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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 内存大小 | 电流源 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | 速度等级 | 寄存器数量 | 电压 - 供电 （最大值） | 电压 - 供电 （最小值） | 高度 | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | M7A3P1000-1FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2008 | ProASIC3 | e0 | 不用于新设计 | 3 (168 Hours) | 144 | Tin/Lead/Silver (Sn/Pb/Ag) | 1.5V | BOTTOM | BALL | 225 | 272MHz | 30 | M7A3P1000 | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 1 | 24576 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | ||||||||||||||||||
 | M7A3P1000-FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | -40°C~100°C TJ | Tray | 2000 | ProASIC3 | 不用于新设计 | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 225 | 1mm | 30 | M7A3P1000 | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 231MHz | 24576 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | ||||||||||||||||||
 | M7A3P1000-2FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 300 | 0°C~85°C TJ | Tray | 2008 | ProASIC3 | e0 | 不用于新设计 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 1.5V | BOTTOM | BALL | 225 | 1mm | 30 | M7A3P1000 | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 310MHz | 2 | 24576 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | |||||||||||||||||
| M7A3P1000-2FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2008 | ProASIC3 | e0 | 不用于新设计 | 3 (168 Hours) | 144 | Tin/Lead/Silver (Sn/Pb/Ag) | 1.5V | BOTTOM | BALL | 225 | 1mm | 310MHz | 30 | M7A3P1000 | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 2 | 24576 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | |||||||||||||||||
| M7A3P1000-1FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | -40°C~100°C TJ | Tray | 2008 | ProASIC3 | 不用于新设计 | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 1.5V | BOTTOM | BALL | 225 | 30 | M7A3P1000 | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 272MHz | 1 | 24576 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | |||||||||||||||||||
| M7A3P1000-1FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | -40°C~100°C TJ | Tray | 2008 | ProASIC3 | e1 | 不用于新设计 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.5V | BOTTOM | BALL | 260 | 272MHz | 40 | M7A3P1000 | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 1 | 24576 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||
| M7A3P1000-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 300 | -40°C~100°C TJ | Tray | 2008 | ProASIC3 | e0 | 不用于新设计 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 225 | 1mm | 30 | M7A3P1000 | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 231MHz | 24576 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | |||||||||||||||||
| M7A3P1000-2FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | -40°C~100°C TJ | Tray | 2008 | ProASIC3 | 不用于新设计 | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 1.5V | BOTTOM | BALL | 225 | 1mm | 30 | M7A3P1000 | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 310MHz | 2 | 24576 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | ||||||||||||||||||
| M7A3P1000-1FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 300 | -40°C~100°C TJ | Tray | 2008 | ProASIC3 | e0 | 不用于新设计 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 1.5V | BOTTOM | BALL | 225 | 30 | M7A3P1000 | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 272MHz | 1 | 24576 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | ||||||||||||||||||
| AGL600V2-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 400.011771mg | 235 | -40°C~85°C TA | Tray | IGLOO | e0 | Obsolete | 3 (168 Hours) | 484 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 230 | 1mm | 30 | AGL600 | S-PBGA-B484 | 不合格 | 13.5kB | 现场可编程门阵列 | 13824 | 110592 | 600000 | 892.86MHz | 1.73mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||
 | AGL600V2-FGG484I | Microsemi Corporation | 数据表 | 2957 In Stock | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 400.011771mg | 235 | -40°C~85°C TA | Tray | 2015 | IGLOO | e1 | Obsolete | 3 (168 Hours) | 484 | 锡银铜 | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 260 | 1mm | 40 | AGL600 | S-PBGA-B484 | 不合格 | 13.5kB | 现场可编程门阵列 | 13824 | 110592 | 600000 | 892.86MHz | 1.73mm | 23mm | 23mm | 符合RoHS标准 | ||||||||||||||||
 | A3P125-2TQ144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 144-TQFP (20x20) | 1.319103g | 100 | 0°C~85°C TJ | Tray | ProASIC3 | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.5V | A3P125 | 4.5kB | 36864 | 125000 | 310MHz | 2 | 3072 | 1.575V | 1.425V | 1.4mm | 20mm | 20mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||
| A3P060-1TQ144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 1.319103g | 91 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e0 | Obsolete | 3 (168 Hours) | 144 | Tin/Lead (Sn/Pb) | 1.5V | QUAD | 鸥翼 | 225 | 0.5mm | 30 | A3P060 | 2.3kB | 现场可编程门阵列 | 18432 | 60000 | 272MHz | 1 | 1536 | 1.4mm | 20mm | 20mm | 无 | Non-RoHS Compliant | |||||||||||||||||
 | A3P250-1PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 151 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e0 | Obsolete | 3 (168 Hours) | 208 | Tin/Lead (Sn/Pb) | 1.5V | QUAD | 鸥翼 | 225 | 0.5mm | 30 | A3P250 | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 272MHz | 1 | 6144 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | ||||||||||||||||||
| AFS090-2FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 75 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e1 | Obsolete | 3 (168 Hours) | 256 | 锡银铜 | 1.5V | BOTTOM | BALL | 260 | 1mm | 40 | AFS090 | 3.4kB | 现场可编程门阵列 | 27648 | 90000 | 1.47059GHz | 2 | 2304 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||
| APA600-FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 186 | -40°C~85°C TA | Tray | 2000 | ProASICPLUS | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 2.5V | BOTTOM | BALL | 250 | 1mm | 180MHz | 30 | APA600 | 186 | 2.52.5/3.3V | 15.8kB | 现场可编程门阵列 | 129024 | 600000 | 21504 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||
| A3P600L-1FG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 177 | 0°C~85°C TJ | Tray | 2009 | ProASIC3L | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.2V | A3P600L | 13.5kB | 5mA | 110592 | 600000 | 892.86MHz | 1 | 13824 | 1.26V | 1.14V | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||
| A3P600L-1FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 177 | 0°C~85°C TJ | Tray | 2009 | ProASIC3L | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | A3P600L | 13.5kB | 5mA | 110592 | 600000 | 892.86MHz | 1 | 13824 | 1.26V | 1.14V | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||
 | A3P250L-FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 157 | 0°C~85°C TJ | Tray | 2009 | ProASIC3L | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.2V | A3P250L | 4.5kB | 36864 | 250000 | 781.25MHz | 6144 | 1.26V | 1.14V | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||
 | AFS090-FGG256 | Microsemi Corporation | 数据表 | 100 In Stock | - | 最小起订量: 1 最小包装量: 1 | 2 Weeks | LIMITED TIME BUY (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 75 | 0°C~85°C TJ | Tray | 2009 | Fusion® | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.5V | 1.0989GHz | AFS090 | 3.4kB | 27648 | 90000 | 1.0989GHz | 2304 | 1.575V | 1.425V | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||
 | A3P250L-1FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2009 | ProASIC3L | e1 | Obsolete | 3 (168 Hours) | 144 | 锡银铜 | 1.2V | BOTTOM | BALL | 260 | 40 | A3P250L | 97 | 4.5kB | 3mA | 现场可编程门阵列 | 36864 | 250000 | 892.86MHz | 1 | 6144 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | ||||||||||||||||
| A3P125-1PQ208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 133 | 0°C~85°C TJ | Tray | 2012 | ProASIC3 | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.5V | A3P125 | 4.5kB | 36864 | 125000 | 272MHz | 1 | 3072 | 1.575V | 1.425V | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||
| AGL400V5-FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~85°C TA | Tray | 2013 | IGLOO | e0 | Obsolete | 3 (168 Hours) | 144 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 230 | 1mm | 30 | AGL400 | 不合格 | 6.8kB | 27μA | 现场可编程门阵列 | 9216 | 55296 | 400000 | 250MHz | 1.05mm | 13mm | 13mm | Non-RoHS Compliant | ||||||||||||||||
| AGL1000V2-FG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 97 | 0°C~70°C TA | Tray | 2013 | IGLOO | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | AGL1000 | 18kB | 24576 | 147456 | 1000000 | 892.86MHz | 1.575V | 1.14V | 1.05mm | 13mm | 13mm | Non-RoHS Compliant | ||||||||||||||||||||||||
| AGL400V2-FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~85°C TA | Tray | 2009 | IGLOO | e0 | Obsolete | 3 (168 Hours) | 144 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 230 | 1mm | 30 | AGL400 | 6.8kB | 27μA | 现场可编程门阵列 | 9216 | 55296 | 400000 | 250MHz | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant |
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M7A3P1000-1FG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7A3P1000-FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7A3P1000-2FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7A3P1000-2FG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7A3P1000-1FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7A3P1000-1FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7A3P1000-FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7A3P1000-2FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7A3P1000-1FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL600V2-FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL600V2-FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P125-2TQ144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P060-1TQ144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250-1PQ208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS090-2FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA600-FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P600L-1FG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P600L-1FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250L-FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS090-FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250L-1FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P125-1PQ208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL400V5-FG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL1000V2-FG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL400V2-FG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)