35)

1

微芯片技术

-

574

Tray

M2S150

活跃

64 kB

-

SMD/SMT

146124 LE

166 MHz

0°C ~ 85°C (TJ)

SmartFusion®2

No Stopper

166MHz

64KB

Cam

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 150K Logic Modules

Zinc-Plated

1 Core

512KB

45.0 mm

M2S005-1VFG256I
M2S005-1VFG256I
Microchip 数据表

116 In Stock

-

最小起订量: 1

最小包装量: 1

256-LBGA

256-FPBGA (17x17)

微芯片技术

活跃

MSL 3 - 168 hours

161

Tray

M2S005

-40°C ~ 100°C (TJ)

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

-

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

191Kbit

FPGA - 5K Logic Modules

128KB

M2S005-VF256I
M2S005-VF256I
Microchip 数据表

38 In Stock

-

最小起订量: 1

最小包装量: 1

256-LFBGA

YES

256-FPBGA (14x14)

256

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

微芯片技术

BGA256,16X16,32

1.2 V

30

1.14 V

M2S005-VF256I

LFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.84

161

Tray

M2S005

活跃

-

166 MHz

6060 LE

SMD/SMT

-

64 kB

VFBGA-256

-40°C ~ 100°C (TJ)

SmartFusion®2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B256

161

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

161

1.56 mm

现场可编程门阵列

FPGA - 5K Logic Modules

6060

1 Core

128KB

14 mm

14 mm

M2S150T-1FC1152M
M2S150T-1FC1152M
Microchip 数据表

510 In Stock

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

微芯片技术

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

NC16

Cully-Minerallac

574

Tray

M2S150

活跃

FBGA-1152

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-55 °C

1.2 V

30

1.14 V

125 °C

-55°C ~ 125°C (TJ)

SmartFusion®2

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B1152

574

不合格

1.2 V

MILITARY

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

574

2.9 mm

现场可编程门阵列

FPGA - 150K Logic Modules

146124

512KB

35 mm

35 mm

M2S150-1FCVG484
M2S150-1FCVG484
Microchip 数据表

2756 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA

YES

484-FBGA (19x19)

484

GRID ARRAY, FINE PITCH

4

PLASTIC/EPOXY

微芯片技术

BGA484,22X22,32

1.2 V

40

1.14 V

85 °C

M2S150-1FCVG484

FBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.77

273

Tray

M2S150

活跃

-

166 MHz

146124 LE

-

64 kB

VFBGA-484

0°C ~ 85°C (TJ)

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B484

273

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

273

3.15 mm

现场可编程门阵列

FPGA - 150K Logic Modules

146124

1 Core

512KB

19 mm

19 mm

M2S060T-FCS325I
M2S060T-FCS325I
Microchip 数据表

2983 In Stock

-

最小起订量: 1

最小包装量: 1

325-TFBGA, FCBGA

325-FCBGA (11x11)

Polystyrene

微芯片技术

166 MHz

56520 LE

-

64 kB

US

EAR99

200

Tray

M2S060

活跃

-

-40°C ~ 100°C (TJ)

SmartFusion®2

Facility Identification

166MHz

64KB

ARM® Cortex®-M3

不发光

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

English

M2S010-1FGG484
M2S010-1FGG484
Microchip 数据表

22 In Stock

-

最小起订量: 1

最小包装量: 1

484-BGA

YES

484-FPBGA (23x23)

484

64 kB

FBGA-484

网格排列

3

微芯片技术

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

1.14 V

85 °C

M2S010-1FGG484

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.77

233

Tray

M2S010

活跃

-

166 MHz

12084 LE

SMD/SMT

-

0°C ~ 85°C (TJ)

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

233

2.44 mm

现场可编程门阵列

FPGA - 10K Logic Modules

12084

1 Core

256KB

23 mm

23 mm

MPFS250T-1FCG1152EES
MPFS250T-1FCG1152EES
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

1152-FCBGA (35x35)

微芯片技术

MCU - 136, FPGA - 372

Tray

活跃

0°C ~ 100°C

PolarFire™

-

2.2MB

RISC-V

DMA, PCI, PWM

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

128kB

MPFS160TLS-FCVG784I
MPFS160TLS-FCVG784I
Microchip Technology 数据表

2855 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-784

784-FCBGA (23x23)

RV64GC, RV64IMAC

微芯片技术

16 kB, 4 x 32 kB

667 MHz, 667 MHz

+ 100 C

0 C

SMD/SMT

312 I/O

161000 LE

Tray

活跃

This product may require additional documentation to export from the United States.

-

1

4 x 32 kB

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 161K Logic Modules

5 Core

128kB

MPFS160TS-1FCSG536I
MPFS160TS-1FCSG536I
Microchip Technology 数据表

2288 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-536

536-LFBGA

RV64GC, RV64IMAC

微芯片技术

16 kB, 4 x 32 kB

667 MHz, 667 MHz

+ 100 C

0 C

SMD/SMT

312 I/O

161000 LE

Tray

活跃

This product may require additional documentation to export from the United States.

-

1

4 x 32 kB

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 161K Logic Modules

5 Core

128kB

MPFS250T-1FCG1152I
MPFS250T-1FCG1152I
Microchip Technology 数据表

2142 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-1152

1152-FCBGA (35x35)

RV64GC, RV64IMAC

微芯片技术

16 kB, 4 x 32 kB

667 MHz, 667 MHz

+ 100 C

0 C

SMD/SMT

372 I/O

254000 LE

Tray

活跃

This product may require additional documentation to export from the United States.

-

1

4 x 32 kB

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

MPFS095TS-1FCVG484I
MPFS095TS-1FCVG484I
Microchip Technology 数据表

2524 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-484

484-FCBGA (19x19)

RV64GC, RV64IMAC

微芯片技术

16 kB, 4 x 32 kB

667 MHz, 667 MHz

+ 100 C

- 40 C

SMD/SMT

276 I/O

93000 LE

Tray

活跃

This product may require additional documentation to export from the United States.

-

1

4 x 32 kB

-40°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

MPFS160T-FCSG536E
MPFS160T-FCSG536E
Microchip Technology 数据表

2791 In Stock

-

最小起订量: 1

最小包装量: 1

FCSG-536

536-LFBGA

RV64GC, RV64IMAC

微芯片技术

16 kB, 4 x 32 kB

4 x 32 kB

-

161000 LE

312 I/O

0 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

0°C ~ 100°C

Tray

PolarFire™

1 V

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 161K Logic Modules

5 Core

128kB

MPFS160TL-FCVG484E
MPFS160TL-FCVG484E
Microchip Technology 数据表

2954 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-484

484-FCBGA (19x19)

RV64GC, RV64IMAC

微芯片技术

16 kB, 4 x 32 kB

4 x 32 kB

-

161000 LE

312 I/O

0 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

0°C ~ 100°C

Tray

PolarFire™

1 V

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 161K Logic Modules

5 Core

128kB

MPFS095TS-1FCSG325I
MPFS095TS-1FCSG325I
Microchip Technology 数据表

2977 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-325

325-LFBGA (11x14.5)

RV64GC, RV64IMAC

微芯片技术

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

- 40 C

+ 100 C

1

Bulk

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

-40°C ~ 100°C

Tray

-

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128KB