N/A

-

表面贴装

30-SMD Module

微芯片技术

-40°C ~ 85°C

Tray

RNBD

活跃

1.9V ~ 3.6V

2.4GHz

2Mbps

Bluetooth v5.2

11dBm

Bluetooth

Antenna Not Included, U.FL

-108dBm

ADC, GPIO, UART

16mA ~ 20mA

22mA ~ 49mA

GFSK, O-QPSK

N/A

-

符合RoHS标准

3 V

3.6 V

94 mA

Bluetooth

288 mA

- 40 C

+ 105 C

U.FL

7 mm x 7 mm x 0.85 mm

802.11b/g/n

3000

Reel

2.4 GHz

N/A

-

符合RoHS标准

3 V

3.6 V

94 mA

Bluetooth

288 mA

- 40 C

+ 105 C

U.FL

7 mm x 7 mm x 0.85 mm

802.11b/g/n

416

Tray

2.4 GHz

N/A

-

符合RoHS标准

3 V

3.6 V

94 mA

Bluetooth

288 mA

- 40 C

+ 105 C

U.FL

21.7 mm x 17.3 mm x 2.1 mm

802.11b/g/n

416

Tray

2.4 GHz

N/A

-

符合RoHS标准

SPI

1.8 V

3.6 V

- 40 C

+ 85 C

U.FL

21.7 mm x 14.7 mm x 2.1 mm

WiFi - 802.11 b/g/n

WPA3

20 MHz

3.3 V

N/A

-

符合RoHS标准

UART

1.8 V

3.6 V

- 40 C

+ 85 C

PCB天线

21.7 mm x 14.7 mm x 2.1 mm

WiFi - 802.11 b/g/n

WPA3

20 MHz

3.3 V

N/A

-

Wireless & RF Modules

蓝牙模块

N/A

-

Wireless & RF Modules

蓝牙模块

N/A

-

表面贴装

54-SMD Module

微芯片技术

Tray

活跃

-40°C ~ 85°C

-

2.97V ~ 3.63V

2.4GHz

1MB Flash, 256kB SRAM

54Mbps

WFI32E01

802.11b/g/n

20.5dBm

WiFi

不包括天线

-99dBm

I²C, JTAG, SPI, UART, USB

216mA

340mA ~ 414mA

-

N/A

-

N/A

-

Wireless & RF Modules

蓝牙模块

N/A

-

Wireless & RF Modules

蓝牙模块

N/A

-

表面贴装

45-PowerFLGA Module

微芯片技术

Tray

Obsolete

-40°C ~ 85°C

-

2.1V ~ 3.3V

2.4GHz

-

-

-

-

-

WiFi

不包括天线

-

I²S, SPI, UART

-

-

-

6 In Stock

-

12 Weeks

表面贴装

表面贴装

35-SMD Module

35

Automotive grade

-40°C~85°C

Tray

2010

活跃

3 (168 Hours)

32

3V~3.6V

UNSPECIFIED

1

3.3V

2.4GHz

RN42

R-XXMA-N32

3.3V

SPI, UART

300kbps

Bluetooth v2.1 +EDR, Class 2

TS 16949

电信电路

4dBm

Bluetooth

Integrated, Trace

UART

25mA

30mA

-80 dBm

6.15

2mm

25.8mm

13.4mm

无

无SVHC

ROHS3 Compliant

无铅

N/A

-

表面贴装

50-SMD Module

DSP

49 mA

59 mA

10.4dBm

3.3 V

Tray

BM83

活跃

32 mm x 15 mm x 2.5 mm

微芯片技术

Details

Class 1, Class 2

GPIO, I2C, SPI, UART, USB

- 90 dBm

3.3 V

- 40 C

+ 85 C

PCB天线

有

PCB 安装

56

-40°C ~ 85°C (TA)

Tray

BM83

USB适配器

3.2V ~ 4.2V

Shielded

2.44 GHz

3.3 V

-

11 dBm

2 Mb/s

IS2083BM

Bluetooth 5.0

2.402 GHz to 2.48 GHz

11dBm

Bluetooth

PCB Trace

-90dBm

ADC, GPIO, I²S, JTAG, PWM, UART, USB

38.5mA ~ 49mA

22mA ~ 59mA

-

蓝牙模块

DPSK, DQSK, GFSK

2.5 mm

32 mm

15 mm

N/A

-

表面贴装

30-SMD Module

微芯片技术

Class 2

UART, I2C

- 90 dBm, -92 dBm

3.3 V

- 20 C

+ 70 C

外部天线

-

SMD/SMT

136

4.2 V

Tray

BM78

活跃

-20°C ~ 70°C

Tray

-

3.3V ~ 4.2V

Unshielded

2.44 GHz

3.8 V

4MB Flash, 320kB ROM, 28kB SRAM

1.5 dBm

115.2kBaud

-

Bluetooth 5.0 + EDR

2.402 GHz to 2.48 GHz

2dBm

Bluetooth

不包括天线

-92dBm

I²C, UART

37mA

43mA

-

蓝牙模块

N/A

-

表面贴装

QFN-32

Plastic

Tray

活跃

微芯片技术

15 I/O

+ 70 C

3.6 V

- 20 C

490

1.9 V

SMD/SMT

10 mA

I2C, SPI, UART

10 mA

Microchip

微芯片技术

SRAM

24 kB

-40°C ~ 85°C

Tray

IS1871

Bluetooth

Wireless & RF Integrated Circuits

Si

1.9V ~ 3.6V

2.402GHz ~ 2.48GHz

2.4 GHz

256kB Flash, 32kB ROM, 24kB SRAM

Flash, ROM

256 kB, 32 kB

0 dBm

921.6kbps

8 bit

8051

RF System on a Chip - SoC

Bluetooth v4.2

0dBm

Bluetooth

PCB Trace

- 90 dBm

6 Channel

ADC, I²C, PWM, SPI, UART

13mA

13mA

-

RF System on a Chip - SoC

0.9 mm

4 mm

4 mm

N/A

-

通孔

54-SMD Module

Polyamide (PA66), Nylon 6/6

Copper Alloy - Tin Plated

Copper Alloy - Nickel Plated

Copper Alloy - Nickel Plated

Microchip Technology / Atmel

Details

802.11 b/g/n

Amphenol PCD

Tray

ESDM10

0.13 Nm (1.15 Lb-In)

活跃

PIC32MZ1025W104

U.FL

+ 85 C

3.6 V

- 40 C

40

3 V

222 mA, 279 mA

CAN, CAN FD, Ethernet, I2C, SPI, SQI, UART, USB 2.0 OTG

73 mA, 88 mA

Microchip

-40°C ~ 110°C

Tray

ESDM

Black

Wireless & RF Modules

0.100 (2.54mm)

32 bit

3V ~ 3.6V

200MHz

3 V to 3.6 V

16-30 AWG

150 V

1MB Flash, 256kB SRAM

1

10 A

18.5 dBm, 21.5 dBm,

11 Mb/s, 54 Mb/s

10

WFI32E01

WiFi模块

水平带板

Screw - Rising Cage Clamp

802.11b/g/n

-

20.5dBm

WiFi

Antenna Not Included, U.FL

-99dBm

I²C, JTAG, SPI, UART, USB

-

-

-

-

WiFi Modules - 802.11

N/A

-

表面贴装

36-SMD Module

22.43 mm x 14.73 mm x 2 mm

微芯片技术

U.FL

802.11 b/g/n

有

+ 85 C

3.6 V

- 40 C

50

2.7 V

I2C, SPI, UART

Microchip

Microchip Technology / Atmel

Tray

ATWINC3400

活跃

-40°C ~ 85°C (TA)

Tray

ATWINC3400-MR210xA

Wireless & RF Modules

2.7V ~ 3.6V

2.4 GHz

-

18.3 dBm

65Mbps

ATWINC3400

多协议模块

802.11b/g/n

18.3dBm

WiFi

Antenna Not Included, U.FL

-95dBm

I²C, SPI, UART

23.68mA ~ 63.9mA

23.68mA ~ 275mA

16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK

多协议模块

N/A

-

表面贴装

36-SMD Module

微芯片技术

U.FL

802.11 b/g/n

有

+ 85 C

3.6 V

- 40 C

50

2.7 V

I2C, SPI, UART

Microchip

Microchip Technology / Atmel

Tray

活跃

22.43 mm x 14.73 mm x 2 mm

-40°C ~ 85°C

Tray

ATWINC3400-MR210xA

Wireless & RF Modules

2.7V ~ 3.6V

2.4 GHz

1MB Flash, 256kB ROM, 708kB RAM

18.3 dBm

72.2Mbps

ATWINC3400

多协议模块

802.11b/g/n, Bluetooth v5.0

18.3dBm

Bluetooth, WiFi

Antenna Not Included, U.FL

-95dBm

I²C, SPI, UART

23.68mA ~ 63.9mA

23.68mA ~ 275mA

16-QAM, 64-QAM, BPSK, CCK, DBPSK, DSSS, DQPSK, GFSK, OFDM, QPSK

多协议模块

N/A

-

表面贴装

33-SMD Module

Tray

BM78

活跃

微芯片技术

-

+ 70 C

4.2 V

- 20 C

88

3.3 V

SMD/SMT

UART, I2C

- 90 dBm, -92 dBm

Microchip

Microchip Technology / Atmel

Internal Antenna

Class 2

-20°C ~ 70°C

Tray

-

Wireless & RF Modules

3.3V ~ 4.2V

Unshielded

2.44 GHz

3.8 V

4MB Flash, 320kB ROM, 28kB SRAM

1.5 dBm

115.2kBaud

-

蓝牙模块

Bluetooth 5.0 + EDR

2.402 GHz to 2.48 GHz

2dBm

Bluetooth

Integrated, Chip

-92dBm

I²C, UART

37mA

43mA

-

蓝牙模块

Bluetooth Modules - 802.15.1

N/A

-

表面贴装

1932-BBGA, FCBGA

1932-FBGA, FC (45x45)

微芯片技术

56

Microchip

Microchip Technology / Atmel

Details

Tray

BM83

活跃

840

-90dBm

10.4dBm

0°C ~ 85°C (TJ)

Tray

Stratix® V GS

活跃

Wireless & RF Modules

0.82 V ~ 0.88 V

2.402GHz ~ 2.48GHz

5SGSED8

-

3Mbps

IS2083BM

695000

蓝牙模块

-

60968960

262400

11dBm

Bluetooth

PCB Trace

-90dBm

ADC, GPIO, I²S, JTAG, PWM, UART, USB

38.5mA ~ 49mA

22mA ~ 59mA

-

Bluetooth Modules - 802.15.1

N/A

-

通孔

35-SMD Module

Thermoplastic

Amphenol Anytek

300 V

-

Bulk

OQ09

-

20 A

活跃

Copper

-40°C ~ 115°C

OQ

Header, Male Pins, Shrouded (4 Side)

9

Green

0.200 (5.08mm)

3V ~ 3.6V

-

0.335 (8.51mm)

2.402GHz ~ 2.48GHz

Solder

0.138 (3.50mm)

-

1

Tin

3Mbps

-

9

-

-

90°, Right Angle

-

-

Bluetooth v2.1 +EDR, Class 1

-

18.4dBm

Bluetooth

Integrated, Chip

-80dBm

SPI, UART, USB

35mA

65mA

FHSS, GFSK

锁定坡道

UL94 V-0

N/A

-

表面贴装

35-SMD Module

微芯片技术

最后一次购买

Bulk

RN42

-40°C ~ 85°C

RN42

3V ~ 3.6V

2.4GHz

-

3Mbps

-

Bluetooth v2.1 + EDR, Class 2

4dBm

Bluetooth

PCB Trace

-86dBm

SPI, UART

-

-

-

N/A

-

SMD模块

11000@b/54000@g Kbps

Commercial grade

0 to 70 °C

44

Commercial

CCK/DBPSK/DQPSK/DSSS/OFDM