品牌是'Microchip' (873)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | Core | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 建筑学 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 速度等级 | 主要属性 | 逻辑单元数 | 核数量 | 闪光大小 | 长度 | 宽度 | ||||||||||||||||||||||||||||||||||||||||
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![]() | M2S010-1VF400 | Microchip Technology | 数据表 | 26 In Stock |
- | 最小起订量: 1 最小包装量: 1 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | ARM Cortex M3 | - | - | 64 kB | 12084 LE | 有 | 1007 LAB | 90 | 微芯片技术 | 1.2000 V | 1.14 V | 1.26 V | 195 | Tray | M2S010 | 活跃 | LFBGA, BGA400,20X20,32 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S010-1VF400 | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.84 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | 0 to 85 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 160 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 160 | 1.51 mm | 现场可编程门阵列 | 1 | FPGA - 10K Logic Modules | 9744 | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||
![]() | M2S050TS-1VF400 | Microchip Technology | 数据表 | 2384 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | VFPBGA-400 | 400-VFBGA (17x17) | ARM Cortex M3 | 微芯片技术 | - | - | 64 kB | 56340 LE | 有 | 4695 LAB | 90 | 207 | Tray | M2S050 | 活跃 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090T-FGG676 | Microchip Technology | 数据表 | 2045 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 676-BGA | 676-FBGA (27x27) | ARM Cortex M3 | 微芯片技术 | This product may require additional documentation to export from the United States. | Details | 166 MHz | - | - | 64 kB | 86316 LE | 有 | 7193 LAB | 40 | 1.2000 V | 1.14 V | 1.26 V | 425 | Tray | M2S090 | 活跃 | 0 to 85 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 90K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090T-1FGG484 | Microchip Technology | 数据表 | 2937 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 86316 LE | 有 | 7193 LAB | 60 | 1.2000 V | 267 | Tray | M2S090 | 活跃 | 0 to 85 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 90K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090T-1FCSG325 | Microchip Technology | 数据表 | 2234 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FCBGA-325 | 325-FCBGA (11x13.5) | ARM Cortex M3 | 微芯片技术 | SMD/SMT | 166 MHz | - | - | 64 kB | 86316 LE | 有 | 7193 LAB | 176 | 180 | Tray | M2S090 | 活跃 | This product may require additional documentation to export from the United States. | Details | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 90K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050-1FCSG325 | Microchip Technology | 数据表 | 2828 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | FCBGA-325 | YES | 325 | 325-FCBGA (11x11) | 325 | ARM Cortex M3 | 64 kB | 56340 LE | 有 | 4695 LAB | 176 | 微芯片技术 | 1.2000 V | 1.14 V | 1.26 V | 200 | Tray | M2S050 | 活跃 | FBGA-325 | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 1.14 V | 85 °C | 有 | M2S050-1FCSG325 | TFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.76 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 0 to 85 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | 0 °C | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | 40 | S-PBGA-B325 | 200 | 不合格 | 1.2 V | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | 现场可编程门阵列 | 1 | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 11 mm | 11 mm | ||||||||||
![]() | M2S025T-1VF256 | Microchip Technology | 数据表 | 2206 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | VFPBGA-256 | 256-FPBGA (14x14) | ARM Cortex M3 | 微芯片技术 | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 119 | 138 | Tray | M2S025 | 活跃 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050TS-1FG484 | Microchip Technology | 数据表 | 2968 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 56340 LE | 有 | 4695 LAB | 60 | 微芯片技术 | 267 | Tray | M2S050 | 活跃 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 30 | 1.14 V | 5.87 | 1.26 V | MICROSEMI CORP | 活跃 | SQUARE | BGA | M2S050TS-1FG484 | 无 | 85 °C | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | 现场可编程门阵列 | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||
![]() | M2S050T-VF400I | Microchip Technology | 数据表 | 2539 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | ARM Cortex M3 | 4695 LAB | 90 | 微芯片技术 | 207 | Tray | M2S050 | 活跃 | LFBGA, BGA400,20X20,32 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 30 | 1.14 V | 无 | M2S050T-VF400I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.81 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 56340 LE | 有 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 207 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | 现场可编程门阵列 | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 17 mm | 17 mm | ||||||||||||||||||||||
![]() | M2S010TS-1VF256 | Microchip Technology | 数据表 | 26 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | VFPBGA-256 | YES | 256-FPBGA (14x14) | 256 | ARM Cortex M3 | 有 | 1007 LAB | 119 | 微芯片技术 | 138 | Tray | M2S010 | 活跃 | VFBGA-256 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA256,16X16,32 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S010TS-1VF256 | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.87 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 12084 LE | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B256 | 138 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 14 mm | 14 mm | |||||||||||||||||||
![]() | M2S050T-FGG484 | Microchip Technology | 数据表 | 2233 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | - | 64 kB | 56340 LE | 有 | 4695 LAB | 60 | 微芯片技术 | 1.2000 V | 267 | Tray | M2S050 | 活跃 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M2S050T-FGG484 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.76 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | 0 to 85 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | 现场可编程门阵列 | STD | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||||||
![]() | M2S025TS-FGG484 | Microchip Technology | 数据表 | 2824 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | 60 | 2308 LAB | 有 | 27696 LE | 64 kB | - | - | 166 MHz | Details | This product may require additional documentation to export from the United States. | 1.2000 V | 1.14 V | 1.26 V | 267 | Tray | M2S025 | 活跃 | 0 to 85 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150TS-FC1152I | Microchip Technology | 数据表 | 2726 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FCBGA-1152 | YES | 1152-FCBGA (35x35) | 1152 | ARM Cortex M3 | 有 | 12177 LAB | 24 | 微芯片技术 | 574 | Tray | M2S150 | 活跃 | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 1.2 V | 30 | 1.14 V | 无 | M2S150TS-FC1152I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.83 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 146124 LE | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | 现场可编程门阵列 | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | 35 mm | 35 mm | |||||||||||||||||||||||
![]() | M2S060T-1FG484M | Microchip Technology | 数据表 | 2087 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | - | 64 kB | 56520 LE | 267 I/O | - 55 C | + 125 C | 1314 kbit | 微芯片技术 | 4710 LAB | 60 | SmartFusion2 | Tray | M2S060 | 活跃 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | -55 °C | 1.2 V | 30 | 1.14 V | 125 °C | 无 | M2S060T-1FG484M | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.84 | This product may require additional documentation to export from the United States. | SMD/SMT | 166 MHz | - | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | e0 | 有 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 2.44 mm | 现场可编程门阵列 | FPGA - 60K Logic Modules | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||
![]() | M2S060T-1FGG676 | Microchip Technology | 数据表 | 2777 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-676 | 676-FBGA (27x27) | ARM Cortex M3 | 微芯片技术 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 56520 LE | 387 I/O | 0 C | + 85 C | 1314 kbit | 4710 LAB | 40 | SmartFusion2 | Tray | M2S060 | 活跃 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010S-1TQG144 | Microchip Technology | 数据表 | 9 In Stock |
- | 最小起订量: 1 最小包装量: 1 | TQFP-144 | 144-TQFP (20x20) | ARM Cortex M3 | 微芯片技术 | This product may require additional documentation to export from the United States. | SMD/SMT | 166 MHz | - | - | 64 kB | 12084 LE | 84 I/O | 0 C | + 85 C | 400 kbit | 1007 LAB | 60 | Tray | M2S010 | 活跃 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025T-FCSG158I | Microchip Technology | 数据表 | 285 In Stock |
- | 最小起订量: 1 最小包装量: 1 | TFBGA-158 | 158-FCBGA | ARM Cortex M3 | 微芯片技术 | 27696 LE | - 40 C | + 100 C | 260 | - | Tray | 活跃 | Details | SMD/SMT | 166 MHz | - | - | 64 kB | -40°C ~ 100°C (TJ) | Tray | - | 1.14 V to 1.26 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025T-1FCSG158I | Microchip Technology | 数据表 | 26 In Stock |
- | 最小起订量: 1 最小包装量: 1 | TFBGA-158 | 158-FCBGA | ARM Cortex M3 | 微芯片技术 | Details | - 40 C | + 125 C | 260 | - | Tray | 活跃 | 27696 LE | 64 kB | - | - | 166 MHz | SMD/SMT | -40°C ~ 100°C (TJ) | Tray | - | 1.14 V to 1.26 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS160T-FCSG536E | Microchip Technology | 数据表 | 2791 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FCSG-536 | 536-LFBGA | RV64GC, RV64IMAC | 微芯片技术 | 161000 LE | 312 I/O | 0 C | + 100 C | 1 | Tray | 活跃 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 0°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS160TL-FCVG484E | Microchip Technology | 数据表 | 2954 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-484 | 484-FCBGA (19x19) | RV64GC, RV64IMAC | 微芯片技术 | 161000 LE | 312 I/O | 0 C | + 100 C | 1 | Tray | 活跃 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 0°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS095TS-1FCSG325I | Microchip Technology | 数据表 | 2977 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-325 | 325-LFBGA (11x14.5) | RV64GC, RV64IMAC | 微芯片技术 | 93000 LE | 276 I/O | - 40 C | + 100 C | 1 | Bulk | 活跃 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | -40°C ~ 100°C | Tray | - | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS160T-1FCVG484E | Microchip Technology | 数据表 | 2176 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FCVG-484 | 484-FCBGA (19x19) | RV64GC, RV64IMAC | 微芯片技术 | 161000 LE | 312 I/O | 0 C | + 100 C | 1 | Tray | 活跃 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 0°C ~ 100°C | Tray | PolarFire® | 1 V | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS160T-FCVG484E | Microchip Technology | 数据表 | 2958 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FCVG-484 | 484-FCBGA (19x19) | RV64GC, RV64IMAC | 微芯片技术 | 161000 LE | 312 I/O | 0 C | + 100 C | 1 | Tray | 活跃 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 0°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS095TLS-FCSG325I | Microchip Technology | 数据表 | 2521 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-325 | 325-LFBGA (11x14.5) | RV64GC, RV64IMAC | 微芯片技术 | 93000 LE | 276 I/O | - 40 C | + 100 C | 1 | Bulk | 活跃 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | -40°C ~ 100°C | Tray | - | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS250T-FCVG484I | Microchip Technology | 数据表 | 2348 In Stock | - | 最小起订量: 1 最小包装量: 1 | FCVG-484 | 484-FCBGA (19x19) | RV64GC, RV64IMAC | 微芯片技术 | 254000 LE | 372 I/O | 0 C | + 100 C | 1 | Tray | 活跃 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB |
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