品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 内存大小 | 时钟频率 | 传播延迟 | 接通延迟时间 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 等效门数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | A54SX32A-1TQG144M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 1.319103g | 113 | -55°C~125°C TC | Tray | SX-A | e3 | 活跃 | 3 (168 Hours) | 144 | Matte Tin (Sn) | 32000 TYPICAL GATES AVAILABLE | 2.25V~5.25V | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 278MHz | 40 | A54SX32A | 113 | 2.5V | 2.53.3/5V | 1.1 ns | 1.1 ns | 现场可编程门阵列 | 2880 | 48000 | 1 | 1980 | 1.4mm | 20mm | 20mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||
![]() | A54SX32A-1FGG256M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 203 | -55°C~125°C TC | Tray | SX-A | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 32000 TYPICAL GATES AVAILABLE | 2.25V~5.25V | BOTTOM | BALL | 260 | 2.5V | 40 | A54SX32A | 203 | 2.5V | 2.52.5/5V | 1.1 ns | 现场可编程门阵列 | 48000 | 278MHz | 2880 | 1 | 1980 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||
![]() | AX250-FGG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 248 | Military grade | -55°C~125°C TA | Tray | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 484 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 1mm | 649MHz | 40 | AX250 | 248 | 1.5V | 1.51.5/3.32.5/3.3V | 6.8kB | 990 ps | 990 ps | 现场可编程门阵列 | 55296 | 250000 | 4224 | MIL-STD-883 Class B | 2816 | 0.99 ns | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||
![]() | A54SX32-TQG144M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 1.319103g | 113 | -55°C~125°C TC | Tray | SX | e3 | 不用于新设计 | 3 (168 Hours) | 144 | 3A001.A.2.C | Matte Tin (Sn) | 8542.39.00.01 | 3V~3.6V 4.75V~5.25V | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 240MHz | 40 | A54SX32 | 113 | 5V | 900 ps | 900 ps | 现场可编程门阵列 | 2880 | 48000 | 1080 | 0.9 ns | 32000 | 1.4mm | 20mm | 20mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||
![]() | M1AFS1500-FG256K | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 119 | -55°C~100°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 100°C | -55°C | 1.425V~1.575V | M1AFS1500 | 33.8kB | 276480 | 1500000 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-1BGG329M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 329-BBGA | 329 | 249 | -55°C~125°C TC | Tray | SX-A | e1 | 活跃 | 3 (168 Hours) | 329 | Tin/Silver/Copper (Sn/Ag/Cu) | 32000 TYPICAL GATES AVAILABLE | 2.25V~5.25V | BOTTOM | BALL | 250 | 2.5V | 278MHz | 40 | A54SX32A | 249 | 2.5V | 2.53.3/5V | 1.1 ns | 1.1 ns | 现场可编程门阵列 | 2880 | 48000 | 1 | 1980 | 1.8mm | 31mm | 31mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||
![]() | AX500-FGG676M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 400.011771mg | 336 | Military grade | -55°C~125°C TA | Tray | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 676 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 1mm | 649MHz | 40 | AX500 | 336 | 1.5V | 1.51.5/3.32.5/3.3V | 9kB | 990 ps | 990 ps | 现场可编程门阵列 | 73728 | 500000 | 8064 | MIL-STD-883 Class B | 5376 | 0.99 ns | 1.73mm | 27mm | 27mm | 无 | 符合RoHS标准 | |||||||||||||||||||||
![]() | AX500-1FGG676M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 400.011771mg | 336 | Military grade | -55°C~125°C TA | Tray | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 676 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 763MHz | 40 | AX500 | 336 | 1.5V | 9kB | 850 ps | 850 ps | 现场可编程门阵列 | 73728 | 500000 | 8064 | MIL-STD-883 Class B | 1 | 5376 | 0.84 ns | 1.73mm | 27mm | 27mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
![]() | APA1000-FGG1152 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 1152-BGA | 1152 | 400.011771mg | 712 | 0°C~70°C TA | Tray | 2007 | ProASICPLUS | e1 | 活跃 | 3 (168 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 2.3V~2.7V | BOTTOM | BALL | 245 | 2.5V | 1mm | 180MHz | 40 | APA1000 | 712 | 2.5V | 2.52.5/3.3V | 24.8kB | 现场可编程门阵列 | 202752 | 1000000 | 56320 | 1.73mm | 35mm | 35mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||
![]() | A54SX16P-2PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 175 | -40°C~85°C TA | Tray | 2006 | SX | 不用于新设计 | 3 (168 Hours) | 85°C | -40°C | 3V~3.6V 4.75V~5.25V | 320MHz | A54SX16 | 5V | 5.5V | 4.5V | 700 ps | 700 ps | 1452 | 24000 | 320MHz | 1452 | 1452 | 2 | 528 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
![]() | A42MX24-2PQG160I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | 表面贴装 | 表面贴装 | 160-BQFP | 160 | 5.566797g | 125 | -40°C~85°C TA | Tray | 2009 | MX | e3 | 活跃 | 3 (168 Hours) | 160 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 3V~3.6V 4.5V~5.5V | QUAD | 鸥翼 | 245 | 3.3V | 0.65mm | 40 | A42MX24 | 5V | 114.75MHz | 现场可编程门阵列 | 36000 | 912 | 2 | 1410 | 1.8 ns | 1890 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||
![]() | AX500-1FGG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 400.011771mg | 336 | 0°C~70°C TA | Tray | 2005 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 676 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 763MHz | 40 | AX500 | 336 | 1.5V | 9kB | 850 ps | 850 ps | 现场可编程门阵列 | 73728 | 500000 | 8064 | 1 | 5376 | 0.84 ns | 1.73mm | 27mm | 27mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
![]() | A42MX24-2PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 176 | 0°C~70°C TA | Tray | 2009 | MX | 活跃 | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | A42MX24 | 5V | 5.25V | 3V | 912 | 36000 | 912 | 2 | 1410 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||
![]() | A54SX32-TQG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 144-TQFP (20x20) | 1.319103g | 113 | -40°C~85°C TA | Tray | 2006 | SX | 不用于新设计 | 3 (168 Hours) | 85°C | -40°C | 3V~3.6V 4.75V~5.25V | 240MHz | A54SX32 | 5V | 5.5V | 4.5V | 900 ps | 900 ps | 2880 | 48000 | 240MHz | 2880 | 2880 | 1080 | 1.4mm | 20mm | 20mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
![]() | A54SX72A-FGG256A | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 256-LBGA | YES | 203 | -40°C~125°C TA | Tray | 2007 | SX-A | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 72000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 2.25V~5.25V | BOTTOM | BALL | 260 | 2.5V | 1mm | 40 | A54SX72A | S-PBGA-B256 | 203 | 不合格 | 2.53.3/5V | 217MHz | 203 | 现场可编程门阵列 | 108000 | 6036 | 1.5 ns | 1.97mm | 17mm | 17mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
![]() | A3PE3000-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 341 | 0°C~85°C TJ | Tray | 2009 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 272MHz | A3PE3000 | 1.5V | 1.575V | 1.425V | 63kB | 516096 | 3000000 | 272MHz | 1 | 75264 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
![]() | A3PE3000-FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 341 | -40°C~100°C TJ | Tray | 2009 | ProASIC3E | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 1mm | 231MHz | 40 | A3PE3000 | 341 | 1.5V | 1.5/3.3V | 63kB | 现场可编程门阵列 | 516096 | 3000000 | 75264 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||
![]() | A42MX24-3PQG160I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | 表面贴装 | 表面贴装 | 160-BQFP | 160 | 5.566797g | 125 | -40°C~85°C TA | Tray | 2009 | MX | e3 | 活跃 | 3 (168 Hours) | 160 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 3V~3.6V 4.5V~5.5V | QUAD | 鸥翼 | 245 | 3.3V | 0.65mm | 40 | A42MX24 | 5V | 现场可编程门阵列 | 36000 | 912 | 3 | 1410 | 2 ns | 1890 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
![]() | A42MX24-3PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 176 | 0°C~70°C TA | Tray | 2009 | MX | 活跃 | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | A42MX24 | 5V | 5.25V | 3V | 912 | 36000 | 912 | 3 | 1410 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||
![]() | AX500-2FGG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 676-FBGA (27x27) | 400.011771mg | 336 | 0°C~70°C TA | Tray | Axcelerator | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 870MHz | AX500 | 1.5V | 1.575V | 1.425V | 9kB | 740 ps | 740 ps | 5376 | 73728 | 500000 | 870MHz | 8064 | 5376 | 2 | 5376 | 1.73mm | 27mm | 27mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
![]() | A42MX24-3PQG160 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | 表面贴装 | 表面贴装 | 160-BQFP | 160 | 160-PQFP (28x28) | 5.566797g | 125 | 0°C~70°C TA | Tray | 2009 | MX | 活跃 | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | A42MX24 | 5V | 5.25V | 3V | 912 | 36000 | 912 | 3 | 1410 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
![]() | M1AFS600-FG256K | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 119 | -55°C~100°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 100°C | -55°C | 1.425V~1.575V | M1AFS600 | 13.5kB | 110592 | 600000 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | AFS600-FG256K | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 119 | -55°C~100°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 100°C | -55°C | 1.425V~1.575V | AFS600 | 13.5kB | 110592 | 600000 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32-2TQG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 1.319103g | 113 | 0°C~70°C TA | Tray | 2006 | SX | e3 | 不用于新设计 | 3 (168 Hours) | 144 | Matte Tin (Sn) | 3V~3.6V 4.75V~5.25V | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 320MHz | 40 | A54SX32 | 113 | 5V | 700 ps | 700 ps | 现场可编程门阵列 | 2880 | 48000 | 2 | 1080 | 0.7 ns | 1.4mm | 20mm | 20mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||
![]() | M7A3P1000-PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 154 | -40°C~100°C TJ | Tray | 2008 | ProASIC3 | 不用于新设计 | 3 (168 Hours) | 208 | 8542.39.00.01 | 1.425V~1.575V | QUAD | 鸥翼 | 1.5V | 0.5mm | 231MHz | M7A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 24576 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 |
A54SX32A-1TQG144M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX32A-1FGG256M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
AX250-FGG484M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX32-TQG144M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1AFS1500-FG256K
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX32A-1BGG329M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
AX500-FGG676M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
AX500-1FGG676M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
APA1000-FGG1152
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX16P-2PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX24-2PQG160I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
AX500-1FGG676
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX24-2PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX32-TQG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX72A-FGG256A
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3PE3000-1FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3PE3000-FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX24-3PQG160I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX24-3PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
AX500-2FGG676
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX24-3PQG160
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1AFS600-FG256K
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
AFS600-FG256K
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX32-2TQG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M7A3P1000-PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
