我的订单
会员中心 
在线咨询
0755-83328606
品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 输出的数量 | 电源 | 内存大小 | 传播延迟 | 接通延迟时间 | 电流源 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 电压 - 供电 （最大值） | 电压 - 供电 （最小值） | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | A42MX24-1PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 176 | -40°C~85°C TA | Tray | 2009 | MX | 活跃 | 3 (168 Hours) | 208 | 5V | QUAD | 鸥翼 | 0.5mm | A42MX24 | 176 | 现场可编程门阵列 | 36000 | 250MHz | 912 | 1 | 1410 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||
 | M1AFS1500-1FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 223 | 0°C~85°C TJ | Tray | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | M1AFS1500 | 33.8kB | 276480 | 1500000 | 1.28205GHz | 1 | 38400 | 1.575V | 1.425V | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||||||||
 | M1A3PE3000-FG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 896-FBGA (31x31) | 400.011771mg | 620 | 0°C~85°C TJ | Tray | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | M1A3PE3000 | 63kB | 516096 | 3000000 | 231MHz | 75264 | 1.575V | 1.425V | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
 | P1AFS1500-2FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 223 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | P1AFS1500 | 33.8kB | 276480 | 1500000 | 2 | 38400 | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
| M1AFS1500-FG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 676-FBGA (27x27) | 400.011771mg | 252 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 1.0989GHz | M1AFS1500 | 33.8kB | 276480 | 1500000 | 1.0989GHz | 38400 | 1.575V | 1.425V | 1.73mm | 27mm | 27mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| M7AFS600-2FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 17 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 172 | -40°C~85°C TA | Tray | Fusion® | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1mm | 40 | M7AFS600 | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 1.47059GHz | 2 | 13824 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
 | APA450-FG256A | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 186 | -40°C~125°C TJ | Tray | 2009 | ProASICPLUS | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 2.5V | BOTTOM | BALL | 1mm | APA450 | 186 | 2.52.5/3.3V | 13.5kB | 现场可编程门阵列 | 110592 | 450000 | 180MHz | 12288 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||
| APA450-FGG256A | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 186 | -40°C~125°C TJ | Tray | ProASICPLUS | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 2.5V | BOTTOM | BALL | 1mm | APA450 | 186 | 2.52.5/3.3V | 13.5kB | 现场可编程门阵列 | 110592 | 450000 | 180MHz | 12288 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||
| AX500-1FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 317 | -40°C~85°C TA | Tray | 2005 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.5V | BOTTOM | BALL | 250 | 763MHz | 40 | AX500 | 336 | 9kB | 850 ps | 850 ps | 现场可编程门阵列 | 73728 | 500000 | 8064 | 1 | 5376 | 0.84 ns | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||
 | A42MX24-3TQG176 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | 表面贴装 | 表面贴装 | 176-LQFP | 176 | 176-TQFP (24x24) | 150 | 0°C~70°C TA | Tray | 2009 | MX | 活跃 | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | A42MX24 | 912 | 36000 | 912 | 3 | 1410 | 5.25V | 3V | 1.4mm | 24mm | 24mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||
| M1A3PE3000-1FG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 896-FBGA (31x31) | 400.011771mg | 620 | 0°C~85°C TJ | Tray | 2015 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | M1A3PE3000 | 63kB | 516096 | 3000000 | 272MHz | 1 | 75264 | 1.575V | 1.425V | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
 | M1AFS1500-1FG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 676-FBGA (27x27) | 400.011771mg | 252 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | M1AFS1500 | 33.8kB | 276480 | 1500000 | 1.28205GHz | 1 | 38400 | 1.575V | 1.425V | 1.73mm | 27mm | 27mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| AX250-FG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 248 | Military grade | -55°C~125°C TA | Tray | 2005 | Axcelerator | e0 | 活跃 | 3 (168 Hours) | 484 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 225 | 1mm | 30 | AX250 | 248 | 1.51.5/3.32.5/3.3V | 6.8kB | 990 ps | 现场可编程门阵列 | 2816 | 55296 | 250000 | 649MHz | 4224 | MIL-STD-883 Class B | 0.99 ns | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | ||||||||||||||||
 | A42MX24-1PQG160M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | 表面贴装 | 表面贴装 | 160-BQFP | 160 | 5.566797g | 125 | -55°C~125°C TC | Tray | 2009 | MX | e3 | 活跃 | 3 (168 Hours) | 160 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 5V | QUAD | 鸥翼 | 245 | 0.65mm | 40 | A42MX24 | 现场可编程门阵列 | 36000 | 912 | 1 | 1410 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||
| A54SX32A-1FG256M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-BGA | 256 | 400.011771mg | 203 | -55°C~125°C TC | Tray | SX-A | e0 | 活跃 | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 32000 TYPICAL GATES AVAILABLE | 2.5V | BOTTOM | BALL | 225 | 278MHz | 30 | A54SX32A | 203 | 2.52.5/5V | 1.1 ns | 1.1 ns | 现场可编程门阵列 | 2880 | 48000 | 1 | 1980 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||
| AX500-FG676M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 400.011771mg | 336 | Military grade | -55°C~125°C TA | Tray | Axcelerator | e0 | 活跃 | 3 (168 Hours) | 676 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 225 | 1mm | 30 | AX500 | 336 | 1.51.5/3.32.5/3.3V | 9kB | 990 ps | 现场可编程门阵列 | 5376 | 73728 | 500000 | 649MHz | 8064 | MIL-STD-883 Class B | 0.99 ns | 1.73mm | 27mm | 27mm | 无 | Non-RoHS Compliant | |||||||||||||||||
| A3PE3000L-1FGG896M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 620 | -55°C~125°C TJ | Tray | 2009 | ProASIC3L | e1 | 活跃 | 3 (168 Hours) | 896 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 40 | A3PE3000L | 620 | 63kB | 25mA | 现场可编程门阵列 | 516096 | 3000000 | 350MHz | 1 | 75264 | 2.44mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
| M1A3P1000-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 300 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | 活跃 | 3 (168 Hours) | 1.5V | M1A3P1000 | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 231MHz | 24576 | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
| A3P250-1FGG256T | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 157 | -40°C~125°C TA | Tray | 2009 | Automotive, AEC-Q100, ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.5V | BOTTOM | BALL | 250 | 30 | A3P250 | 157 | 4.5kB | 3mA | 现场可编程门阵列 | 36864 | 250000 | 272MHz | 1 | 6144 | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||
| M1A3P1000-1PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 154 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | 活跃 | 3 (168 Hours) | 1.5V | M1A3P1000 | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 272MHz | 1 | 24576 | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
| M1A3P1000-2FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 300 | 0°C~85°C TJ | Tray | 2003 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | M1A3P1000 | 18kB | 147456 | 1000000 | 310MHz | 2 | 24576 | 1.575V | 1.425V | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
| A42MX16-FPQG160 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 160-BQFP | 160 | 160-PQFP (28x28) | 5.566797g | 125 | 0°C~70°C TA | Tray | 2009 | MX | 活跃 | 3 (168 Hours) | 70°C | 0°C | 5V | A42MX16 | 608 | 24000 | 103MHz | 608 | 928 | 5.25V | 3V | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
| AGLE600V5-FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 165 | 0°C~70°C TA | Tray | 2009 | IGLOOe | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | AGLE600 | 13.5kB | 13824 | 110592 | 600000 | 892.86MHz | 13824 | 1.575V | 1.425V | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||
 | APA150-FGG144A | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 100 | -40°C~125°C TJ | Tray | 2009 | ProASICPLUS | 活跃 | 3 (168 Hours) | 144 | 8542.39.00.01 | 2.5V | BOTTOM | BALL | 1mm | APA150 | 100 | 2.52.5/3.3V | 4.5kB | 现场可编程门阵列 | 36864 | 150000 | 180MHz | 6144 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||
| A54SX16A-PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 175 | -40°C~85°C TA | Tray | 2007 | SX-A | 活跃 | 3 (168 Hours) | 85°C | -40°C | 2.5V | 227MHz | A54SX16A | 1.4 ns | 1.4 ns | 1452 | 24000 | 227MHz | 1452 | 1452 | 990 | 2.75V | 2.25V | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 |
-
A42MX24-1PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS1500-1FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000-FG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
P1AFS1500-2FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS1500-FG676
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7AFS600-2FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA450-FG256A
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA450-FGG256A
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX500-1FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX24-3TQG176
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000-1FG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS1500-1FG676
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX250-FG484M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX24-1PQG160M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A54SX32A-1FG256M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX500-FG676M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE3000L-1FGG896M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000-FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250-1FGG256T
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000-1PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000-2FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX16-FPQG160
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLE600V5-FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA150-FGG144A
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A54SX16A-PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)