N/A

-

Production (Last Updated: 2 months ago)

FCBGA-325

YES

325-FCBGA (11x11)

325

ARM Cortex M3

微芯片技术

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

85 °C

无

M2S050-1FCS325

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

有

4695 LAB

176

200

Tray

M2S050

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

FPGA - 50K Logic Modules

56340

1 Core

256KB

11 mm

11 mm

N/A

-

Production (Last Updated: 2 months ago)

256-LFBGA

YES

256-FPBGA (14x14)

256

ARM Cortex M3

微芯片技术

Tray

M2S025

活跃

VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

40

1.14 V

85 °C

有

M2S025T-VFG256

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.77

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

138 I/O

0 C

+ 85 C

有

2308 LAB

119

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B256

138

不合格

1.2 V

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

FPGA - 25K Logic Modules

27696

1 Core

256KB

14 mm

14 mm

N/A

-

FPBGA-484

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

267

Tray

M2S025

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

有

2308 LAB

60

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 25K Logic Modules

1 Core

256KB

N/A

-

Production (Last Updated: 2 months ago)

FCBGA-325

325-FCBGA (11x11)

ARM Cortex M3

微芯片技术

M2S025

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

有

2308 LAB

176

180

Tray

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

N/A

-

Production (Last Updated: 2 months ago)

VFPBGA-256

256-FPBGA (14x14)

ARM Cortex M3

微芯片技术

M2S025

活跃

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

有

2308 LAB

119

138

Tray

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

N/A

-

FPBGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

微芯片技术

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

1.14 V

85 °C

无

M2S005S-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.87

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

6060 LE

有

505 LAB

60

209

Tray

M2S005

活跃

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

209

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

209

2.44 mm

现场可编程门阵列

FPGA - 5K Logic Modules

6060

1 Core

128KB

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

484-BGA

YES

484-FPBGA (23x23)

484

ARM Cortex M3

微芯片技术

M2S060

Tray

267

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

1.14 V

有

M2S060TS-1FGG484I

BGA

SQUARE

活跃

IC FPGA SOC 60K LUTS

MICROSEMI CORP

1.26 V

5.81

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

60

SmartFusion2

0.418384 oz

1.2000 V

活跃

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

1

FPGA - 60K Logic Modules

56520

1 Core

256KB

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

400-LFBGA

YES

400-VFBGA (17x17)

400

ARM Cortex M3

微芯片技术

1.2 V

30

GRID ARRAY, LOW PROFILE, FINE PITCH

VFBGA-400

5.88

1.26 V

MICROSEMI CORP

活跃

SQUARE

LFBGA

M2S060T-1VF400

无

85 °C

1.14 V

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

90

SmartFusion2

207

Tray

M2S060

活跃

PLASTIC/EPOXY

BGA400,20X20,32

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

207

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

207

1.51 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

17 mm

17 mm

N/A

-

484-BGA

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

活跃

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

86316 LE

有

7193 LAB

60

267

Tray

M2S090

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 90K Logic Modules

1 Core

512KB

N/A

-

484-BFBGA

484-FBGA (19x19)

ARM Cortex M3

微芯片技术

活跃

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

146124 LE

有

12177 LAB

84

273

Tray

M2S150

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 150K Logic Modules

1 Core

512KB

N/A

-

FPBGA-484

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

-

64 kB

56340 LE

有

4695 LAB

60

1.2000 V

1.14 V

1.26 V

267

Tray

M2S050

活跃

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-40 to 100 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 50K Logic Modules

1 Core

256KB

N/A

-

FPBGA-484

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

267

Tray

M2S090

活跃

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

有

7193 LAB

60

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 90K Logic Modules

1 Core

512KB

N/A

-

FPBGA-484

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

64 kB

86316 LE

273 I/O

- 40 C

+ 100 C

有

7193 LAB

60

0.766018 oz

1.2000 V

Tray

M2S090

活跃

Details

SMD/SMT

166 MHz

-

-

-40 to 100 °C

Tray

SmartFusion2

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 90K Logic Modules

1 Core

512KB

N/A

-

Production (Last Updated: 2 months ago)

676-BGA

YES

676-FBGA (27x27)

676

ARM Cortex M3

微芯片技术

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

30

1.14 V

85 °C

无

M2S060-1FG676

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.88

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

40

SmartFusion2

活跃

M2S060

Tray

387

FBGA-676

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B676

387

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

387

2.44 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

27 mm

27 mm

N/A

-

BGA-484

484-FCBGA (19x19)

RV64GC, RV64IMAC

微芯片技术

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

0 C

+ 100 C

1

Tray

活跃

-40°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

N/A

-

BGA-536

536-LFBGA

RV64GC, RV64IMAC

微芯片技术

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

0 C

+ 100 C

1

Tray

活跃

0°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

N/A

-

BGA-784

784-FCBGA (23x23)

RV64GC, RV64IMAC

微芯片技术

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

254000 LE

372 I/O

- 40 C

+ 100 C

1

Tray

活跃

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

N/A

-

BGA-784

784-FCBGA (23x23)

RV64GC, RV64IMAC

微芯片技术

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

254000 LE

372 I/O

- 40 C

+ 100 C

1

Tray

活跃

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

N/A

-

BGA-325

325-LFBGA (11x14.5)

RV64GC, RV64IMAC

微芯片技术

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

- 40 C

+ 100 C

1

Bulk

活跃

-40°C ~ 100°C

Tray

-

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128KB

N/A

-

表面贴装

BGA-82

8051

微芯片技术

I2C, UART, USB

SMD/SMT

19 I/O

3000

VFBGA

2 Mbps

Class I/Class II

表面贴装

4.2 V

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

IS2083

活跃

Industrial grade

3.2 V

- 40 C

+ 85 C

96 kB

SRAM

-40 to 85 °C

Reel

-

Bluetooth

3.2V ~ 4.2V

2.4GHz

82

3.3 V

2

16MB Flash, 512kB RAM, 832kB ROM

Flash

2 MB

9.5 dBm

3Mbps

8 bit

IS2083BM

Bluetooth v5.0

Industrial

-

Bluetooth

不包括天线

- 90 dBm

2 Channel

GPIO, I²C, I²S, PWM, UART, USB

-

-

8DPSK, DQPSK, GFSK

10 bit, 16 bit

0.9 mm

5.5 mm

5.5 mm

N/A

-

TQFP-100

微芯片技术

120 MHz

PIC32CX

81 I/O

3.63 V

1.71 V

Details

- 40 C

+ 85 C

CAN, Ethernet, USB

SMD/SMT

90

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

EV06X38A

Reel

-

1.71 V to 3.63 V

Flash

1 MB

- 40 C to + 85 C

32 Channel

N/A

-

TQFP-100

微芯片技术

120 MHz

PIC32CX

81 I/O

3.63 V

1.71 V

Details

- 40 C

+ 125 C

CAN, Ethernet, USB

SMD/SMT

90

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

EV06X38A

Reel

-

1.71 V to 3.63 V

Flash

1 MB

- 40 C to + 125 C

32 Channel

N/A

-

TQFP-100

微芯片技术

120 MHz

PIC32CX

81 I/O

3.63 V

1.71 V

Details

- 40 C

+ 125 C

CAN, Ethernet, USB

SMD/SMT

1000

Tray

活跃

EV06X38A

Tray

-

1.71 V to 3.63 V

Flash

1 MB

- 40 C to + 125 C

32 Channel

N/A

-

TQFP-128

微芯片技术

120 MHz

PIC32CX

99 I/O

3.63 V

1.71 V

Details

- 40 C

+ 125 C

CAN, Ethernet, USB

SMD/SMT

1000

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

EV06X38A

Reel

-

1.71 V to 3.63 V

Flash

1 MB

- 40 C to + 125 C

32 Channel

N/A

-

TQFP-128

微芯片技术

120 MHz

PIC32CX

99 I/O

3.63 V

1.71 V

Details

- 40 C

+ 85 C

CAN, Ethernet, USB

SMD/SMT

1000

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

EV06X38A

Reel

-

1.71 V to 3.63 V

Flash

1 MB

- 40 C to + 85 C

32 Channel