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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | 核心架构 | EEPROM 大小 | 片上程序 ROM 宽度 | 处理器系列 | 筛选水平 | 外部数据总线宽度 | 以太网 | USB | SPI,SPI | CAN | ADC Channels | 设备核心 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |||||||||||||||||||||||||||||||||||||
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 | S912XEQ512F1CAG | NXP USA Inc. | 数据表 | 4200 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 144-LQFP | 119 | A/D 24x12b | -40°C~85°C TA | Tray | 1996 | HCS12X | 活跃 | 3 (168 Hours) | External | 50MHz | 32K x 8 | 1.72V~5.5V | LVD, POR, PWM, WDT | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 4K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S912ZVMBA6F0WLFR | NXP USA Inc. | 数据表 | 23 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 48-LQFP | 15 | A/D 5x10b | -40°C~150°C TA | Tape & Reel (TR) | 2015 | S12 MagniV | 活跃 | 3 (168 Hours) | Internal | 32MHz | 4K x 8 | 3.5V~40V | MICROCONTROLLER | S12Z | DMA, LVD, POR, PWM, WDT | FLASH | 16-Bit | 64KB 64K x 8 | LINbus, SCI, SPI | 512 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC56F82723VFM | NXP USA Inc. | 数据表 | 1200 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 32-VFQFN Exposed Pad | YES | 26 | 32768 | A/D 6x12b; D/A 2x12b | -40°C~105°C TA | Tray | 2002 | 56F8xxx | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | 8542.31.00.01 | QUAD | 无铅 | 260 | 3.3V | 0.5mm | 40 | MC56F82723 | S-XQCC-N32 | 不合格 | 3.6V | 3.3V | 2.7V | Internal | 100MHz | 3K x 16 | 2.7V~3.6V | MICROCONTROLLER | 56800EX | DMA, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 32KB 16K x 16 | I2C, SCI, SPI | 32 | YES | YES | YES | YES | 5mm | 5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MK50DX256CMC7 | NXP USA Inc. | 数据表 | 2000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 121-LFBGA | YES | 63 | 262144 | A/D 36x16b; D/A 1x12b | -40°C~85°C TA | Tray | 2012 | Kinetis K50 | e1 | 活跃 | 3 (168 Hours) | 121 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | 40 | MK50DX256 | S-PBGA-B121 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 2K x 8 | CORTEX-M4 | 8mm | 8mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | LPC1104UK,118 | NXP USA Inc. | 数据表 | 2000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 16-UFBGA, WLCSP | YES | 11 | 8192 | 32768 | A/D 5x10b | -40°C~85°C TA | Tape & Reel (TR) | 2010 | LPC1104 | 活跃 | 1 (Unlimited) | 16 | BOTTOM | BALL | 3.3V | 0.5mm | 16 | S-PBGA-B16 | 不合格 | 3.6V | 3.3V | 1.8V | Internal | 50MHz | 8K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0 | Brown-out Detect/Reset, POR, WDT | 25MHz | FLASH | 32-Bit | 32KB 32K x 8 | SPI, UART/USART | 32 | YES | NO | NO | CORTEX-M0 | 2.32mm | 2.17mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MK20DX32VFT5 | NXP USA Inc. | 数据表 | 2000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | YES | 29 | 32768 | A/D 11x16b | -40°C~105°C TA | Tray | 2012 | Kinetis K20 | 活跃 | 3 (168 Hours) | 48 | 3A991.A.2 | 8542.31.00.01 | QUAD | 无铅 | 260 | 3.3V | 0.5mm | 40 | MK20DX32 | S-XQCC-N48 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 2K x 8 | CORTEX-M4 | 1mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC68HC908JK3CDW | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 20-SOIC (0.295, 7.50mm Width) | 15 | A/D 12x8b | -40°C~85°C TA | Tube | 2005 | HC08 | Obsolete | 1 (Unlimited) | 8542.31.00.01 | MC68HC908 | External | 8MHz | 128 x 8 | 2.7V~3.3V | MICROCONTROLLER | LED, LVD, POR, PWM | FLASH | 8-Bit | 4KB 4K x 8 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S711E20E0VFNE2 | NXP USA Inc. | 数据表 | 450 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 52-LCC (J-Lead) | YES | 38 | A/D 8x8b | -40°C~105°C TA | Tube | 1993 | HC11 | e3 | 不用于新设计 | 3 (168 Hours) | 52 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | J BEND | 250 | 5V | 1.27mm | 30 | 5.5V | 3V | Internal | 2MHz | 768 x 8 | 4.5V~5.5V | MICROCONTROLLER | POR, WDT | 8MHz | OTP | 8-Bit | 20KB 20K x 8 | SCI, SPI | 8 | YES | NO | NO | 16 | 512 x 8 | 8 | 19.125mm | 19.125mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SPC5634MF2MLQ80RSPC5634MF2MLQ80R | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3A991.a.2 | MPC56xx | RISC | 80 | 80 | 32 | 有 | CAN/SCI/SPI | 80 | 4 | Dual | 12/12 | 0 | 0 | 0 | 0 | 1 | CAN控制器 | 1.62|4.75|3|1.14 | 5|1.2|3.3 | 5.25|1.32|3.6 | 1500 | -40 | 125 | 无 | QFP | LQFP | 表面贴装 | 1.45(Max) | 20 | 20 | 144 | Gull-wing | 卷带 | 活跃 | 144 | 94KB | Flash | 1.5MB | e200 | 0 | 0 | 2 | 2 | 32/32 | e200z3 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MKL15Z32VLH4 | NXP USA Inc. | 数据表 | 30 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 64-LQFP | YES | 54 | 32768 | A/D 16x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2012 | Kinetis KL1 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 16-BIT ADC AND 12-BIT DAC AVAILABLE | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MKL15Z32 | S-PQFP-G64 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 4K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, TSI, UART/USART | 32 | YES | YES | YES | YES | CORTEX-M0 | 1.6mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| MC9S08GT8AMFDE | NXP USA Inc. | 数据表 | 1200 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | YES | 39 | 8192 | A/D 8x10b | -40°C~125°C TA | Tray | 2006 | S08 | 活跃 | 3 (168 Hours) | 48 | EAR99 | 8542.31.00.01 | QUAD | 无铅 | 260 | 3V | 0.5mm | 40 | MC9S08GT8 | S-XQCC-N48 | 不合格 | 3.6V | 1.8/3.6V | 1.8V | Internal | 40MHz | 1K x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SCI, SPI | 16 | YES | NO | YES | NO | 1mm | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| FS32K144HAT0VLHR | NXP USA Inc. | 数据表 | 45000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 64-LQFP | A/D 16x12b; D/A 1x8b | -40°C~105°C TA | Tape & Reel (TR) | S32K | 活跃 | 3 (168 Hours) | 260 | 40 | Internal | 80MHz | 64K x 8 | 2.7V~5.5V | ARM® Cortex®-M4F | POR, PWM, WDT | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | 4K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MKL17Z32VFM4R | NXP USA Inc. | 数据表 | 10006 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 32-UFQFN Exposed Pad | YES | 28 | A/D 11x16b | -40°C~105°C TA | Tape & Reel (TR) | Kinetis KL1 | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | DIFFERENTIAL ANALOG CHANNEL INPUTS: 2-CH 16-BIT | 8542.31.00.01 | QUAD | 无铅 | 未说明 | 3V | 0.5mm | 未说明 | S-XQCC-N32 | 3.6V | 1.71V | Internal | 48MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, I2S, PWM, WDT | 48MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, FlexIO, SPI, UART/USART | 32 | YES | YES | YES | NO | 0.65mm | 5mm | 5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SPC5601PEF0MLL6 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 100-LQFP | YES | 79 | A/D 16x10b | -40°C~125°C TA | Tray | 2007 | MPC56xx Qorivva | yes | 活跃 | 3 (168 Hours) | 100 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | SPC5601 | 3.63V | 2.97V | Internal | 64MHz | 12K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z0h | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 192KB 192K x 8 | CANbus, LINbus, SCI, SPI | 32 | YES | YES | YES | 4K x 16 | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SPC5777CK3MMO3R | NXP USA Inc. | 数据表 | 5 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 516-BGA | A/D 16b Sigma-Delta, eQADC | -40°C~125°C TA | Tape & Reel (TR) | MPC57xx | 活跃 | 3 (168 Hours) | Internal | 264MHz | 512K x 8 | 3V~5.5V | e200z7 | DMA, LVD, POR, Zipwire | FLASH | 32-Bit Tri-Core | 8MB 8M x 8 | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SPC5602DF1MLL3R | NXP USA Inc. | 数据表 | 43 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 100-LQFP | 79 | A/D 33x12b | -40°C~125°C TA | Tape & Reel (TR) | 2006 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | 260 | 40 | SPC5602 | Internal | 32MHz | 16K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z0h | DMA, POR, PWM, WDT | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, LINbus, SCI, SPI | 64K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MKE02Z32VFM4R | NXP USA Inc. | 数据表 | 13 In Stock | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | 表面贴装 | 32-VFQFN Exposed Pad | YES | 28 | 4096 | 32768 | A/D 16x12b; D/A 2x6b | -40°C~105°C TA | Tape & Reel (TR) | 2002 | Kinetis KE02 | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | 从制造商网站考虑的柱塞尺寸 | 8542.31.00.01 | QUAD | 无铅 | 260 | 3V | 0.8mm | 40 | S-XQCC-N32 | 5.5V | 2.7V | Internal | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 20MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | 32 | YES | NO | YES | NO | 256 x 8 | 8 | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC68F375BGMZP33 | NXP USA Inc. | 数据表 | 20 In Stock | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 217-BBGA | YES | A/D 16x10b | 48 | -40°C~125°C TA | Tray | 1996 | M683xx | e0 | Obsolete | 3 (168 Hours) | 217 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 3.3V | 30 | MC68F375 | S-PBGA-B217 | 3.6V | 3V | Internal | 33MHz | 10K x 8 | 3V~5.25V | MICROCONTROLLER | CPU32 | POR, PWM, WDT | 33.6MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, SPI, UART/USART | 32 | YES | NO | YES | YES | 24 | 16 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LPC1112JHN33/203E | NXP USA Inc. | 数据表 | 23 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 32-VFQFN Exposed Pad | YES | 28 | 16384 | A/D 8x10b | -40°C~105°C TA | Tray | 2010 | LPC1100XL | 活跃 | 3 (168 Hours) | 33 | QUAD | 无铅 | 3.3V | 0.65mm | LPC1112 | 32 | S-PQCC-N32 | 不合格 | 3.6V | 3.3V | 1.8V | Internal | 50MHz | 4K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0 | Brown-out Detect/Reset, POR, WDT | 25MHz | FLASH | 32-Bit | 16KB 16K x 8 | I2C, SPI, UART/USART | 32 | YES | NO | NO | CORTEX-M0 | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SPC5746CSK1AMMH6 | NXP USA Inc. | 数据表 | 68031 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 17 Weeks | 表面贴装 | 100-LBGA | YES | 65 | A/D 80x10b, 64x12b | -40°C~125°C TA | Tray | MPC57xx | 活跃 | 3 (168 Hours) | 100 | BOTTOM | BALL | 260 | 1.25V | 1mm | 40 | 1.32V | 1.2V | Internal | 80MHz/160MHz | 512K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z2, e200z4 | DMA, LVD, POR, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 3MB 3M x 8 | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | 32 | YES | YES | NO | 11mm | 11mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SPC5746RK1MLU3 | NXP USA Inc. | 数据表 | 200 In Stock | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 176-LQFP | YES | A/D 12b SAR, 16b Sigma-Delta | -40°C~125°C TA | Tray | Automotive, AEC-Q100 MPC57xx | 活跃 | 3 (168 Hours) | 176 | QUAD | 鸥翼 | 260 | 1.25V | 0.5mm | 40 | 1.32V | 1.2V | Internal | 150MHz | 256K x 8 | 3.5V~5.5V | e200z4 | DMA, LVD, POR, Zipwire | 40MHz | FLASH | 32-Bit Tri-Core | 4MB 4M x 8 | CANbus, Ethernet, I2C, LINbus, SCI, SPI, UART/USART | 32 | YES | YES | NO | 24mm | 24mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SPC5747GK1MKU6R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | 表面贴装 | 176-LQFP Exposed Pad | 129 | A/D 80x10b, 64x12b | -40°C~125°C TA | Tape & Reel (TR) | MPC57xx | 活跃 | 3 (168 Hours) | Internal | 80MHz/160MHz | 768K x 8 | 3V~5.5V | e200z2, e200z4, e200z4 | DMA, LVD, POR, WDT | FLASH | 32-Bit Tri-Core | 4MB 4M x 8 | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MK50DN512CMD10R | NXP USA Inc. | 数据表 | 10 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 144-LBGA | YES | 96 | 524288 | A/D 41x16b; D/A 2x12b | -40°C~85°C TA | Tape & Reel (TR) | 2011 | Kinetis K50 | e1 | 活跃 | 3 (168 Hours) | 144 | 3A991.A.2 | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MK50DN512 | S-PBGA-B144 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M4 | 1.7mm | 13mm | 13mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| S912XHY128F0VLL | NXP USA Inc. | 数据表 | 8 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 100-LQFP | YES | 76 | 131072 | Automotive grade | A/D 8x10b | -40°C~105°C TA | Bulk | 2008 | HCS12X | 活跃 | 3 (168 Hours) | 100 | 8542.31.00.01 | QUAD | 鸥翼 | 5V | 0.5mm | S912XHY128 | S-PQFP-G100 | 不合格 | 5.5V | 1.83.3/5V | 4.5V | External | 40MHz | 8K x 8 | 4.5V~5.5V | MICROCONTROLLER | LCD, Motor control PWM, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | 16 | YES | NO | YES | 8K x 8 | CPU12 | AEC-Q100 | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S912XEG128J2VAAR | NXP USA Inc. | 数据表 | 6 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 80-QFP | YES | 59 | 12288 | 131072 | A/D 8x12b | -40°C~105°C TA | Tape & Reel (TR) | 1996 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.65mm | 40 | S-PQFP-G80 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 12K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 16 | YES | YES | YES | 2K x 8 | CPU12 | 14mm | 14mm | ROHS3 Compliant |
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21.302184
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分类:Embedded - Microcontrollers
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NXP Semiconductors
分类:Embedded - Microcontrollers
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NXP USA Inc.
分类:Embedded - Microcontrollers
57.212645
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NXP USA Inc.
分类:Embedded - Microcontrollers
46.444782
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NXP USA Inc.
分类:Embedded - Microcontrollers
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NXP USA Inc.
分类:Embedded - Microcontrollers
25.786735
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NXP USA Inc.
分类:Embedded - Microcontrollers
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NXP USA Inc.
分类:Embedded - Microcontrollers
435.050573
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NXP USA Inc.
分类:Embedded - Microcontrollers
102.058577
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NXP USA Inc.
分类:Embedded - Microcontrollers
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NXP USA Inc.
分类:Embedded - Microcontrollers
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NXP USA Inc.
分类:Embedded - Microcontrollers
17.323671
-
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NXP USA Inc.
分类:Embedded - Microcontrollers
172.447669
-
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NXP USA Inc.
分类:Embedded - Microcontrollers
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NXP USA Inc.
分类:Embedded - Microcontrollers
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NXP USA Inc.
分类:Embedded - Microcontrollers
151.554872
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NXP USA Inc.
分类:Embedded - Microcontrollers
67.550345
-
S912XEG128J2VAAR
NXP USA Inc.
分类:Embedded - Microcontrollers
94.553260