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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 内存大小 | 时钟频率 | 传播延迟 | 接通延迟时间 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | A3PE3000L-1FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 341 | -40°C~100°C TJ | Tray | 2009 | ProASIC3L | e0 | 活跃 | 3 (168 Hours) | 484 | 锡铅 | 1.14V~1.575V | BOTTOM | BALL | 225 | 1.2V | 30 | A3PE3000L | 341 | 1.2V | 63kB | 现场可编程门阵列 | 516096 | 3000000 | 892.86MHz | 1 | 75264 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||
 | A3PE3000L-1FGG896I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 620 | -40°C~100°C TJ | Tray | 2009 | ProASIC3L | e1 | 活跃 | 3 (168 Hours) | 896 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.14V~1.575V | BOTTOM | BALL | 250 | 1.2V | 40 | A3PE3000L | 620 | 1.2V | 25mA | 63kB | 现场可编程门阵列 | 516096 | 3000000 | 892.86MHz | 1 | 75264 | 1.73mm | 31mm | 31mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
 | MPF500TS-1FCG784I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 784-BBGA, FCBGA | 784-FCBGA (29x29) | 388 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 481000 | 33792000 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| A3PE3000L-FG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 341 | -55°C~125°C TJ | Tray | 2009 | ProASIC3L | e0 | 活跃 | 3 (168 Hours) | 484 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.2V | 1mm | 30 | A3PE3000L | 341 | 1.5V | 1.2/1.51.2/3.3V | 63kB | 现场可编程门阵列 | 516096 | 3000000 | 75264 | 2.44mm | 23mm | 23mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||
 | A3PE3000L-1FGG484M | Microsemi Corporation | 数据表 | 200 In Stock | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 341 | -55°C~125°C TJ | Tray | 2009 | ProASIC3L | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.2V | 40 | A3PE3000L | 341 | 1.5V | 63kB | 250MHz | 现场可编程门阵列 | 516096 | 3000000 | 1 | 75264 | 2.44mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||
 | AGL060V2-CSG121 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 121-VFBGA, CSBGA | 121 | 121-CSP (6x6) | 96 | 0°C~70°C TA | Tray | IGLOO | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | AGL060 | 1.5V | 1.575V | 1.14V | 2.3kB | 2.3kB | 1536 | 18432 | 60000 | 892.86MHz | 990μm | 6mm | 6mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
 | AGL250V2-VQG100 | Microsemi Corporation | 数据表 | 435 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Tin | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 100-VQFP (14x14) | 68 | 0°C~70°C TA | Tray | 2009 | IGLOO | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | AGL250 | 1.5V | 1.575V | 1.14V | 4.5kB | 4.5kB | 6144 | 36864 | 250000 | 892.86MHz | 1mm | 14mm | 14mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||
 | AGL1000V5-FGG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 97 | 0°C~70°C TA | Tray | 2009 | IGLOO | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | AGL1000 | 1.5V | 1.575V | 1.425V | 18kB | 24576 | 147456 | 1000000 | 892.86MHz | 1.05mm | 13mm | 13mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
 | A3PE3000L-PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 147 | -40°C~100°C TJ | Tray | 2009 | ProASIC3L | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 8542.39.00.01 | 1.14V~1.575V | QUAD | 鸥翼 | 245 | 1.2V | 0.5mm | 40 | A3PE3000L | 147 | 1.2V | 1.2/1.51.2/3.3V | 63kB | 现场可编程门阵列 | 516096 | 3000000 | 781.25MHz | 75264 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||
| AX2000-1FG1152 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 1152-BGA | 1152 | 400.011771mg | 684 | 0°C~70°C TA | Tray | 2005 | Axcelerator | Obsolete | 3 (168 Hours) | TIN LEAD/TIN LEAD SILVER | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 763MHz | 20 | AX2000 | 684 | 1.5V | 36kB | 850 ps | 850 ps | 现场可编程门阵列 | 294912 | 2000000 | 32256 | 1 | 21504 | 0.84 ns | 1.73mm | 35mm | 35mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||
 | A3PE600-2PQ208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 147 | 0°C~85°C TJ | Tray | 2009 | ProASIC3E | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | A3PE600 | 1.5V | 1.575V | 1.425V | 13.5kB | 110592 | 600000 | 310MHz | 2 | 13824 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
| A3P600L-PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 154 | -40°C~100°C TJ | Tray | ProASIC3L | e3 | Obsolete | 3 (168 Hours) | 208 | 哑光锡 | 8542.39.00.01 | 1.14V~1.575V | QUAD | 鸥翼 | 245 | 1.2V | 0.5mm | 40 | A3P600L | 154 | 1.2V | 1.5/3.3V | 13.5kB | 45mA | 13.5kB | 现场可编程门阵列 | 6500 | 110592 | 600000 | 781.25MHz | 13824 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
| AFS600-PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 95 | 0°C~85°C TJ | Tray | 2013 | Fusion® | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 1.0989GHz | AFS600 | 1.5V | 1.575V | 1.425V | 13.5kB | 13.5kB | 110592 | 600000 | 350MHz | 13824 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
 | AX2000-2FG1152 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 1152-BGA | 1152 | 1152-FPBGA (35x35) | 400.011771mg | 684 | 0°C~70°C TA | Tray | 2005 | Axcelerator | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 870MHz | AX2000 | 1.5V | 1.575V | 1.425V | 36kB | 740 ps | 740 ps | 21504 | 294912 | 2000000 | 870MHz | 32256 | 21504 | 2 | 21504 | 1.73mm | 35mm | 35mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||
| A42MX36-1PQ208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 176 | 0°C~70°C TA | Tray | 2009 | MX | Obsolete | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | A42MX36 | 5V | 5.25V | 3V | 320B | 1184 | 2560 | 54000 | 151MHz | 1184 | 1 | 1822 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
| A42MX36-2PQ208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 176 | 0°C~70°C TA | Tray | MX | Obsolete | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | A42MX36 | 5V | 5.25V | 3V | 320B | 1184 | 2560 | 54000 | 164MHz | 1184 | 2 | 1822 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| A42MX36-3PQ208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 176 | 0°C~70°C TA | Tray | MX | Obsolete | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | A42MX36 | 5V | 5.25V | 3V | 320B | 1184 | 2560 | 54000 | 180MHz | 1184 | 3 | 1822 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| A42MX36-FPQ208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 176 | 0°C~70°C TA | Tray | 2009 | MX | Obsolete | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | A42MX36 | 5V | 5.25V | 3V | 320B | 1184 | 2560 | 54000 | 79MHz | 1184 | 1822 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| AGL600V2-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 400.011771mg | 235 | -40°C~85°C TA | Tray | IGLOO | e0 | Obsolete | 3 (168 Hours) | 484 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 230 | 1.2V | 1mm | 30 | AGL600 | S-PBGA-B484 | 不合格 | 1.5V | 13.5kB | 现场可编程门阵列 | 13824 | 110592 | 600000 | 892.86MHz | 1.73mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| AGL600V2-FGG484I | Microsemi Corporation | 数据表 | 2957 In Stock | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 400.011771mg | 235 | -40°C~85°C TA | Tray | 2015 | IGLOO | e1 | Obsolete | 3 (168 Hours) | 484 | 锡银铜 | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | AGL600 | S-PBGA-B484 | 不合格 | 1.5V | 13.5kB | 现场可编程门阵列 | 13824 | 110592 | 600000 | 892.86MHz | 1.73mm | 23mm | 23mm | 符合RoHS标准 | ||||||||||||||||||||||||||
 | A3P125-2TQ144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 144-TQFP (20x20) | 1.319103g | 100 | 0°C~85°C TJ | Tray | ProASIC3 | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | A3P125 | 1.5V | 1.575V | 1.425V | 4.5kB | 36864 | 125000 | 310MHz | 2 | 3072 | 1.4mm | 20mm | 20mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
| A3P060-1TQ144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 1.319103g | 91 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e0 | Obsolete | 3 (168 Hours) | 144 | Tin/Lead (Sn/Pb) | 1.425V~1.575V | QUAD | 鸥翼 | 225 | 1.5V | 0.5mm | 30 | A3P060 | 1.5V | 2.3kB | 现场可编程门阵列 | 18432 | 60000 | 272MHz | 1 | 1536 | 1.4mm | 20mm | 20mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||
| A3P250-1PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 151 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e0 | Obsolete | 3 (168 Hours) | 208 | Tin/Lead (Sn/Pb) | 1.425V~1.575V | QUAD | 鸥翼 | 225 | 1.5V | 0.5mm | 30 | A3P250 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 272MHz | 1 | 6144 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| AFS090-2FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 75 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e1 | Obsolete | 3 (168 Hours) | 256 | 锡银铜 | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | AFS090 | 1.5V | 3.4kB | 现场可编程门阵列 | 27648 | 90000 | 1.47059GHz | 2 | 2304 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||
 | APA600-FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 186 | -40°C~85°C TA | Tray | 2000 | ProASICPLUS | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 2.3V~2.7V | BOTTOM | BALL | 250 | 2.5V | 1mm | 180MHz | 30 | APA600 | 186 | 2.5V | 2.52.5/3.3V | 15.8kB | 现场可编程门阵列 | 129024 | 600000 | 21504 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 |
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A3PE3000L-1FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE3000L-1FGG896I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF500TS-1FCG784I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE3000L-FG484M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE3000L-1FGG484M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL060V2-CSG121
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL250V2-VQG100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL1000V5-FGG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE3000L-PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX2000-1FG1152
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE600-2PQ208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P600L-PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS600-PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX2000-2FG1152
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX36-1PQ208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX36-2PQ208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX36-3PQ208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX36-FPQ208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL600V2-FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL600V2-FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P125-2TQ144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P060-1TQ144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250-1PQ208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS090-2FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA600-FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)