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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 输出的数量 | 资历状况 | 电源 | 内存大小 | 电流源 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 电压 - 供电 （最大值） | 电压 - 供电 （最小值） | 高度 | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | A3P600-2FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 days ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.5V | BOTTOM | BALL | 260 | 1mm | 310MHz | 40 | A3P600 | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 2 | 13824 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||
 | A3P250-VQ100 | Microsemi Corporation | 数据表 | 180 In Stock | - | 最小起订量: 1 最小包装量: 1 | 2 Weeks | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 100-VQFP (14x14) | 68 | 0°C~85°C TJ | Tray | 2009 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | 231MHz | A3P250 | 4.5kB | 36864 | 250000 | 231MHz | 6144 | 1.575V | 1.425V | 1mm | 14mm | 14mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| AGL030V2-VQG100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | Tin | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 100-VQFP (14x14) | 77 | 0°C~70°C TA | Tray | 2009 | IGLOO | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | AGL030 | 768 | 30000 | 892.86MHz | 1.575V | 1.14V | 1mm | 14mm | 14mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||
 | A3P400-FG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 97 | 0°C~85°C TJ | Tray | 2009 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | A3P400 | 6.8kB | 55296 | 400000 | 231MHz | 9216 | 1.575V | 1.425V | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||
 | A3P600-2PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 154 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 1.5V | QUAD | 鸥翼 | 245 | 0.5mm | 310MHz | 40 | A3P600 | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 2 | 13824 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
 | A40MX02-PL44M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 44-LCC (J-Lead) | 44 | 2.386605g | 34 | -55°C~125°C TC | Tray | 2009 | MX | e0 | Obsolete | 3 (168 Hours) | 44 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 5V | QUAD | J BEND | 225 | 1.27mm | 30 | A40MX02 | 现场可编程门阵列 | 3000 | 139MHz | 295 | 147 | 2.7 ns | 295 | 3.68mm | 16.59mm | 16.59mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||
 | A42MX16-PL84I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 84-LCC (J-Lead) | 84 | 6.777889g | 72 | -40°C~85°C TA | Tray | 2009 | MX | e0 | Obsolete | 3 (168 Hours) | 84 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 5V | QUAD | J BEND | 1.27mm | A42MX16 | 现场可编程门阵列 | 24000 | 172MHz | 608 | 928 | 2.8 ns | 1232 | 1232 | 3.68mm | 29.31mm | 29.31mm | 无 | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||
 | A3P600L-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 235 | 0°C~85°C TJ | Tray | 2009 | ProASIC3L | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.2V | A3P600L | 13.5kB | 5mA | 110592 | 600000 | 892.86MHz | 1 | 13824 | 1.26V | 1.14V | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||
 | A3P400-FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 194 | 0°C~85°C TJ | Tray | 2009 | ProASIC3 | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.5V | A3P400 | 6.8kB | 55296 | 400000 | 231MHz | 9216 | 1.575V | 1.425V | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| A40MX04-PL84I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 84-LCC (J-Lead) | 84 | 6.777889g | 69 | -40°C~85°C TA | Tray | 2009 | MX | Obsolete | 3 (168 Hours) | 84 | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 5V | QUAD | J BEND | 225 | 1.27mm | 30 | A40MX04 | 现场可编程门阵列 | 6000 | 139MHz | 547 | 273 | 2.7 ns | 547 | 3.68mm | 29.31mm | 29.31mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||
| A3P400-PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | OBSOLETE (Last Updated: 1 month ago) | Lead, Tin | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 151 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e0 | Obsolete | 3 (168 Hours) | 208 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.5V | QUAD | 鸥翼 | 225 | 0.5mm | 231MHz | 30 | A3P400 | 6.8kB | 现场可编程门阵列 | 55296 | 400000 | 9216 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||
| A40MX02-PL44I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 44-LCC (J-Lead) | 44 | 2.386605g | 34 | -40°C~85°C TA | Tray | 2009 | MX | e0 | Obsolete | 3 (168 Hours) | 44 | 锡铅 | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 5V | QUAD | J BEND | 1.27mm | A40MX02 | 现场可编程门阵列 | 3000 | 139MHz | 295 | 147 | 2.7 ns | 295 | 3.68mm | 16.59mm | 16.59mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||
| A40MX04-PL84M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 84-LCC (J-Lead) | 84 | 6.777889g | 69 | -55°C~125°C TC | Tray | 2009 | MX | e0 | Obsolete | 3 (168 Hours) | 84 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 5V | QUAD | J BEND | 225 | 1.27mm | 30 | A40MX04 | 现场可编程门阵列 | 6000 | 139MHz | 547 | 273 | 2.7 ns | 547 | 3.68mm | 29.31mm | 29.31mm | 无 | Non-RoHS Compliant | |||||||||||||||||||
| A3PE1500-PQ208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2 Weeks | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 147 | 0°C~85°C TJ | Tray | 2006 | ProASIC3E | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.5V | A3PE1500 | 33.8kB | 276480 | 1500000 | 231MHz | 38400 | 1.575V | 1.425V | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| A3PE600-2PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | OBSOLETE (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 147 | -40°C~100°C TJ | Tray | 2009 | ProASIC3E | e0 | Obsolete | 3 (168 Hours) | 208 | Tin/Lead (Sn/Pb) | 1.5V | QUAD | 鸥翼 | 225 | 0.5mm | 310MHz | 30 | A3PE600 | 147 | 1.5/3.3V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 2 | 13824 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||
 | A3PE600-2FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | IN PRODUCTION (Last Updated: 3 weeks ago) | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 165 | -40°C~100°C TJ | Tray | 2009 | ProASIC3E | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.5V | BOTTOM | BALL | 260 | 1mm | 40 | A3PE600 | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 310MHz | 2 | 13824 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||
 | A3PE600-FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 165 | -40°C~100°C TJ | Tray | 2009 | ProASIC3E | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 260 | 1mm | 40 | A3PE600 | 165 | 1.5/3.3V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 231MHz | 13824 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||
| A42MX09-1VQ100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 83 | -40°C~85°C TA | Tray | MX | e0 | Obsolete | 3 (168 Hours) | 100 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 5V | QUAD | 鸥翼 | 225 | 0.5mm | 30 | A42MX09 | 现场可编程门阵列 | 14000 | 247MHz | 336 | 1 | 516 | 684 | 1mm | 14mm | 14mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||
| A3P600L-1FGG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 97 | 0°C~85°C TJ | Tray | 2009 | ProASIC3L | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.2V | A3P600L | 13.5kB | 5mA | 110592 | 600000 | 892.86MHz | 1 | 13824 | 1.26V | 1.14V | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||
| A3PE1500-2PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 147 | -40°C~100°C TJ | Tray | 2015 | ProASIC3E | e0 | Obsolete | 3 (168 Hours) | 208 | Tin/Lead (Sn/Pb) | 1.5V | QUAD | 鸥翼 | 225 | 0.5mm | 30 | A3PE1500 | 147 | 1.5/3.3V | 33.8kB | 现场可编程门阵列 | 276480 | 1500000 | 310MHz | 2 | 38400 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||
| A42MX36-PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | OBSOLETE (Last Updated: 3 weeks ago) | Lead, Tin | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 176 | -40°C~85°C TA | Tray | 2015 | MX | e0 | Obsolete | 3 (168 Hours) | 208 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 5V | QUAD | 鸥翼 | 0.5mm | A42MX36 | 320B | 现场可编程门阵列 | 2560 | 54000 | 131MHz | 1184 | 1822 | 2.7 ns | 2438 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | 无铅 | |||||||||||||||||||
| M7A3P1000-2PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 154 | -40°C~100°C TJ | Tray | ProASIC3 | Obsolete | 3 (168 Hours) | 208 | 1.5V | QUAD | 鸥翼 | 0.5mm | M7A3P1000 | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 310MHz | 2 | 24576 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||
 | AGL030V2-QNG48I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | 48 | 150.507618mg | 34 | -40°C~85°C TA | Tray | 2009 | IGLOO | 活跃 | 3 (168 Hours) | 48 | 8542.39.00.01 | 1.5V | QUAD | 无铅 | 未说明 | 未说明 | AGL030 | 不合格 | 4μA | 现场可编程门阵列 | 768 | 30000 | 250MHz | 768 | 880μm | 6mm | 6mm | 符合RoHS标准 | |||||||||||||||||||||||||
| M2GL005-FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 209 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 1.14V~2.625V | 6060 | 719872 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||
| M1AGL1000V2-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 300 | 0°C~70°C TA | Tray | IGLOO | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | M1AGL1000 | 18kB | 24576 | 147456 | 1000000 | 符合RoHS标准 |
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A3P600-2FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250-VQ100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL030V2-VQG100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P400-FG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P600-2PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A40MX02-PL44M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX16-PL84I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P600L-1FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P400-FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A40MX04-PL84I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P400-PQ208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A40MX02-PL44I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A40MX04-PL84M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE1500-PQ208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE600-2PQ208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE600-2FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE600-FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX09-1VQ100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P600L-1FGG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE1500-2PQ208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX36-PQ208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7A3P1000-2PQ208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL030V2-QNG48I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005-FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AGL1000V2-FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)