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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 内存大小 | 时钟频率 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | 速度等级 | 寄存器数量 | 逻辑块数量 | 逻辑单元数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | A3P1000-2FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | -40°C~100°C TJ | Tray | 2013 | ProASIC3 | 活跃 | 3 (168 Hours) | 256 | 3A001.A.7.A | TIN LEAD/TIN LEAD SILVER | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 310MHz | 30 | A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 2 | 24576 | 1.8mm | 17mm | 17mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||
 | M1AGL600V2-CS281I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 281-TFBGA, CSBGA | 281 | 215 | -40°C~85°C TA | Tray | 2016 | IGLOO | e0 | 活跃 | 3 (168 Hours) | 281 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 235 | 1.2V | 0.5mm | 20 | M1AGL600 | 不合格 | 13.5kB | 108MHz | 现场可编程门阵列 | 13824 | 110592 | 600000 | 1.05mm | 10mm | 10mm | Non-RoHS Compliant | |||||||||||||||||||||||||
 | M2GL050T-VFG400 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 400-LFBGA | YES | 400 | 207 | 0°C~85°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | M2GL050T | 207 | 不合格 | 1.2V | 228.3kB | 现场可编程门阵列 | 56340 | 1869824 | 1.51mm | 17mm | 17mm | 符合RoHS标准 | ||||||||||||||||||||||||||||
| M1AGL600V2-CSG281I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 281-TFBGA, CSBGA | 281 | 215 | -40°C~85°C TA | Tray | 2016 | IGLOO | e1 | 活跃 | 3 (168 Hours) | 281 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 260 | 1.2V | 0.5mm | 30 | M1AGL600 | 不合格 | 13.5kB | 108MHz | 现场可编程门阵列 | 13824 | 110592 | 600000 | 1.05mm | 10mm | 10mm | 符合RoHS标准 | |||||||||||||||||||||||||
 | M2GL050TS-1FCSG325 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA, CSPBGA | YES | 200 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 30 | S-PBGA-B325 | 200 | 不合格 | 1.2V | 200 | 现场可编程门阵列 | 56340 | 1869824 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| M2GL050T-1FCSG325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA, CSPBGA | YES | 200 | -40°C~100°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 30 | S-PBGA-B325 | 200 | 不合格 | 1.2V | 200 | 现场可编程门阵列 | 56340 | 1869824 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
 | A3P600L-FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2009 | ProASIC3L | e0 | 活跃 | 3 (168 Hours) | 144 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 225 | 1.2V | 1mm | 30 | A3P600L | 97 | 1.2V | 1.5/3.3V | 5mA | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 781.25MHz | 13824 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||
 | M2GL025TS-1FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 484-BGA | YES | 267 | -40°C~100°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | M2GL025TS | S-PBGA-B484 | 267 | 不合格 | 1.2V | 138kB | 267 | 现场可编程门阵列 | 27696 | 1130496 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||||||||||
 | M1AGL1000V5-FGG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 97 | 0°C~70°C TA | Tray | 2013 | IGLOO | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1AGL1000 | 127μA | 18kB | 24576 | 147456 | 1000000 | 250MHz | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
 | AFS250-2FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 114 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | AFS250 | 1.5V | 1.575V | 1.425V | 4.5kB | 36864 | 250000 | 1.47059GHz | 2 | 6144 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||
 | M2GL050TS-FGG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 896-BGA | YES | 377 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 896 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | S-PBGA-B896 | 377 | 不合格 | 1.2V | 377 | 现场可编程门阵列 | 56340 | 1869824 | 2.44mm | 31mm | 31mm | 符合RoHS标准 | ||||||||||||||||||||||||||||
| M1AFS250-FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 114 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 1.0989GHz | 40 | M1AFS250 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 6144 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||
| M1AGL1000V5-FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 300 | -40°C~85°C TA | Tray | 2015 | IGLOO | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 1mm | 40 | M1AGL1000 | 不合格 | 18kB | 108MHz | 现场可编程门阵列 | 24576 | 147456 | 1000000 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||||||||
| M2GL050-1FG896I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 896-BGA | 896-FBGA (31x31) | 377 | -40°C~100°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 100°C | -40°C | 1.14V~2.625V | M2GL050 | 228.3kB | 56340 | 1869824 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||
 | A3P250-VQ100M | Microsemi Corporation | 数据表 | 14 In Stock | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 68 | -55°C~125°C TJ | Tray | 2014 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 100 | Tin/Lead (Sn85Pb15) | 8542.39.00.01 | 1.425V~1.575V | QUAD | 鸥翼 | 未说明 | 1.5V | 0.5mm | 231MHz | 未说明 | A3P250 | S-PQFP-G100 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 6144 | 1.2mm | 14mm | 14mm | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||||
| M2GL090TS-1FCS325 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 325-TFBGA | YES | 180 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 20 | S-PBGA-B325 | 180 | 不合格 | 1.2V | 180 | 现场可编程门阵列 | 86184 | 2648064 | 86316 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
| M2GL090TS-1FCSG325 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA, CSPBGA | YES | 180 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.14V~2.625V | 1.2V | 180 | 不合格 | 1.2V | 180 | 现场可编程门阵列 | 86184 | 2648064 | 86316 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
| M1AFS250-1FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 114 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 40 | M1AFS250 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 1.28205GHz | 1 | 6144 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
 | M1AGL1000V5-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 300 | -40°C~85°C TA | Tray | 2015 | IGLOO | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | M1AGL1000 | 不合格 | 18kB | 108MHz | 现场可编程门阵列 | 24576 | 147456 | 1000000 | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | |||||||||||||||||||||||||
 | AFS250-1FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 114 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 40 | AFS250 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 1.28205GHz | 1 | 6144 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
| M1AGL1000V2-FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 484-BGA | 484 | 300 | -40°C~85°C TA | Tray | 2010 | IGLOO | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 250 | 1.2V | 1mm | 40 | M1AGL1000 | 不合格 | 127μA | 18kB | 现场可编程门阵列 | 24576 | 147456 | 1000000 | 250MHz | 2.44mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||||||||
| M2GL090TS-FCS325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 325-TFBGA | YES | 180 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 20 | S-PBGA-B325 | 180 | 不合格 | 1.2V | 180 | 现场可编程门阵列 | 86184 | 2648064 | 86316 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
| AFS250-2FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 114 | -40°C~100°C TJ | Tray | Fusion® | 活跃 | 3 (168 Hours) | 256 | 3A001.A.7.A | TIN LEAD/TIN LEAD SILVER | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | AFS250 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 1.47059GHz | 2 | 6144 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||
| M2GL090TS-1FCSG325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA, CSPBGA | YES | 180 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.14V~2.625V | 1.2V | 180 | 不合格 | 1.2V | 180 | 现场可编程门阵列 | 86184 | 2648064 | 86316 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
| M2GL090T-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 484-BGA | YES | 484 | 267 | 0°C~85°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | M2GL090T | 267 | 不合格 | 1.2V | 323.3kB | 现场可编程门阵列 | 86316 | 2648064 | 2.44mm | 23mm | 23mm | 符合RoHS标准 |
-
A3P1000-2FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AGL600V2-CS281I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL050T-VFG400
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AGL600V2-CSG281I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL050TS-1FCSG325
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL050T-1FCSG325I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P600L-FG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025TS-1FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AGL1000V5-FGG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS250-2FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL050TS-FGG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS250-FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AGL1000V5-FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL050-1FG896I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250-VQ100M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL090TS-1FCS325
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL090TS-1FCSG325
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS250-1FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AGL1000V5-FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS250-1FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AGL1000V2-FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL090TS-FCS325I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS250-2FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL090TS-1FCSG325I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL090T-FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)