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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 内存大小 | 传播延迟 | 接通延迟时间 | 电流源 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 电压 - 供电 （最大值） | 电压 - 供电 （最小值） | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | M2GL005-1FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 484-BGA | YES | 209 | -40°C~100°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 240 | 1mm | 20 | M2GL005 | S-PBGA-B484 | 209 | 不合格 | 1.2V | 87.9kB | 209 | 现场可编程门阵列 | 6060 | 719872 | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||
 | AGLP030V5-CSG289 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 15 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 289-TFBGA, CSBGA | 289 | 289-CSP (14x14) | 120 | 0°C~85°C TJ | Tray | 2015 | IGLOO PLUS | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | AGLP030 | 792 | 30000 | 892.86MHz | 792 | 1.575V | 1.425V | 810μm | 14mm | 14mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
| AGLP060V5-CS289 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 289-TFBGA, CSBGA | 289 | 289-CSP (14x14) | 157 | 0°C~85°C TJ | Tray | 2015 | IGLOO PLUS | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | AGLP060 | 2.3kB | 1584 | 18432 | 60000 | 892.86MHz | 512 | 1584 | 1.575V | 1.425V | 810μm | 14mm | 14mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
 | A42MX24-PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 176 | 0°C~70°C TA | Tray | 2009 | MX | 活跃 | 3 (168 Hours) | 70°C | 0°C | 5V | A42MX24 | 912 | 36000 | 250MHz | 912 | 1410 | 5.25V | 3V | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
 | M7AFS600-2FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 17 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 119 | -40°C~85°C TA | Tray | Fusion® | 活跃 | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 1.425V~1.575V | BOTTOM | BALL | 225 | 1mm | 30 | M7AFS600 | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 1.47059GHz | 2 | 13824 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
 | M7AFS600-2FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 17 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 119 | -40°C~85°C TA | Tray | Fusion® | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.5V | BOTTOM | BALL | 260 | 1mm | 40 | M7AFS600 | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 1.47059GHz | 2 | 13824 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||
| M7AFS600-1FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 17 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 172 | -40°C~85°C TA | Tray | Fusion® | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 1.5V | BOTTOM | BALL | 225 | 30 | M7AFS600 | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 1.28205GHz | 1 | 13824 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| M7AFS600-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 17 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 172 | -40°C~85°C TA | Tray | Fusion® | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 225 | 1mm | 30 | M7AFS600 | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 1.0989GHz | 13824 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||
 | AX500-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 317 | 0°C~70°C TA | Tray | 2005 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.5V | BOTTOM | BALL | 250 | 763MHz | 40 | AX500 | 336 | 9kB | 850 ps | 850 ps | 现场可编程门阵列 | 73728 | 500000 | 8064 | 1 | 5376 | 0.84 ns | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||
 | A42MX24-3PLG84 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | 表面贴装 | 表面贴装 | 84-LCC (J-Lead) | 84 | 84-PLCC (29.31x29.31) | 6.777889g | 72 | 0°C~70°C TA | Tube | 2009 | MX | 活跃 | 3 (168 Hours) | 70°C | 0°C | 5V | A42MX24 | 912 | 36000 | 912 | 3 | 1410 | 5.25V | 3V | 3.68mm | 29.31mm | 29.31mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
 | AX500-2PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 115 | -40°C~85°C TA | Tray | 2012 | Axcelerator | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 1.5V | QUAD | 鸥翼 | 245 | 0.5mm | 870MHz | 40 | AX500 | 336 | 9kB | 740 ps | 740 ps | 现场可编程门阵列 | 73728 | 500000 | 8064 | 2 | 5376 | 0.74 ns | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||
| A3PE3000-FGG324 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 324-BGA | 324 | 324-FBGA (19x19) | 400.011771mg | 221 | 0°C~85°C TJ | Tray | 2009 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | 231MHz | A3PE3000 | 63kB | 25mA | 516096 | 3000000 | 231MHz | 75264 | 1.575V | 1.425V | 1.25mm | 19mm | 19mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||
 | A42MX24-TQG176A | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 176-LQFP | 176 | 150 | -40°C~125°C TA | Tray | 2009 | MX | e3 | 活跃 | 3 (168 Hours) | 176 | Matte Tin (Sn) | CAN ALSO BE OPERATED AT 5.0V SUPPLY | 8542.39.00.01 | 5V | QUAD | 鸥翼 | 260 | 0.5mm | 40 | A42MX24 | 2 ns | 现场可编程门阵列 | 36000 | 135MHz | 1410 | 1890 | 1.4mm | 24mm | 24mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||
| A42MX24-1PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 176 | -40°C~85°C TA | Tray | 2009 | MX | 活跃 | 3 (168 Hours) | 208 | 5V | QUAD | 鸥翼 | 0.5mm | A42MX24 | 176 | 现场可编程门阵列 | 36000 | 250MHz | 912 | 1 | 1410 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| M1AFS1500-1FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 223 | 0°C~85°C TJ | Tray | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | M1AFS1500 | 33.8kB | 276480 | 1500000 | 1.28205GHz | 1 | 38400 | 1.575V | 1.425V | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||||||||||
| M1A3PE3000-FG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 896-FBGA (31x31) | 400.011771mg | 620 | 0°C~85°C TJ | Tray | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | M1A3PE3000 | 63kB | 516096 | 3000000 | 231MHz | 75264 | 1.575V | 1.425V | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| P1AFS1500-2FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 223 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | P1AFS1500 | 33.8kB | 276480 | 1500000 | 2 | 38400 | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||
| M1AFS1500-FG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 676-FBGA (27x27) | 400.011771mg | 252 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 1.0989GHz | M1AFS1500 | 33.8kB | 276480 | 1500000 | 1.0989GHz | 38400 | 1.575V | 1.425V | 1.73mm | 27mm | 27mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
| M7AFS600-2FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 17 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 172 | -40°C~85°C TA | Tray | Fusion® | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1mm | 40 | M7AFS600 | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 1.47059GHz | 2 | 13824 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||
| APA450-FG256A | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 186 | -40°C~125°C TJ | Tray | 2009 | ProASICPLUS | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 2.5V | BOTTOM | BALL | 1mm | APA450 | 186 | 2.52.5/3.3V | 13.5kB | 现场可编程门阵列 | 110592 | 450000 | 180MHz | 12288 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| APA450-FGG256A | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 186 | -40°C~125°C TJ | Tray | ProASICPLUS | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 2.5V | BOTTOM | BALL | 1mm | APA450 | 186 | 2.52.5/3.3V | 13.5kB | 现场可编程门阵列 | 110592 | 450000 | 180MHz | 12288 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||
| AX500-1FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 317 | -40°C~85°C TA | Tray | 2005 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.5V | BOTTOM | BALL | 250 | 763MHz | 40 | AX500 | 336 | 9kB | 850 ps | 850 ps | 现场可编程门阵列 | 73728 | 500000 | 8064 | 1 | 5376 | 0.84 ns | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||
| A42MX24-3TQG176 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | 表面贴装 | 表面贴装 | 176-LQFP | 176 | 176-TQFP (24x24) | 150 | 0°C~70°C TA | Tray | 2009 | MX | 活跃 | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | A42MX24 | 912 | 36000 | 912 | 3 | 1410 | 5.25V | 3V | 1.4mm | 24mm | 24mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
| M1A3PE3000-1FG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 896-FBGA (31x31) | 400.011771mg | 620 | 0°C~85°C TJ | Tray | 2015 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | M1A3PE3000 | 63kB | 516096 | 3000000 | 272MHz | 1 | 75264 | 1.575V | 1.425V | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
 | M1AFS1500-1FG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 676-FBGA (27x27) | 400.011771mg | 252 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | M1AFS1500 | 33.8kB | 276480 | 1500000 | 1.28205GHz | 1 | 38400 | 1.575V | 1.425V | 1.73mm | 27mm | 27mm | 无 | Non-RoHS Compliant |
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M2GL005-1FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLP030V5-CSG289
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLP060V5-CS289
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX24-PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7AFS600-2FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7AFS600-2FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7AFS600-1FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7AFS600-FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX500-1FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX24-3PLG84
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX500-2PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE3000-FGG324
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX24-TQG176A
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX24-1PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS1500-1FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000-FG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
P1AFS1500-2FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS1500-FG676
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7AFS600-2FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA450-FG256A
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA450-FGG256A
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX500-1FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX24-3TQG176
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000-1FG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS1500-1FG676
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)