品牌是'Microchip' (873)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | Core | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 界面 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 建筑学 | 数据总线宽度 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 核心架构 | 总 RAM 位数 | 筛选水平 | 速度等级 | 主要属性 | 逻辑单元数 | 核数量 | 闪光大小 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | M2S025TS-1VF400 | Microchip Technology | 数据表 | 2216 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | ARM Cortex M3 | 微芯片技术 | N | SMD/SMT | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 90 | 207 | Tray | M2S025 | 活跃 | VFBGA-400 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S025TS-1VF400 | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.87 | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 207 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | 现场可编程门阵列 | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010T-1VF256 | Microchip Technology | 数据表 | 31 In Stock |
- | 最小起订量: 1 最小包装量: 1 | VFPBGA-256 | YES | 256-FPBGA (14x14) | 256 | ARM Cortex M3 | 微芯片技术 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 12084 LE | 有 | 1007 LAB | 119 | 138 | Tray | M2S010 | 活跃 | VFBGA-256 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA256,16X16,32 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S010T-1VF256 | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.81 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B256 | 138 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060TS-1FCS325I | Microchip Technology | 数据表 | 2550 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | ARM Cortex M3 | 微芯片技术 | 64 kB | 56520 LE | 有 | 4710 LAB | 176 | SmartFusion2 | 200 | Tray | M2S060 | 活跃 | FBGA-325 | GRID ARRAY, THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | 1.2 V | 30 | 1.14 V | 无 | M2S060TS-1FCS325I | TFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.88 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | 无 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | S-PBGA-B325 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1.01 mm | 现场可编程门阵列 | FPGA - 60K Logic Modules | 1 Core | 256KB | 11 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090T-FG676 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 676-BGA | YES | 676-FBGA (27x27) | 676 | ARM Cortex M3 | 微芯片技术 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 86316 LE | 有 | 7193 LAB | 40 | 425 | Tray | M2S090 | 活跃 | BGA, BGA676,26X26,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA676,26X26,40 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S090T-FG676 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.83 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B676 | 425 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 425 | 2.44 mm | 现场可编程门阵列 | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F500M3G-FG484M | Microchip Technology | 数据表 | 698 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BGA | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | 60 | SmartFusion | MCU - 41, FPGA - 128 | Tray | A2F500 | 活跃 | This product may require additional documentation to export from the United States. | N | 80 MHz | - | - | 64 kB | 6000 LE | 有 | - | -55°C ~ 125°C (TJ) | Tray | A2F500 | 125 °C | -55 °C | 80 MHz | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025-FCS325I | Microchip Technology | 数据表 | 47 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | FCBGA-325 | 325-FCBGA (11x11) | ARM Cortex M3 | 微芯片技术 | Tray | M2S025 | 活跃 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 176 | 180 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S005-VFG400I | Microchip Technology | 数据表 | 59 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | ARM Cortex M3 | 微芯片技术 | 活跃 | MICROSEMI CORP | 1.26 V | 5.78 | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 6060 LE | 169 I/O | - 40 C | + 100 C | 有 | 505 LAB | 90 | 0.346560 oz | Tray | M2S005 | 活跃 | VFBGA-400 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 40 | 1.14 V | 有 | M2S005-VFG400I | LFBGA | SQUARE | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 171 | 不合格 | 1.2 V | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 171 | 1.51 mm | 现场可编程门阵列 | STD | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S005-VF400I | Microchip Technology | 数据表 | 125 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | ARM Cortex M3 | 微芯片技术 | 有 | 6060 LE | 64 kB | - | - | 166 MHz | N | 169 | Tray | M2S005 | 活跃 | VFBGA-400 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 30 | 1.14 V | 无 | M2S005-VF400I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.84 | 0.356867 oz | 90 | 505 LAB | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 171 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 171 | 1.51 mm | 现场可编程门阵列 | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S005-1VFG256 | Microchip Technology | 数据表 | 245 In Stock | - | 最小起订量: 1 最小包装量: 1 | VFPBGA-256 | YES | 256-FPBGA (17x17) | 256 | ARM Cortex M3 | 微芯片技术 | 活跃 | MICROSEMI CORP | 1.26 V | 5.79 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 6060 LE | 有 | 505 LAB | 119 | 161 | Tray | M2S005 | 活跃 | MSL 3 - 168 hours | VFBGA-256 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA256,16X16,32 | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M2S005-1VFG256 | LFBGA | SQUARE | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B256 | 161 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 161 | 1.56 mm | 现场可编程门阵列 | 191Kbit | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F500M3G-FGG484M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-BGA | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | 60 | SmartFusion | MCU - 41, FPGA - 128 | Tray | A2F500 | 活跃 | This product may require additional documentation to export from the United States. | Details | 80 MHz | - | - | 64 kB | 6000 LE | 有 | - | -55°C ~ 125°C (TJ) | Tray | A2F500 | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150T-1FCVG484I | Microchip Technology | 数据表 | 2028 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BFBGA | 484-FBGA (19x19) | ARM Cortex M3 | 微芯片技术 | M2S150 | 活跃 | This product may require additional documentation to export from the United States. | Details | 166 MHz | - | - | 64 kB | 146124 LE | 有 | 12177 LAB | 84 | 273 | Tray | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090TS-1FCS325I | Microchip Technology | 数据表 | 2754 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FCBGA-325 | 325-FCBGA (11x13.5) | ARM Cortex M3 | 微芯片技术 | M2S090 | 活跃 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 86316 LE | 有 | 7193 LAB | 176 | SMARTFUSION2 | 100C | INDUSTRIALC | FCBGA | -40C to 100C | 180 | 86184 | 65nm | 1.26(V) | 1.2(V) | 无 | 1.14(V) | -40C | 有 | 86184 | 表面贴装 | 180 | Tray | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 325 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 90K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150TS-1FC1152 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FCBGA-1152 | 1152-FCBGA (35x35) | ARM Cortex M3 | 微芯片技术 | 12177 LAB | 24 | 574 | Tray | M2S150 | 活跃 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 146124 LE | 有 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090TS-FCS325I | Microchip Technology | 数据表 | 2708 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FCBGA-325 | 325-FCBGA (11x13.5) | ARM Cortex M3 | 微芯片技术 | 7193 LAB | 176 | 180 | Tray | M2S090 | 活跃 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 86316 LE | 有 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 90K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090T-1FGG484I | Microchip Technology | 数据表 | 2320 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 微芯片技术 | SQUARE | 活跃 | FPGA - Field Programmable Gate Array M2S090T-1FGG484I | MICROSEMI CORP | 1.26 V | 5.77 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 86316 LE | 有 | 7193 LAB | 60 | 1.2000 V | 1.14 V | 1.26 V | 267 | Tray | M2S090 | 活跃 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 1.14 V | 有 | M2S090T-1FGG484I | BGA | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 40 | S-PBGA-B484 | 267 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | 现场可编程门阵列 | 1 | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060T-1FG484 | Microchip Technology | 数据表 | 2845 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 484-BGA | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 微芯片技术 | 5.88 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 56520 LE | 有 | 4710 LAB | 60 | SmartFusion2 | 267 | Tray | M2S060 | 活跃 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S060T-1FG484 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | 现场可编程门阵列 | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010TS-1FG484 | Microchip Technology | 数据表 | 2460 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | FPBGA-484 | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | Tray | M2S010 | 活跃 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 12084 LE | 有 | 1007 LAB | 60 | 233 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050TS-1FGG896 | Microchip Technology | 数据表 | 2368 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | FPBGA-896 | 896-FBGA (31x31) | ARM Cortex M3 | 微芯片技术 | Tray | M2S050 | 活跃 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 56340 LE | 有 | 4695 LAB | 27 | 377 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060TS-1FCSG325I | Microchip Technology | 数据表 | 2986 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | 325-FCBGA (11x11) | ARM Cortex M3 | 微芯片技术 | 有 | 表面贴装 | 200 | Tray | M2S060 | 活跃 | Industrial grade | This product may require additional documentation to export from the United States. | Details | 166 MHz | - | - | 64 kB | 56520 LE | 有 | 4710 LAB | 176 | SmartFusion2 | RISC | 1.2, 1.5, 1.8, 2.5, 3.3 V | 1 | CAN/Ethernet/Serial I2C/SPI/UART/USB | -40 to 100 °C | Tray | SmartFusion2 | 325 | 1.2 V | CAN/Ethernet/Serial | 166MHz | 64 KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 32 Bit | Industrial | FPGA - 60K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060-VFG400 | Microchip Technology | 数据表 | 2680 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 400-LFBGA | 400-VFBGA (17x17) | ARM Cortex M3 | 微芯片技术 | - | - | 64 kB | 56520 LE | 有 | 4710 LAB | 90 | SmartFusion2 | 1.2000 V | 1.14 V | 1.26 V | 207 | Tray | M2S060 | 活跃 | This product may require additional documentation to export from the United States. | Details | 166 MHz | -40 to 100 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 60K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025-1FCS325I | Microchip Technology | 数据表 | 2022 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | ARM Cortex M3 | 微芯片技术 | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 176 | 180 | Tray | M2S025 | 活跃 | FBGA-325 | GRID ARRAY, THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 30 | 1.14 V | 无 | M2S025-1FCS325I | TFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.84 | This product may require additional documentation to export from the United States. | N | SMD/SMT | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | S-PBGA-B325 | 180 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.01 mm | 现场可编程门阵列 | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 11 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010-VF400 | Microchip Technology | 数据表 | 31 In Stock |
- | 最小起订量: 1 最小包装量: 1 | VFPBGA-400 | 400-VFBGA (17x17) | ARM Cortex M3 | 微芯片技术 | 90 | 1007 LAB | 有 | 12084 LE | 64 kB | - | - | 166 MHz | SMD/SMT | N | This product may require additional documentation to export from the United States. | 1.2000 V | 1.14 V | 1.26 V | 195 | Tray | M2S010 | 活跃 | 0 to 85 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 10K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090-1FCSG325I | Microchip Technology | 数据表 | 2867 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FCBGA-325 | YES | 325-FCBGA (11x13.5) | 325 | ARM Cortex M3 | 微芯片技术 | 1.2 V | BGA325,21X21,20 | PLASTIC/EPOXY | 3 | GRID ARRAY, THIN PROFILE, FINE PITCH | TFBGA, BGA325,21X21,20 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 86316 LE | 有 | 7193 LAB | 176 | 1.2000 V | 1.14 V | 1.26 V | 180 | Tray | M2S090 | 活跃 | 5.78 | 1.26 V | MICROSEMI CORP | 活跃 | RECTANGULAR | TFBGA | M2S090-1FCSG325I | 有 | 1.14 V | 40 | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | R-PBGA-B325 | 180 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.16 mm | 现场可编程门阵列 | 1 | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 13.5 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050T-FCSG325 | Microchip Technology | 数据表 | 2580 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | ARM Cortex M3 | 微芯片技术 | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.76 | This product may require additional documentation to export from the United States. | Details | 166 MHz | - | - | 64 kB | 56340 LE | 有 | 4695 LAB | 176 | 2.5, 3.3 V | 1.14 V | 1.26 V | 200 | Tray | M2S050 | 活跃 | TFBGA, BGA325,21X21,20 | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M2S050T-FCSG325 | TFBGA | 0 to 85 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 200 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | 现场可编程门阵列 | STD | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 11 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | M2S005S-1TQG144I | Microchip Technology | 数据表 | 31 In Stock |
- | 最小起订量: 1 最小包装量: 1 | TQFP-144 | 144-TQFP (20x20) | ARM Cortex M3 | 微芯片技术 | 64 kB | 6060 LE | 有 | 505 LAB | 60 | 0.046530 oz | 活跃 | M2S005 | Tray | 84 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB |
M2S025TS-1VF400
Microchip Technology
分类:Embedded - System On Chip (SoC)
1,203.149301
M2S010T-1VF256
Microchip Technology
分类:Embedded - System On Chip (SoC)
536.053335
M2S060TS-1FCS325I
Microchip Technology
分类:Embedded - System On Chip (SoC)
1,578.886327
M2S090T-FG676
Microchip Technology
分类:Embedded - System On Chip (SoC)
A2F500M3G-FG484M
Microchip Technology
分类:Embedded - System On Chip (SoC)
7,873.836337
M2S025-FCS325I
Microchip Technology
分类:Embedded - System On Chip (SoC)
680.522760
M2S005-VFG400I
Microchip Technology
分类:Embedded - System On Chip (SoC)
221.247921
M2S005-VF400I
Microchip Technology
分类:Embedded - System On Chip (SoC)
306.378592
M2S005-1VFG256
Microchip Technology
分类:Embedded - System On Chip (SoC)
A2F500M3G-FGG484M
Microchip Technology
分类:Embedded - System On Chip (SoC)
M2S150T-1FCVG484I
Microchip Technology
分类:Embedded - System On Chip (SoC)
3,731.445571
M2S090TS-1FCS325I
Microchip Technology
分类:Embedded - System On Chip (SoC)
1,739.228360
M2S150TS-1FC1152
Microchip Technology
分类:Embedded - System On Chip (SoC)
M2S090TS-FCS325I
Microchip Technology
分类:Embedded - System On Chip (SoC)
1,745.704530
M2S090T-1FGG484I
Microchip Technology
分类:Embedded - System On Chip (SoC)
2,259.338851
M2S060T-1FG484
Microchip Technology
分类:Embedded - System On Chip (SoC)
1,487.006002
M2S010TS-1FG484
Microchip Technology
分类:Embedded - System On Chip (SoC)
818.773020
M2S050TS-1FGG896
Microchip Technology
分类:Embedded - System On Chip (SoC)
1,701.549547
M2S060TS-1FCSG325I
Microchip Technology
分类:Embedded - System On Chip (SoC)
1,578.886327
M2S060-VFG400
Microchip Technology
分类:Embedded - System On Chip (SoC)
1,311.764909
M2S025-1FCS325I
Microchip Technology
分类:Embedded - System On Chip (SoC)
905.452119
M2S010-VF400
Microchip Technology
分类:Embedded - System On Chip (SoC)
303.357261
M2S090-1FCSG325I
Microchip Technology
分类:Embedded - System On Chip (SoC)
2,050.498137
M2S050T-FCSG325
Microchip Technology
分类:Embedded - System On Chip (SoC)
1,165.881710
M2S005S-1TQG144I
Microchip Technology
分类:Embedded - System On Chip (SoC)
196.051543
