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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 输出的数量 | 资历状况 | 电源 | 内存大小 | 传播延迟 | 接通延迟时间 | 电流源 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | 逻辑块数量 | 逻辑单元数 | 电压 - 供电 （最大值） | 电压 - 供电 （最小值） | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | M1AGL600V5-CS281 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 281-TFBGA, CSBGA | 281 | 281-CSP (10x10) | 215 | 0°C~70°C TA | Tray | 2016 | IGLOO | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1AGL600 | 13.5kB | 13824 | 110592 | 600000 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
| M1AGL600V2-CS281 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 281-TFBGA, CSBGA | 281 | 281-CSP (10x10) | 215 | 0°C~70°C TA | Tray | 2016 | IGLOO | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | M1AGL600 | 13.5kB | 13824 | 110592 | 600000 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
 | M1AGL1000V2-FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 300 | 0°C~70°C TA | Tray | 2010 | IGLOO | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | M1AGL1000 | 18kB | 24576 | 147456 | 1000000 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
 | M2GL060T-1FGG676I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 676-BGA | 676-FBGA (27x27) | 387 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 1.14V~2.625V | 56520 | 1869824 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||
 | M2GL025T-1FGG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 267 | -55°C~125°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 1.14V~2.625V | 27696 | 1130496 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||
 | M1A3P1000-1PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 154 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e0 | Obsolete | 3 (168 Hours) | 208 | Tin/Lead (Sn/Pb) | 1.5V | QUAD | 鸥翼 | 225 | 0.5mm | 272MHz | 30 | M1A3P1000 | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 1 | 24576 | 28mm | 28mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||
 | M1AGLE3000V5-FGG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 620 | 0°C~70°C TA | Tray | 2012 | IGLOOe | e1 | Obsolete | 3 (168 Hours) | 896 | 锡银铜 | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 245 | 30 | M1AGLE3000 | 63kB | 现场可编程门阵列 | 75264 | 516096 | 3000000 | 892.86MHz | 1.73mm | 31mm | 31mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
 | AGLE3000V5-FG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 896-FBGA (31x31) | 400.011771mg | 620 | 0°C~70°C TA | Tray | IGLOOe | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.5V | AGLE3000 | 63kB | 75264 | 516096 | 3000000 | 892.86MHz | 75264 | 1.575V | 1.425V | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| M1AGLE3000V2-FG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 620 | 0°C~70°C TA | Tray | IGLOOe | e0 | Obsolete | 3 (168 Hours) | 896 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 225 | 20 | M1AGLE3000 | 63kB | 现场可编程门阵列 | 75264 | 516096 | 3000000 | 892.86MHz | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||
| M1AGLE3000V2-FG896I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 620 | -40°C~85°C TA | Tray | 2012 | IGLOOe | e0 | Obsolete | 3 (168 Hours) | 896 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 225 | 20 | M1AGLE3000 | 63kB | 现场可编程门阵列 | 75264 | 516096 | 3000000 | 892.86MHz | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||
| AGLE3000V2-FGG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 896-FBGA (31x31) | 400.011771mg | 620 | 0°C~70°C TA | Tray | 2012 | IGLOOe | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.5V | AGLE3000 | 63kB | 75264 | 516096 | 3000000 | 892.86MHz | 75264 | 1.575V | 1.14V | 1.73mm | 31mm | 31mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||
| AX1000-2FG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 896-FBGA (31x31) | 400.011771mg | 516 | 0°C~70°C TA | Tray | 2012 | Axcelerator | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.5V | 870MHz | AX1000 | 20.3kB | 740 ps | 740 ps | 12096 | 165888 | 1000000 | 870MHz | 18144 | 12096 | 2 | 12096 | 1.575V | 1.425V | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||
| A3P400-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 194 | 0°C~85°C TJ | Tray | 2008 | ProASIC3 | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.5V | A3P400 | 6.8kB | 55296 | 400000 | 272MHz | 1 | 9216 | 1.575V | 1.425V | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||
 | A54SX32A-TQG176I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 176-LQFP | 176 | 176-TQFP (24x24) | 147 | -40°C~85°C TA | Tray | 2007 | SX-A | Obsolete | 3 (168 Hours) | 85°C | -40°C | 2.5V | 238MHz | A54SX32A | 1.2 ns | 1.2 ns | 2880 | 48000 | 238MHz | 2880 | 2880 | 1980 | 2.75V | 2.25V | 1.4mm | 24mm | 24mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||
| M1A3P400-1FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 194 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e0 | Obsolete | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 225 | 1mm | 30 | M1A3P400 | 不合格 | 6.8kB | 现场可编程门阵列 | 55296 | 400000 | 9216 | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | |||||||||||||||||||||||||
| M1A3P400-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 194 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e0 | Obsolete | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 225 | 1mm | 30 | M1A3P400 | 不合格 | 6.8kB | 现场可编程门阵列 | 55296 | 400000 | 9216 | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | |||||||||||||||||||||||||
| A3P400-1FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 194 | -40°C~100°C TJ | Tray | 2008 | ProASIC3 | e1 | Obsolete | 3 (168 Hours) | 484 | 锡银铜 | 1.5V | BOTTOM | BALL | 250 | 40 | A3P400 | 6.8kB | 现场可编程门阵列 | 55296 | 400000 | 272MHz | 1 | 9216 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
| A3P250L-1PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 151 | -40°C~100°C TJ | Tray | 2009 | ProASIC3L | e3 | Obsolete | 3 (168 Hours) | 208 | 哑光锡 | 1.2V | QUAD | 鸥翼 | 245 | 0.5mm | 40 | A3P250L | 151 | 4.5kB | 3mA | 现场可编程门阵列 | 36864 | 250000 | 892.86MHz | 1 | 6144 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||
| M1AFS250-PQ208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 93 | 0°C~85°C TJ | Tray | Fusion® | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.5V | 1.0989GHz | M1AFS250 | 4.5kB | 36864 | 250000 | 1.0989GHz | 6144 | 1.575V | 1.425V | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
| M1A3P400-1PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 151 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e0 | Obsolete | 3 (168 Hours) | 208 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.5V | QUAD | 鸥翼 | 225 | 0.5mm | 30 | M1A3P400 | 不合格 | 6.8kB | 现场可编程门阵列 | 55296 | 400000 | 9216 | 4.1mm | 28mm | 28mm | Non-RoHS Compliant | |||||||||||||||||||||||||
| AGLP060V5-VQ176I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 176-TQFP | 176 | 176-VQFP (20x20) | 137 | -40°C~100°C TJ | Tray | 2015 | IGLOO PLUS | Obsolete | 3 (168 Hours) | 85°C | -40°C | 1.5V | AGLP060 | 2.3kB | 20μA | 1584 | 18432 | 60000 | 892.86MHz | 512 | 1584 | 1.575V | 1.425V | 20mm | 20mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||
 | A1020B-PL84I | Microsemi Corporation | 数据表 | 1072 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 84-LCC (J-Lead) | 84 | 69 | -40°C~85°C TA | Tray | 1997 | ACT™ 1 | e0 | Obsolete | 3 (168 Hours) | 84 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 5V | QUAD | J BEND | 225 | 1.27mm | 48MHz | 30 | A1020 | 69 | 5V | 4.5 ns | 4.5 ns | 现场可编程门阵列 | 547 | 2000 | 273 | 547 | 547 | 4.572mm | 29.3116mm | 29.3116mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||
| M1A3P1000L-1PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 154 | -40°C~100°C TJ | Tray | ProASIC3L | e3 | Obsolete | 3 (168 Hours) | 208 | 哑光锡 | 1.14V~1.575V | QUAD | 鸥翼 | 245 | 0.5mm | 40 | M1A3P1000L | 154 | 18kB | 8mA | 现场可编程门阵列 | 147456 | 1000000 | 892.86MHz | 1 | 24576 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||
| M1AFS600-PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 95 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e0 | Obsolete | 3 (168 Hours) | 208 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.5V | QUAD | FLAT | 225 | 0.5mm | 1.0989GHz | 30 | M1AFS600 | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 13824 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||
| AFS600-PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 95 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e3 | Obsolete | 3 (168 Hours) | 208 | 哑光锡 | 8542.39.00.01 | 1.5V | QUAD | FLAT | 245 | 0.5mm | 1.0989GHz | 40 | AFS600 | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 13824 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 |
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M1AGL600V5-CS281
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AGL600V2-CS281
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AGL1000V2-FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060T-1FGG676I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025T-1FGG484M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000-1PQ208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AGLE3000V5-FGG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLE3000V5-FG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AGLE3000V2-FG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AGLE3000V2-FG896I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLE3000V2-FGG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX1000-2FG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P400-1FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A54SX32A-TQG176I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P400-1FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P400-FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P400-1FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250L-1PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS250-PQ208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P400-1PQ208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLP060V5-VQ176I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A1020B-PL84I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000L-1PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS600-PQ208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS600-PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)