N/A

-

YES

8

有

Obsolete

MICROCHIP TECHNOLOGY INC

PACKAGE-6

70 °C

CERAMIC, METAL-SEALED COFIRED

SOJ

SOJ8(UNSPEC)

RECTANGULAR

小概要

3.3 V

8542.39.00.01

DUAL

J BEND

1

2.54 mm

compliant

R-CDSO-J6

3.6 V

3 V

锁相环频率合成器

4.69 mm

40 mA

13.97 mm

8.89 mm

N/A

-

YES

2

SOIC

VSON,

85 °C

-40 °C

PLASTIC/EPOXY

VSON

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE

Obsolete

THIN FILM TECHNOLOGY CORP

e4

镍镀金

8542.39.00.01

DUAL

无铅

1

unknown

2

R-PDSO-N2

不合格

INDUSTRIAL

0.35 mm

线路均衡器

1.52 mm

0.76 mm

N/A

-

YES

64

无

接触制造商

COMTECH AHA CORP

QFP

TFQFP, TQFP64,.35SQ,16

3

85 °C

-40 °C

PLASTIC/EPOXY

TFQFP

TQFP64,.35SQ,16

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

1.8 V

8542.39.00.01

QUAD

鸥翼

220

1

0.4 mm

unknown

64

S-PQFP-G64

不合格

INDUSTRIAL

0.07 mA

1.2 mm

支持回路

7 mm

7 mm

N/A

-

YES

128

PLASTIC/EPOXY

70 °C

LEAD FREE, LQFP-128

MICROCHIP TECHNOLOGY INC

活跃

1.2 V

FLATPACK, LOW PROFILE, FINE PITCH

SQUARE

LFQFP

e3

哑光锡

8542.39.00.01

QUAD

鸥翼

1

0.4 mm

compliant

S-PQFP-G128

COMMERCIAL

1.6 mm

以太网收发器

14 mm

14 mm

N/A

-

YES

28

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP28,.4

RECTANGULAR

小概要

3.3 V

活跃

MICROCHIP TECHNOLOGY INC

8542.39.00.01

DUAL

鸥翼

1.27 mm

compliant

R-PDSO-G28

不合格

INDUSTRIAL

160 mA

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

N/A

-

N/A

-

N/A

-

N/A

-

YES

28

QCCJ,

CHIP CARRIER

PLASTIC/EPOXY

3.3 V

70 °C

有

LE9500BBJC

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.6

LCC

有

8542.39.00.01

QUAD

J BEND

1

1.27 mm

compliant

28

S-PQCC-J28

不合格

COMMERCIAL

4.572 mm

SLIC

11.5062 mm

11.5062 mm

N/A

-

微芯片技术

Bulk

活跃

-

N/A

-

N/A

-

N/A

-

微芯片技术

Bulk

Obsolete

-

N/A

-

N/A

-

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

YES

20

20

活跃

MICROSEMI CORP

5.27

150 V

Compliant

SOP, SOP20,.4

小概要

PLASTIC/EPOXY

SOP20,.4

5 V

30

70 °C

有

MT8963ASR1

SOP

RECTANGULAR

Microsemi Corporation

Tape & Reel

0.5 %

e3

有

25 ppm/°C

379 kΩ

哑光锡

155 °C

-55 °C

Thin Film

8542.39.00.01

Codecs

125 mW

CMOS

DUAL

鸥翼

260

1

1.27 mm

compliant

R-PDSO-G20

不合格

5 V

+-5 V

COMMERCIAL

1

SYNCHRONOUS

0.004 mA

3 mA

2.65 mm

1

PCM 编解码器

1

YES

A-LAW

-5 V

0.25 dB

不提供

650 µm

12.8 mm

7.5 mm

无

N/A

-

N/A

-

表面贴装

888-BGA, FCBGA

888-FCBGA (25x25)

微芯片技术

微芯片技术

Details

Tray

活跃

40

Microchip

0°C ~ 105°C

Tray

SparX™-IV

Communication & Networking ICs

-

以太网交换机

SPI

-

以太网集成电路

以太网交换机

以太网集成电路

N/A

-

1206 (3216 Metric)

1206

Stackpole Electronics Inc

Microchip

微芯片技术

Details

Bulk

活跃

-55°C ~ 155°C

RMEF

0.120 L x 0.063 W (3.05mm x 1.60mm)

±1%

2

±100ppm/°C

2.21 kOhms

厚膜

0.25W, 1/4W

接口集成电路

-

电信接口集成电路

Automotive AEC-Q200

电信接口集成电路

0.028 (0.70mm)

AEC-Q200

N/A

-

PEI-Genesis

Bulk

活跃

*

N/A

-

PEI-Genesis

Bulk

活跃

PLCC

2.048 Mbps

表面贴装

ESF/T1

-40 to 85 °C

*

44

1

N/A

-

PEI-Genesis

Bulk

活跃

PLCC

2.048 Mbps

表面贴装

ESF/T1

-40 to 85 °C

*

44

1

N/A

-

表面贴装

6-SMD, No Lead

SiTime

SIT9375

活跃

BGA

3.3 V

3.135 V

8.192 Mbps

PCI

3.46 V

表面贴装

Commercial grade

Tape & Reel (TR)

-40°C ~ 105°C

SiT9375

0.079 L x 0.063 W (2.00mm x 1.60mm)

XO (Standard)

1.8V

125 MHz

±20ppm

HCSL

456

Enable/Disable

MEMS

38mA

-

-

Commercial

-

0.031 (0.80mm)

-

N/A

-

表面贴装

888-BGA, FCBGA

888-FCBGA (25x25)

微芯片技术

Details

微芯片技术

Tray

活跃

40

Microchip

-

Tray

VeriTime™

Communication & Networking ICs

-

以太网交换机

Ethernet

57

-

以太网集成电路

以太网交换机

以太网集成电路

N/A

-

Turck

A3173-2