品牌是'Microsemi' (760)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 连接方式 | 数据率 | 建筑学 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 核心架构 | 阀门数量 | 最高频率 | 逻辑块数(LABs) | 速度等级 | 主要属性 | 寄存器数量 | 逻辑单元数 | 等效门数 | 闪光大小 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | M2S060TS-1FGG676I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 676-BGA | YES | 387 | -40°C~100°C TJ | Tray | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 676 | 哑光锡 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 1mm | 未说明 | S-PBGA-B676 | 387 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 387 | 现场可编程门阵列 | FPGA - 60K Logic Modules | 56520 | 256KB | 2.44mm | 27mm | 27mm | 符合RoHS标准 | |||||||||||||||||||||||||||
![]() | M2S150T-1FCVG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BFBGA | YES | 273 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 484 | 哑光锡 | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | 未说明 | S-PBGA-B484 | 273 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 273 | 现场可编程门阵列 | FPGA - 150K Logic Modules | 146124 | 512KB | 3.15mm | 19mm | 19mm | 符合RoHS标准 | |||||||||||||||||||||||||
![]() | M2S150-1FCS536I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 536-LFBGA, CSPBGA | YES | 293 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 536 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | not_compliant | 未说明 | S-PBGA-B536 | 293 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 293 | 现场可编程门阵列 | FPGA - 150K Logic Modules | 146124 | 512KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||
![]() | M2S050TS-1FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | 484-FPBGA (23x23) | 267 | -40°C~100°C TJ | Tray | SmartFusion®2 | 活跃 | 3 (168 Hours) | 100°C | -40°C | 166MHz | M2S050TS | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 50K Logic Modules | 256KB | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||
![]() | A2F500M3G-FGG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 484-BGA | MCU - 41, FPGA - 128 | -55°C~125°C TJ | Tray | SmartFusion® | 活跃 | 3 (168 Hours) | 8542.39.00.01 | 80MHz | A2F500M3G | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150T-FC1152I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 1152-BBGA, FCBGA | YES | 574 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 1mm | not_compliant | 未说明 | S-PBGA-B1152 | 574 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 574 | 现场可编程门阵列 | FPGA - 150K Logic Modules | 146124 | 512KB | 2.9mm | 35mm | 35mm | Non-RoHS Compliant | ||||||||||||||||||||||||||
![]() | M2S150-1FCSG536I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 536-LFBGA, CSPBGA | YES | 293 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 536 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 未说明 | S-PBGA-B536 | 293 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 293 | 现场可编程门阵列 | FPGA - 150K Logic Modules | 146124 | 512KB | 符合RoHS标准 | ||||||||||||||||||||||||||||||
![]() | M2S150-FCS536I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 536-LFBGA, CSPBGA | YES | 293 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 536 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | not_compliant | 未说明 | S-PBGA-B536 | 293 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 293 | 现场可编程门阵列 | FPGA - 150K Logic Modules | 146124 | 512KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||
![]() | A2F500M3G-1FGG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 484-BGA | MCU - 41, FPGA - 128 | -55°C~125°C TJ | Tray | SmartFusion® | 活跃 | 3 (168 Hours) | 8542.39.00.01 | 100MHz | A2F500M3G | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S005-TQ144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | OBSOLETE (Last Updated: 1 month ago) | 144-LQFP | YES | 84 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Obsolete | 3 (168 Hours) | 144 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 鸥翼 | 未说明 | 1.2V | 0.5mm | not_compliant | 未说明 | S-PQFP-G144 | 84 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 84 | 现场可编程门阵列 | FPGA - 5K Logic Modules | 6060 | 128KB | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | |||||||||||||||||||||||||
![]() | M2S010-1TQ144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 144-LQFP | YES | 144 | 84 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Obsolete | 3 (168 Hours) | 144 | Tin/Lead (Sn/Pb) | QUAD | 鸥翼 | 未说明 | 1.2V | 0.5mm | not_compliant | 未说明 | 84 | 不合格 | 1.2V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 现场可编程门阵列 | 1 | FPGA - 10K Logic Modules | 256KB | 20mm | 20mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
![]() | M2S060T-1FGG676 | Microsemi Corporation | 数据表 | 2 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 676-BGA | YES | 387 | 0°C~85°C TJ | Tray | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 676 | 哑光锡 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 1mm | 未说明 | S-PBGA-B676 | 387 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 387 | 现场可编程门阵列 | FPGA - 60K Logic Modules | 56520 | 256KB | 2.44mm | 27mm | 27mm | 符合RoHS标准 | |||||||||||||||||||||||||||
![]() | M2S025TS-1FGG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 484-BGA | YES | 267 | -55°C~125°C TJ | Tray | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 484 | 哑光锡 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 1mm | 未说明 | S-PBGA-B484 | 267 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | 现场可编程门阵列 | FPGA - 25K Logic Modules | 27696 | 256KB | 2.44mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||||||||||
![]() | M2S005-TQ144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | OBSOLETE (Last Updated: 1 month ago) | 144-LQFP | YES | 84 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Obsolete | 3 (168 Hours) | 144 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 鸥翼 | 未说明 | 1.2V | 0.5mm | not_compliant | 未说明 | S-PQFP-G144 | 84 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 84 | 现场可编程门阵列 | FPGA - 5K Logic Modules | 6060 | 128KB | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | |||||||||||||||||||||||||
![]() | M2S005S-1TQ144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 144-LQFP | YES | 84 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Obsolete | 3 (168 Hours) | 144 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 鸥翼 | 未说明 | 1.2V | 0.5mm | not_compliant | 未说明 | S-PQFP-G144 | 84 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 84 | 现场可编程门阵列 | FPGA - 5K Logic Modules | 6060 | 128KB | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | ||||||||||||||||||||||||||
![]() | M2S010-1TQ144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 144-LQFP | YES | 144 | 84 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Obsolete | 3 (168 Hours) | 144 | Tin/Lead (Sn/Pb) | QUAD | 鸥翼 | 未说明 | 1.2V | 0.5mm | not_compliant | 未说明 | 84 | 不合格 | 1.2V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 现场可编程门阵列 | 1 | FPGA - 10K Logic Modules | 256KB | 20mm | 20mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
![]() | M2S005S-TQ144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 144-LQFP | YES | 84 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Obsolete | 3 (168 Hours) | 144 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 鸥翼 | 未说明 | 1.2V | 0.5mm | not_compliant | 未说明 | S-PQFP-G144 | 84 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 84 | 现场可编程门阵列 | FPGA - 5K Logic Modules | 6060 | 128KB | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | ||||||||||||||||||||||||||
![]() | M2S005S-FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | YES | 209 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 1mm | not_compliant | 未说明 | S-PBGA-B484 | 209 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 209 | 现场可编程门阵列 | FPGA - 5K Logic Modules | 6060 | 128KB | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | |||||||||||||||||||||||||
![]() | M2S005-1VFG400 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | 400 | 400-VFBGA (17x17) | 169 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | 活跃 | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S005 | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 5K Logic Modules | 128KB | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||
![]() | A2F200M3F-CSG288 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 288-TFBGA, CSPBGA | 288-CSP (11x11) | MCU - 31, FPGA - 78 | 0°C~85°C TJ | Tray | 2015 | SmartFusion® | 活跃 | 3 (168 Hours) | 85°C | 0°C | 80MHz | A2F200 | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||
![]() | A2F060M3E-1TQ144 | Microsemi Corporation | 数据表 | 835 In Stock | - | 最小起订量: 1 最小包装量: 1 | 144-LQFP | 144-TQFP (20x20) | MCU - 21, FPGA - 33 | 0°C~85°C TJ | Tray | 2015 | SmartFusion® | Obsolete | 3 (168 Hours) | 85°C | 0°C | 100MHz | A2F060M3E | EBI/EMI, I2C, SPI, UART, USART | 100MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F060M3E-1TQG144I | Microsemi Corporation | 数据表 | 838 In Stock | - | 最小起订量: 1 最小包装量: 1 | 144-LQFP | 144-TQFP (20x20) | MCU - 21, FPGA - 33 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | Obsolete | 3 (168 Hours) | 100°C | -40°C | 100MHz | A2F060M3E | EBI/EMI, I2C, SPI, UART, USART | 100MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F060M3E-1FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 256-LBGA | YES | 256 | MCU - 26, FPGA - 66 | -40°C~100°C TJ | Tray | 2009 | SmartFusion® | e0 | Obsolete | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 225 | 1.5V | 100MHz | 20 | A2F060M3E | 66 | 1.5V | EBI/EMI, I2C, SPI, UART, USART | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | 现场可编程门阵列 | ARM | 8 | 1 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 1536 | 60000 | 128KB | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
![]() | A2F060M3E-FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 256-LBGA | 256 | 256-FPBGA (17x17) | MCU - 26, FPGA - 66 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | Obsolete | 3 (168 Hours) | 100°C | -40°C | 80MHz | A2F060M3E | 1.5V | EBI/EMI, I2C, SPI, UART, USART | 1.575V | 1.425V | 4.5kB | 3mA | 80MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | 400 kbps | MCU, FPGA | 660 | ARM | 60000 | 100MHz | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
![]() | M2S005-1TQ144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 144-LQFP | YES | 84 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Obsolete | 3 (168 Hours) | 144 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 鸥翼 | 未说明 | 1.2V | 0.5mm | not_compliant | 未说明 | S-PQFP-G144 | 84 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 84 | 现场可编程门阵列 | FPGA - 5K Logic Modules | 6060 | 128KB | 1.6mm | 20mm | 20mm | Non-RoHS Compliant |
M2S060TS-1FGG676I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S150T-1FCVG484
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S150-1FCS536I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S050TS-1FGG484I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
A2F500M3G-FGG484M
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S150T-FC1152I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S150-1FCSG536I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S150-FCS536I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
A2F500M3G-1FGG484M
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S005-TQ144I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S010-1TQ144I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S060T-1FGG676
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S025TS-1FGG484M
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S005-TQ144
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S005S-1TQ144
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S010-1TQ144
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S005S-TQ144I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S005S-FG484
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S005-1VFG400
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
A2F200M3F-CSG288
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
A2F060M3E-1TQ144
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
A2F060M3E-1TQG144I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
A2F060M3E-1FG256I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
A2F060M3E-FGG256I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S005-1TQ144
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
