品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 内存大小 | 时钟频率 | 传播延迟 | 接通延迟时间 | 电流源 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | AGLE600V2-FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 165 | -40°C~85°C TA | Tray | 2012 | IGLOOe | e0 | 活跃 | 3 (168 Hours) | 256 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 230 | 1mm | 30 | AGLE600 | 165 | 13.5kB | 现场可编程门阵列 | 13824 | 110592 | 600000 | 892.86MHz | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||
![]() | AGLE600V2-FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 165 | -40°C~85°C TA | Tray | 2012 | IGLOOe | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 250 | 1mm | 40 | AGLE600 | 165 | 13.5kB | 现场可编程门阵列 | 13824 | 110592 | 600000 | 892.86MHz | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||
![]() | M2GL050T-1FGG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 896-BGA | YES | 377 | 0°C~85°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 896 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 1mm | 30 | M2GL050T | S-PBGA-B896 | 377 | 不合格 | 1.2V | 228.3kB | 377 | 现场可编程门阵列 | 56340 | 1869824 | 2.44mm | 31mm | 31mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||
![]() | M2GL050T-1FG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 896-BGA | YES | 377 | 0°C~85°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 896 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 240 | 1mm | 20 | M2GL050T | S-PBGA-B896 | 377 | 不合格 | 1.2V | 228.3kB | 377 | 现场可编程门阵列 | 56340 | 1869824 | 2.44mm | 31mm | 31mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
![]() | A54SX32A-TQG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 144-TQFP (20x20) | 1.319103g | 113 | 0°C~70°C TA | Tray | 2007 | SX-A | 活跃 | 3 (168 Hours) | 70°C | 0°C | 2.5V | 238MHz | A54SX32A | 1.2 ns | 1.2 ns | 2880 | 48000 | 238MHz | 2880 | 2880 | 1980 | 2.75V | 2.25V | 1.4mm | 20mm | 20mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
![]() | M2GL050-1FGG896I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 377 | -40°C~100°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 896 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 1mm | 30 | M2GL050 | S-PBGA-B896 | 377 | 不合格 | 1.2V | 228.3kB | 377 | 现场可编程门阵列 | 56340 | 1869824 | 2.44mm | 31mm | 31mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||
![]() | M1A3P1000L-FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2013 | ProASIC3L | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 1mm | 40 | M1A3P1000L | 97 | 1.5/3.3V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 781.25MHz | 24576 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||
![]() | M2GL050T-1FG896I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 896-BGA | YES | 377 | -40°C~100°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 896 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 240 | 1mm | 20 | M2GL050T | S-PBGA-B896 | 377 | 不合格 | 1.2V | 228.3kB | 377 | 现场可编程门阵列 | 56340 | 1869824 | 2.44mm | 31mm | 31mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
![]() | A54SX32A-FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 203 | 0°C~70°C TA | Tray | 2007 | SX-A | 活跃 | 3 (168 Hours) | 70°C | 0°C | 2.5V | 238MHz | A54SX32A | 1.2 ns | 1.2 ns | 2880 | 48000 | 238MHz | 2880 | 2880 | 1980 | 2.75V | 2.25V | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
![]() | A42MX09-TQG176I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 176-LQFP | 176 | 104 | -40°C~85°C TA | Tray | 2009 | MX | e3 | 活跃 | 3 (168 Hours) | 176 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 5V | QUAD | 鸥翼 | 260 | 0.5mm | 40 | A42MX09 | 现场可编程门阵列 | 14000 | 215MHz | 336 | 516 | 2.5 ns | 684 | 1.4mm | 24mm | 24mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||
![]() | AFS250-2FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 114 | -40°C~100°C TJ | Tray | Fusion® | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.5V | BOTTOM | BALL | 260 | 1mm | 40 | AFS250 | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 1.47059GHz | 2 | 6144 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
![]() | A54SX32A-TQG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 144-TQFP (20x20) | 1.319103g | 113 | -40°C~85°C TA | Tray | 2007 | SX-A | 活跃 | 3 (168 Hours) | 85°C | -40°C | 2.5V | 238MHz | A54SX32A | 1.2 ns | 1.2 ns | 2880 | 48000 | 238MHz | 2880 | 2880 | 1980 | 2.75V | 2.25V | 1.4mm | 20mm | 20mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
![]() | M1A3P1000L-1FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2013 | ProASIC3L | e0 | 活跃 | 3 (168 Hours) | 144 | 锡铅银 | 1.2V | BOTTOM | BALL | 225 | 30 | M1A3P1000L | 97 | 18kB | 8mA | 现场可编程门阵列 | 147456 | 1000000 | 892.86MHz | 1 | 24576 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||
![]() | M1A3P1000L-FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2013 | ProASIC3L | e0 | 活跃 | 3 (168 Hours) | 144 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 225 | 1mm | 30 | M1A3P1000L | 97 | 1.5/3.3V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 781.25MHz | 24576 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||
![]() | APA300-FG256M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 186 | -55°C~125°C TC | Tray | ProASICPLUS | 活跃 | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 2.5V | BOTTOM | BALL | 225 | 1mm | 30 | APA300 | 186 | 2.52.5/3.3V | 9kB | 现场可编程门阵列 | 73728 | 300000 | 180MHz | 8192 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
![]() | M1A3PE3000-2FG324I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 324-BGA | 221 | -40°C~100°C TJ | Tray | 2015 | ProASIC3E | e0 | 活跃 | 3 (168 Hours) | 324 | 锡铅银 | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 225 | 1mm | 30 | M1A3PE3000 | S-PBGA-B324 | 221 | 不合格 | 1.5/3.3V | 63kB | 350MHz | 221 | 现场可编程门阵列 | 516096 | 3000000 | 75264 | 75264 | 1.78mm | 19mm | 19mm | Non-RoHS Compliant | |||||||||||||||||||||||||
![]() | APA300-PQG208M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 158 | -55°C~125°C TC | Tray | 2007 | ProASICPLUS | 活跃 | 3 (168 Hours) | 208 | 3A001.A.2.C | 8542.39.00.01 | 2.5V | QUAD | 鸥翼 | 245 | 0.5mm | 180MHz | 40 | APA300 | 158 | 2.52.5/3.3V | 9kB | 现场可编程门阵列 | 73728 | 300000 | 8192 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||
![]() | A54SX72A-1FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 360 | -40°C~85°C TA | Tray | 2007 | SX-A | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 72000 TYPICAL GATES AVAILABLE | 2.5V | BOTTOM | BALL | 225 | 250MHz | 30 | A54SX72A | 360 | 2.53.3/5V | 1.3 ns | 1.3 ns | 现场可编程门阵列 | 6036 | 108000 | 1 | 4024 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||
![]() | AX500-2FG676I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 400.011771mg | 336 | -40°C~85°C TA | Tray | 2005 | Axcelerator | e0 | 活跃 | 3 (168 Hours) | 676 | 锡铅 | 1.5V | BOTTOM | BALL | 225 | 1mm | 870MHz | 30 | AX500 | 336 | 9kB | 740 ps | 740 ps | 现场可编程门阵列 | 73728 | 500000 | 8064 | 2 | 5376 | 0.74 ns | 1.73mm | 27mm | 27mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||
![]() | M1AFS1500-FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 119 | -40°C~100°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 85°C | -40°C | 1.5V | 1.0989GHz | M1AFS1500 | 33.8kB | 276480 | 1500000 | 1.0989GHz | 38400 | 1.575V | 1.425V | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
![]() | AFS1500-FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 119 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 260 | 1mm | 1.0989GHz | 40 | AFS1500 | 33.8kB | 现场可编程门阵列 | 276480 | 1500000 | 38400 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||
![]() | M1AFS1500-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 223 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 225 | 1mm | 1.0989GHz | 30 | M1AFS1500 | 33.8kB | 现场可编程门阵列 | 276480 | 1500000 | 38400 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
![]() | M1AFS1500-1FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 223 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 1.5V | BOTTOM | BALL | 225 | 30 | M1AFS1500 | 33.8kB | 现场可编程门阵列 | 276480 | 1500000 | 1.28205GHz | 1 | 38400 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
![]() | AFS1500-2FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 119 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.5V | BOTTOM | BALL | 260 | 1mm | 40 | AFS1500 | 33.8kB | 现场可编程门阵列 | 276480 | 1500000 | 1.47059GHz | 2 | 38400 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||
![]() | AFS1500-2FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 223 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.5V | BOTTOM | BALL | 250 | 1mm | 40 | AFS1500 | 33.8kB | 现场可编程门阵列 | 276480 | 1500000 | 1.47059GHz | 2 | 38400 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 |
AGLE600V2-FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGLE600V2-FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL050T-1FGG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL050T-1FG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX32A-TQG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL050-1FGG896I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1A3P1000L-FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL050T-1FG896I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX32A-FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX09-TQG176I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
AFS250-2FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX32A-TQG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1A3P1000L-1FG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1A3P1000L-FG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
APA300-FG256M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1A3PE3000-2FG324I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
APA300-PQG208M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX72A-1FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
AX500-2FG676I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1AFS1500-FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
AFS1500-FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1AFS1500-FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1AFS1500-1FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
AFS1500-2FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
AFS1500-2FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
