品牌是'Microchip' (873)

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生命周期状态

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表面安装

引脚数

供应商器件包装

终端数量

Core

厂商

操作温度

包装

系列

JESD-609代码

无铅代码

ECCN 代码

端子表面处理

最高工作温度

最小工作温度

附加功能

HTS代码

技术

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

时间@峰值回流温度-最大值(s)

JESD-30代码

输出的数量

资历状况

工作电源电压

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核心处理器

周边设备

程序内存大小

连接方式

建筑学

输入数量

座位高度-最大

可编程逻辑类型

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主要属性

逻辑单元数

核数量

闪光大小

长度

宽度

M2S010-1VF400
M2S010-1VF400
Microchip Technology 数据表

26 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-400

YES

400-VFBGA (17x17)

400

ARM Cortex M3

-

-

64 kB

12084 LE

1007 LAB

90

微芯片技术

1.2000 V

1.14 V

1.26 V

195

Tray

M2S010

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

85 °C

M2S010-1VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.84

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

160

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

160

1.51 mm

现场可编程门阵列

1

FPGA - 10K Logic Modules

9744

1 Core

256KB

17 mm

17 mm

M2S050TS-1VF400
M2S050TS-1VF400
Microchip Technology 数据表

2384 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

VFPBGA-400

400-VFBGA (17x17)

ARM Cortex M3

微芯片技术

-

-

64 kB

56340 LE

4695 LAB

90

207

Tray

M2S050

活跃

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 50K Logic Modules

1 Core

256KB

M2S090T-FGG676
M2S090T-FGG676
Microchip Technology 数据表

2045 In Stock

-

最小起订量: 1

最小包装量: 1

676-BGA

676-FBGA (27x27)

ARM Cortex M3

微芯片技术

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

86316 LE

7193 LAB

40

1.2000 V

1.14 V

1.26 V

425

Tray

M2S090

活跃

0 to 85 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 90K Logic Modules

1 Core

512KB

M2S090T-1FGG484
M2S090T-1FGG484
Microchip Technology 数据表

2937 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

7193 LAB

60

1.2000 V

267

Tray

M2S090

活跃

0 to 85 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 90K Logic Modules

1 Core

512KB

M2S090T-1FCSG325
M2S090T-1FCSG325
Microchip Technology 数据表

2234 In Stock

-

最小起订量: 1

最小包装量: 1

FCBGA-325

325-FCBGA (11x13.5)

ARM Cortex M3

微芯片技术

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

7193 LAB

176

180

Tray

M2S090

活跃

This product may require additional documentation to export from the United States.

Details

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 90K Logic Modules

1 Core

512KB

M2S050-1FCSG325
M2S050-1FCSG325
Microchip Technology 数据表

2828 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

FCBGA-325

YES

325

325-FCBGA (11x11)

325

ARM Cortex M3

64 kB

56340 LE

4695 LAB

176

微芯片技术

1.2000 V

1.14 V

1.26 V

200

Tray

M2S050

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

1.14 V

85 °C

M2S050-1FCSG325

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.76

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

0 to 85 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

0 °C

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

40

S-PBGA-B325

200

不合格

1.2 V

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

1

FPGA - 50K Logic Modules

56340

1 Core

256KB

11 mm

11 mm

M2S025T-1VF256
M2S025T-1VF256
Microchip Technology 数据表

2206 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

VFPBGA-256

256-FPBGA (14x14)

ARM Cortex M3

微芯片技术

-

-

64 kB

27696 LE

2308 LAB

119

138

Tray

M2S025

活跃

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S050TS-1FG484
M2S050TS-1FG484
Microchip Technology 数据表

2968 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

FPBGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

56340 LE

4695 LAB

60

微芯片技术

267

Tray

M2S050

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

1.14 V

5.87

1.26 V

MICROSEMI CORP

活跃

SQUARE

BGA

M2S050TS-1FG484

85 °C

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

FPGA - 50K Logic Modules

56340

1 Core

256KB

23 mm

23 mm

M2S050T-VF400I
M2S050T-VF400I
Microchip Technology 数据表

2539 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

VFPBGA-400

YES

400-VFBGA (17x17)

400

ARM Cortex M3

4695 LAB

90

微芯片技术

207

Tray

M2S050

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

M2S050T-VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

207

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

207

1.51 mm

现场可编程门阵列

FPGA - 50K Logic Modules

56340

1 Core

256KB

17 mm

17 mm

M2S010TS-1VF256
M2S010TS-1VF256
Microchip Technology 数据表

26 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 1 month ago)

VFPBGA-256

YES

256-FPBGA (14x14)

256

ARM Cortex M3

1007 LAB

119

微芯片技术

138

Tray

M2S010

活跃

VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

30

1.14 V

85 °C

M2S010TS-1VF256

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.87

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B256

138

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

FPGA - 10K Logic Modules

12084

1 Core

256KB

14 mm

14 mm

M2S050T-FGG484
M2S050T-FGG484
Microchip Technology 数据表

2233 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

-

64 kB

56340 LE

4695 LAB

60

微芯片技术

1.2000 V

267

Tray

M2S050

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

1.14 V

85 °C

M2S050T-FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.76

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

0 to 85 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

STD

FPGA - 50K Logic Modules

56340

1 Core

256KB

23 mm

23 mm

M2S025TS-FGG484
M2S025TS-FGG484
Microchip Technology 数据表

2824 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

484-BGA

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

60

2308 LAB

27696 LE

64 kB

-

-

166 MHz

Details

This product may require additional documentation to export from the United States.

1.2000 V

1.14 V

1.26 V

267

Tray

M2S025

活跃

0 to 85 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 25K Logic Modules

1 Core

256KB

M2S150TS-FC1152I
M2S150TS-FC1152I
Microchip Technology 数据表

2726 In Stock

-

最小起订量: 1

最小包装量: 1

FCBGA-1152

YES

1152-FCBGA (35x35)

1152

ARM Cortex M3

12177 LAB

24

微芯片技术

574

Tray

M2S150

活跃

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

30

1.14 V

M2S150TS-FC1152I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.83

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

146124 LE

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B1152

574

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

574

2.9 mm

现场可编程门阵列

FPGA - 150K Logic Modules

146124

1 Core

512KB

35 mm

35 mm

M2S060T-1FG484M
M2S060T-1FG484M
Microchip Technology 数据表

2087 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

-

64 kB

56520 LE

267 I/O

- 55 C

+ 125 C

1314 kbit

微芯片技术

4710 LAB

60

SmartFusion2

Tray

M2S060

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

-55 °C

1.2 V

30

1.14 V

125 °C

M2S060T-1FG484M

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.84

This product may require additional documentation to export from the United States.

SMD/SMT

166 MHz

-

-55°C ~ 125°C (TJ)

Tray

SmartFusion2

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

8542.39.00.01

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

1.2 V

MILITARY

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

2.44 mm

现场可编程门阵列

FPGA - 60K Logic Modules

1 Core

256KB

23 mm

23 mm

M2S060T-1FGG676
M2S060T-1FGG676
Microchip Technology 数据表

2777 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-676

676-FBGA (27x27)

ARM Cortex M3

微芯片技术

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

56520 LE

387 I/O

0 C

+ 85 C

1314 kbit

4710 LAB

40

SmartFusion2

Tray

M2S060

活跃

0°C ~ 85°C (TJ)

Tray

SmartFusion2

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

M2S010S-1TQG144
M2S010S-1TQG144
Microchip Technology 数据表

9 In Stock

-

最小起订量: 1

最小包装量: 1

TQFP-144

144-TQFP (20x20)

ARM Cortex M3

微芯片技术

This product may require additional documentation to export from the United States.

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

84 I/O

0 C

+ 85 C

400 kbit

1007 LAB

60

Tray

M2S010

活跃

0°C ~ 85°C (TJ)

Tray

SmartFusion2

1.2 V

166MHz

64KB

ARM® Cortex®-M3

-

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 10K Logic Modules

1 Core

256KB

M2S025T-FCSG158I
M2S025T-FCSG158I
Microchip Technology 数据表

285 In Stock

-

最小起订量: 1

最小包装量: 1

TFBGA-158

158-FCBGA

ARM Cortex M3

微芯片技术

27696 LE

- 40 C

+ 100 C

260

-

Tray

活跃

Details

SMD/SMT

166 MHz

-

-

64 kB

-40°C ~ 100°C (TJ)

Tray

-

1.14 V to 1.26 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S025T-1FCSG158I
M2S025T-1FCSG158I
Microchip Technology 数据表

26 In Stock

-

最小起订量: 1

最小包装量: 1

TFBGA-158

158-FCBGA

ARM Cortex M3

微芯片技术

Details

- 40 C

+ 125 C

260

-

Tray

活跃

27696 LE

64 kB

-

-

166 MHz

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

-

1.14 V to 1.26 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

MPFS160T-FCSG536E
MPFS160T-FCSG536E
Microchip Technology 数据表

2791 In Stock

-

最小起订量: 1

最小包装量: 1

FCSG-536

536-LFBGA

RV64GC, RV64IMAC

微芯片技术

161000 LE

312 I/O

0 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

0°C ~ 100°C

Tray

PolarFire™

1 V

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 161K Logic Modules

5 Core

128kB

MPFS160TL-FCVG484E
MPFS160TL-FCVG484E
Microchip Technology 数据表

2954 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-484

484-FCBGA (19x19)

RV64GC, RV64IMAC

微芯片技术

161000 LE

312 I/O

0 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

0°C ~ 100°C

Tray

PolarFire™

1 V

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 161K Logic Modules

5 Core

128kB

MPFS095TS-1FCSG325I
MPFS095TS-1FCSG325I
Microchip Technology 数据表

2977 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-325

325-LFBGA (11x14.5)

RV64GC, RV64IMAC

微芯片技术

93000 LE

276 I/O

- 40 C

+ 100 C

1

Bulk

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

-40°C ~ 100°C

Tray

-

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128KB

MPFS160T-1FCVG484E
MPFS160T-1FCVG484E
Microchip Technology 数据表

2176 In Stock

-

最小起订量: 1

最小包装量: 1

FCVG-484

484-FCBGA (19x19)

RV64GC, RV64IMAC

微芯片技术

161000 LE

312 I/O

0 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

0°C ~ 100°C

Tray

PolarFire®

1 V

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 161K Logic Modules

5 Core

128kB

MPFS160T-FCVG484E
MPFS160T-FCVG484E
Microchip Technology 数据表

2958 In Stock

-

最小起订量: 1

最小包装量: 1

FCVG-484

484-FCBGA (19x19)

RV64GC, RV64IMAC

微芯片技术

161000 LE

312 I/O

0 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

0°C ~ 100°C

Tray

PolarFire™

1 V

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 161K Logic Modules

5 Core

128kB

MPFS095TLS-FCSG325I
MPFS095TLS-FCSG325I
Microchip Technology 数据表

2521 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-325

325-LFBGA (11x14.5)

RV64GC, RV64IMAC

微芯片技术

93000 LE

276 I/O

- 40 C

+ 100 C

1

Bulk

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

-40°C ~ 100°C

Tray

-

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128KB

MPFS250T-FCVG484I
MPFS250T-FCVG484I
Microchip Technology 数据表

2348 In Stock

-

最小起订量: 1

最小包装量: 1

FCVG-484

484-FCBGA (19x19)

RV64GC, RV64IMAC

微芯片技术

254000 LE

372 I/O

0 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB