品牌是'Microchip' (873)

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包装

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JESD-609代码

无铅代码

端子表面处理

最高工作温度

最小工作温度

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HTS代码

技术

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JESD-30代码

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逻辑单元数

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宽度

M2S025TS-1VF400
M2S025TS-1VF400
Microchip Technology 数据表

2216 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

VFPBGA-400

YES

400-VFBGA (17x17)

400

ARM Cortex M3

微芯片技术

N

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

2308 LAB

90

207

Tray

M2S025

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

85 °C

M2S025TS-1VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.87

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

207

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

207

1.51 mm

现场可编程门阵列

FPGA - 25K Logic Modules

27696

1 Core

256KB

17 mm

17 mm

M2S010T-1VF256
M2S010T-1VF256
Microchip Technology 数据表

31 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-256

YES

256-FPBGA (14x14)

256

ARM Cortex M3

微芯片技术

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

1007 LAB

119

138

Tray

M2S010

活跃

VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

30

1.14 V

85 °C

M2S010T-1VF256

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B256

138

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

FPGA - 10K Logic Modules

12084

1 Core

256KB

14 mm

14 mm

M2S060TS-1FCS325I
M2S060TS-1FCS325I
Microchip Technology 数据表

2550 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

ARM Cortex M3

微芯片技术

64 kB

56520 LE

4710 LAB

176

SmartFusion2

200

Tray

M2S060

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

30

1.14 V

M2S060TS-1FCS325I

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.88

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

BOTTOM

BALL

240

0.5 mm

not_compliant

S-PBGA-B325

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1.01 mm

现场可编程门阵列

FPGA - 60K Logic Modules

1 Core

256KB

11 mm

11 mm

M2S090T-FG676
M2S090T-FG676
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

676-BGA

YES

676-FBGA (27x27)

676

ARM Cortex M3

微芯片技术

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

86316 LE

7193 LAB

40

425

Tray

M2S090

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

30

1.14 V

85 °C

M2S090T-FG676

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.83

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B676

425

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

425

2.44 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

27 mm

27 mm

A2F500M3G-FG484M
A2F500M3G-FG484M
Microchip Technology 数据表

698 In Stock

-

最小起订量: 1

最小包装量: 1

484-BGA

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

60

SmartFusion

MCU - 41, FPGA - 128

Tray

A2F500

活跃

This product may require additional documentation to export from the United States.

N

80 MHz

-

-

64 kB

6000 LE

-

-55°C ~ 125°C (TJ)

Tray

A2F500

125 °C

-55 °C

80 MHz

EBI/EMI, Ethernet, I2C, SPI, UART, USART

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

ARM

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

1 Core

512KB

M2S025-FCS325I
M2S025-FCS325I
Microchip Technology 数据表

47 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

FCBGA-325

325-FCBGA (11x11)

ARM Cortex M3

微芯片技术

Tray

M2S025

活跃

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

2308 LAB

176

180

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S005-VFG400I
M2S005-VFG400I
Microchip Technology 数据表

59 In Stock

-

最小起订量: 1

最小包装量: 1

400-LFBGA

YES

400-VFBGA (17x17)

400

ARM Cortex M3

微芯片技术

活跃

MICROSEMI CORP

1.26 V

5.78

Details

SMD/SMT

166 MHz

-

-

64 kB

6060 LE

169 I/O

- 40 C

+ 100 C

505 LAB

90

0.346560 oz

Tray

M2S005

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

40

1.14 V

M2S005-VFG400I

LFBGA

SQUARE

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B400

171

不合格

1.2 V

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

171

1.51 mm

现场可编程门阵列

STD

FPGA - 5K Logic Modules

6060

1 Core

128KB

17 mm

17 mm

M2S005-VF400I
M2S005-VF400I
Microchip Technology 数据表

125 In Stock

-

最小起订量: 1

最小包装量: 1

400-LFBGA

YES

400-VFBGA (17x17)

400

ARM Cortex M3

微芯片技术

6060 LE

64 kB

-

-

166 MHz

N

169

Tray

M2S005

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

M2S005-VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.84

0.356867 oz

90

505 LAB

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

171

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

171

1.51 mm

现场可编程门阵列

FPGA - 5K Logic Modules

6060

1 Core

128KB

17 mm

17 mm

M2S005-1VFG256
M2S005-1VFG256
Microchip Technology 数据表

245 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-256

YES

256-FPBGA (17x17)

256

ARM Cortex M3

微芯片技术

活跃

MICROSEMI CORP

1.26 V

5.79

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

6060 LE

505 LAB

119

161

Tray

M2S005

活跃

MSL 3 - 168 hours

VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

40

1.14 V

85 °C

M2S005-1VFG256

LFBGA

SQUARE

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B256

161

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

161

1.56 mm

现场可编程门阵列

191Kbit

FPGA - 5K Logic Modules

6060

1 Core

128KB

14 mm

14 mm

A2F500M3G-FGG484M
A2F500M3G-FGG484M
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

484-BGA

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

60

SmartFusion

MCU - 41, FPGA - 128

Tray

A2F500

活跃

This product may require additional documentation to export from the United States.

Details

80 MHz

-

-

64 kB

6000 LE

-

-55°C ~ 125°C (TJ)

Tray

A2F500

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

1 Core

512KB

M2S150T-1FCVG484I
M2S150T-1FCVG484I
Microchip Technology 数据表

2028 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA

484-FBGA (19x19)

ARM Cortex M3

微芯片技术

M2S150

活跃

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

146124 LE

12177 LAB

84

273

Tray

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 150K Logic Modules

1 Core

512KB

M2S090TS-1FCS325I
M2S090TS-1FCS325I
Microchip Technology 数据表

2754 In Stock

-

最小起订量: 1

最小包装量: 1

FCBGA-325

325-FCBGA (11x13.5)

ARM Cortex M3

微芯片技术

M2S090

活跃

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

7193 LAB

176

SMARTFUSION2

100C

INDUSTRIALC

FCBGA

-40C to 100C

180

86184

65nm

1.26(V)

1.2(V)

1.14(V)

-40C

86184

表面贴装

180

Tray

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

325

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 90K Logic Modules

1 Core

512KB

M2S150TS-1FC1152
M2S150TS-1FC1152
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FCBGA-1152

1152-FCBGA (35x35)

ARM Cortex M3

微芯片技术

12177 LAB

24

574

Tray

M2S150

活跃

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

146124 LE

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 150K Logic Modules

1 Core

512KB

M2S090TS-FCS325I
M2S090TS-FCS325I
Microchip Technology 数据表

2708 In Stock

-

最小起订量: 1

最小包装量: 1

FCBGA-325

325-FCBGA (11x13.5)

ARM Cortex M3

微芯片技术

7193 LAB

176

180

Tray

M2S090

活跃

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 90K Logic Modules

1 Core

512KB

M2S090T-1FGG484I
M2S090T-1FGG484I
Microchip Technology 数据表

2320 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

微芯片技术

SQUARE

活跃

FPGA - Field Programmable Gate Array M2S090T-1FGG484I

MICROSEMI CORP

1.26 V

5.77

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

7193 LAB

60

1.2000 V

1.14 V

1.26 V

267

Tray

M2S090

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

1.14 V

M2S090T-1FGG484I

BGA

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

40

S-PBGA-B484

267

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

1

FPGA - 90K Logic Modules

86316

1 Core

512KB

23 mm

23 mm

M2S060T-1FG484
M2S060T-1FG484
Microchip Technology 数据表

2845 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

484-BGA

YES

484-FPBGA (23x23)

484

ARM Cortex M3

微芯片技术

5.88

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

56520 LE

4710 LAB

60

SmartFusion2

267

Tray

M2S060

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

1.14 V

85 °C

M2S060T-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

23 mm

23 mm

M2S010TS-1FG484
M2S010TS-1FG484
Microchip Technology 数据表

2460 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 1 month ago)

FPBGA-484

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

Tray

M2S010

活跃

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

1007 LAB

60

233

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 10K Logic Modules

1 Core

256KB

M2S050TS-1FGG896
M2S050TS-1FGG896
Microchip Technology 数据表

2368 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

FPBGA-896

896-FBGA (31x31)

ARM Cortex M3

微芯片技术

Tray

M2S050

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

4695 LAB

27

377

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 50K Logic Modules

1 Core

256KB

M2S060TS-1FCSG325I
M2S060TS-1FCSG325I
Microchip Technology 数据表

2986 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

325-TFBGA, FCBGA

325-FCBGA (11x11)

ARM Cortex M3

微芯片技术

表面贴装

200

Tray

M2S060

活跃

Industrial grade

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

56520 LE

4710 LAB

176

SmartFusion2

RISC

1.2, 1.5, 1.8, 2.5, 3.3 V

1

CAN/Ethernet/Serial I2C/SPI/UART/USB

-40 to 100 °C

Tray

SmartFusion2

325

1.2 V

CAN/Ethernet/Serial

166MHz

64 KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

32 Bit

Industrial

FPGA - 60K Logic Modules

1 Core

256KB

M2S060-VFG400
M2S060-VFG400
Microchip Technology 数据表

2680 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

400-LFBGA

400-VFBGA (17x17)

ARM Cortex M3

微芯片技术

-

-

64 kB

56520 LE

4710 LAB

90

SmartFusion2

1.2000 V

1.14 V

1.26 V

207

Tray

M2S060

活跃

This product may require additional documentation to export from the United States.

Details

166 MHz

-40 to 100 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 60K Logic Modules

1 Core

256KB

M2S025-1FCS325I
M2S025-1FCS325I
Microchip Technology 数据表

2022 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

FCBGA-325

YES

325-FCBGA (11x11)

325

ARM Cortex M3

微芯片技术

166 MHz

-

-

64 kB

27696 LE

2308 LAB

176

180

Tray

M2S025

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

M2S025-1FCS325I

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.84

This product may require additional documentation to export from the United States.

N

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

S-PBGA-B325

180

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.01 mm

现场可编程门阵列

FPGA - 25K Logic Modules

27696

1 Core

256KB

11 mm

11 mm

M2S010-VF400
M2S010-VF400
Microchip Technology 数据表

31 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-400

400-VFBGA (17x17)

ARM Cortex M3

微芯片技术

90

1007 LAB

12084 LE

64 kB

-

-

166 MHz

SMD/SMT

N

This product may require additional documentation to export from the United States.

1.2000 V

1.14 V

1.26 V

195

Tray

M2S010

活跃

0 to 85 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 10K Logic Modules

1 Core

256KB

M2S090-1FCSG325I
M2S090-1FCSG325I
Microchip Technology 数据表

2867 In Stock

-

最小起订量: 1

最小包装量: 1

FCBGA-325

YES

325-FCBGA (11x13.5)

325

ARM Cortex M3

微芯片技术

1.2 V

BGA325,21X21,20

PLASTIC/EPOXY

3

GRID ARRAY, THIN PROFILE, FINE PITCH

TFBGA, BGA325,21X21,20

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

7193 LAB

176

1.2000 V

1.14 V

1.26 V

180

Tray

M2S090

活跃

5.78

1.26 V

MICROSEMI CORP

活跃

RECTANGULAR

TFBGA

M2S090-1FCSG325I

1.14 V

40

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

R-PBGA-B325

180

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.16 mm

现场可编程门阵列

1

FPGA - 90K Logic Modules

86316

1 Core

512KB

13.5 mm

11 mm

M2S050T-FCSG325
M2S050T-FCSG325
Microchip Technology 数据表

2580 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

ARM Cortex M3

微芯片技术

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.76

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

56340 LE

4695 LAB

176

2.5, 3.3 V

1.14 V

1.26 V

200

Tray

M2S050

活跃

TFBGA, BGA325,21X21,20

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

40

1.14 V

85 °C

M2S050T-FCSG325

TFBGA

0 to 85 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

STD

FPGA - 50K Logic Modules

56340

1 Core

256KB

11 mm

11 mm

M2S005S-1TQG144I
M2S005S-1TQG144I
Microchip Technology 数据表

31 In Stock

-

最小起订量: 1

最小包装量: 1

TQFP-144

144-TQFP (20x20)

ARM Cortex M3

微芯片技术

64 kB

6060 LE

505 LAB

60

0.046530 oz

活跃

M2S005

Tray

84

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 5K Logic Modules

1 Core

128KB