品牌是'NXP' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 子类别 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | 产品类别 | 核心架构 | EEPROM 大小 | 片上程序 ROM 宽度 | 处理器系列 | 边界扫描 | 低功率模式 | 筛选水平 | 外部数据总线宽度 | 格式 | 集成缓存 | 以太网 | USB | SPI,SPI | CAN | 脉宽调制 | 产品类别 | ADC Channels | 设备核心 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | ||||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | MC9S08QB8CGK | NXP USA Inc. | 数据表 | 2000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 24-VQFN Exposed Pad | YES | A/D 8x12b | 18 | 8192 | -40°C~85°C TA | Tray | 2006 | S08 | 活跃 | 3 (168 Hours) | 24 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | 无铅 | 260 | 3V | 0.65mm | 40 | MC9S08QB8 | S-XBCC-N24 | 不合格 | 3.6V | 1.8/3.6V | 1.8V | External | 20MHz | 512 x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, PWM, WDT | 16MHz | FLASH | 8-Bit | 8KB 8K x 8 | LINbus, SCI | 8 | YES | NO | YES | NO | 1.05mm | 5mm | 5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S9S12ZVL32F0MLCR | NXP USA Inc. | 数据表 | 6000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 32-LQFP | YES | A/D 6x10b | 19 | -40°C~125°C TA | Tape & Reel (TR) | 2013 | S12 MagniV | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 0.8mm | 未说明 | Internal | 32MHz | 1K x 8 | 5.5V~18V | MICROCONTROLLER | S12Z | LVD, POR, PWM, WDT | FLASH | 16-Bit | 32KB 32K x 8 | I2C, IrDA, LINbus, SCI, SPI, UART/USART | 16 | YES | NO | YES | 128 x 8 | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S912ZVHL64F1VLL | NXP USA Inc. | 数据表 | 501 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 100-LQFP | YES | 4096 | 65536 | Automotive grade | A/D 4x10b | 73 | -40°C~105°C TA | Tray | 2010 | S12 MagniV | 活跃 | 3 (168 Hours) | 100 | 8542.31.00.01 | QUAD | 鸥翼 | 12V | 0.5mm | S-PQFP-G100 | 不合格 | 18V | 6/18V | 5.5V | Internal | 32MHz | 4K x 8 | 4.5V~5.5V | MICROCONTROLLER | S12Z | DMA, LCD, POR, PWM, WDT | 20MHz | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, I2C, LINbus, SCI, SPI | 16 | YES | YES | YES | 32 | 2K x 8 | CPU12 | AEC-Q100 | 32 | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MK30DX64VLH7 | NXP USA Inc. | 数据表 | 30 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 64-LQFP | YES | A/D 22x16b; D/A 1x12b | 40 | 65536 | -40°C~105°C TA | Tray | 2012 | Kinetis K30 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MK30DX64 | S-PQFP-G64 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 64KB 64K x 8 | CANbus, I2C, IrDA, SD, SPI, UART/USART | 32 | YES | YES | YES | YES | 2K x 8 | CORTEX-M4 | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S912ZVMC25F1VKK | NXP USA Inc. | 数据表 | 116 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 80-LQFP Exposed Pad | YES | A/D 16x12b | 31 | -40°C~105°C TA | Tray | 2012 | S12 MagniV | 活跃 | 80 | 40V SUPPLY IS NOT ALWAYS POOSIBLE | QUAD | 鸥翼 | 1.8V | 0.5mm | S-PQFP-G80 | 1.98V | 1.72V | Internal | 50MHz | 32K x 8 | 3.5V~40V | MICROCONTROLLER | S12Z | DMA, POR, PWM, WDT | 20MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, SCI, SPI | 16 | YES | NO | NO | NO | 1K x 8 | 8 | 1.6mm | 12mm | 12mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC9S08GT60ACFDER | NXP USA Inc. | 数据表 | 2000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 11 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | YES | A/D 8x10b | 39 | -40°C~85°C TA | Tape & Reel (TR) | 2005 | S08 | 不用于新设计 | 3 (168 Hours) | 48 | EAR99 | OPERATES AT 1.8V MINIMUM SUPPLY | 8542.31.00.01 | QUAD | 无铅 | 260 | 3V | 0.5mm | 40 | MC9S08GT60 | S-XQCC-N48 | 不合格 | 3.6V | 2.08V | Internal | 40MHz | 4K x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 1mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC9S08SH8MTG | NXP USA Inc. | 数据表 | 373 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 22 Weeks | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 8x10b | 13 | 8192 | -40°C~125°C TA | Tube | 2007 | S08 | e3 | 活跃 | 3 (168 Hours) | 16 | EAR99 | 哑光锡 | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 3V | 0.65mm | 40 | MC9S08SH8 | R-PDSO-G16 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | 1.2mm | 5mm | 4.4mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S9S12XS128J1MALR | NXP USA Inc. | 数据表 | 3000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 112-LQFP | YES | 8192 | 131072 | Automotive grade | A/D 16x12b | 91 | -40°C~125°C TA | Tape & Reel (TR) | 2010 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 112 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.65mm | 40 | S-PQFP-G112 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 40MHz | 8K x 8 | 1.72V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, SCI, SPI | 16 | YES | NO | YES | YES | CPU12 | AEC-Q100 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC9S08AW60CFGE | NXP USA Inc. | 数据表 | 10000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 44-LQFP | YES | A/D 8x10b | 34 | 63280 | -40°C~85°C TA | Tray | 2000 | S08 | e3 | 活跃 | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.8mm | 40 | MC9S08AW60 | S-PQFP-G44 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 1.6mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC9S08QG8CDTE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 8x10b | 12 | 8192 | -40°C~85°C TA | Tube | 2005 | S08 | e3 | 活跃 | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 3V | 0.65mm | 40 | MC9S08QG8 | R-PDSO-G16 | 不合格 | 3.6V | 1.8/3.6V | 1.8V | Internal | 20MHz | 512 x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 1.2mm | 5mm | 4.4mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MC9S08DZ16AMLF | NXP USA Inc. | 数据表 | 4950 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 48-LQFP | 48-LQFP (7x7) | A/D 16x12b | 39 | -40°C~125°C TA | Tray | 2008 | S08 | 活跃 | 3 (168 Hours) | MC9S08DZ16 | External | 40MHz | 1K x 8 | 2.7V~5.5V | S08 | LVD, POR, PWM, WDT | FLASH | 8-Bit | 16KB 16K x 8 | CANbus, I2C, LINbus, SCI, SPI | 512 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC908AP32CFBE | NXP USA Inc. | 数据表 | 583 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 44-QFP | YES | A/D 8x10b | 32 | -40°C~85°C TA | Tray | 1996 | HC08 | e3 | 不用于新设计 | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.8mm | 40 | MC908AP32 | 5.5V | 4.5V | Internal | 8MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LED, LVD, POR, PWM | 8MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, IRSCI, SCI, SPI | 8 | YES | YES | YES | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MKL02Z16VFK4 | NXP USA Inc. | 数据表 | 59 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 24-VFQFN Exposed Pad | YES | A/D 12x12b | 22 | 16384 | -40°C~105°C TA | Tray | 2002 | Kinetis KL02 | 活跃 | 3 (168 Hours) | 24 | 3A991.A.2 | 8542.31.00.01 | QUAD | 无铅 | 260 | 0.5mm | 40 | MKL02Z16 | S-PQCC-N24 | 不合格 | 1.8/3.3V | Internal | 48MHz | 2K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, LVD, POR, PWM, WDT | FLASH | 32-Bit | 16KB 16K x 8 | I2C, SPI, UART/USART | 32 | CORTEX-M0 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC9S08GT8AMFBE | NXP USA Inc. | 数据表 | 10 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 44-QFP | YES | A/D 8x10b | 36 | 8192 | -40°C~125°C TA | Tray | 2006 | S08 | e3 | 活跃 | 3 (168 Hours) | 44 | EAR99 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.8mm | 40 | MC9S08GT8 | S-PQFP-G44 | 不合格 | 3.6V | 1.8/3.6V | 1.8V | Internal | 40MHz | 1K x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SCI, SPI | 16 | YES | NO | YES | NO | 2.45mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
S9S12GN48F0VLF | NXP USA Inc. | 数据表 | 2200 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 48-LQFP | YES | A/D 12x10b | 40 | 49152 | Automotive grade | -40°C~105°C TA | Tray | 2008 | HCS12 | 活跃 | 3 (168 Hours) | 48 | 8542.31.00.01 | QUAD | 鸥翼 | 0.5mm | S9S12GN48 | S-PQFP-G48 | 不合格 | 3.3/5V | Internal | 25MHz | 4K x 8 | 3.13V~5.5V | 12V1 | LVD, POR, PWM, WDT | FLASH | 16-Bit | 48KB 48K x 8 | IrDA, LINbus, SCI, SPI | 16 | 1.5K x 8 | CPU12 | AEC-Q100 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | LPC54102J512UK49Z | NXP USA Inc. | 数据表 | 1512 In Stock | - | 最小起订量: 1 最小包装量: 1 | 26 Weeks | 表面贴装 | 49-UFBGA, WLCSP | YES | A/D 12x12b | 39 | 106496 | 524288 | -40°C~105°C TA | Tape & Reel (TR) | 2010 | LPC54100 | 活跃 | 1 (Unlimited) | 49 | BOTTOM | BALL | 未说明 | 3.3V | 0.4mm | 未说明 | S-PBGA-B49 | 3.6V | 1.62V | Internal | 100MHz | 104K x 8 | 1.62V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4/M0+ | Brown-out Detect/Reset, POR, PWM, WDT | 25MHz | FLASH | 32-Bit Dual-Core | 512KB 512K x 8 | I2C, SPI, UART/USART | 32 | YES | YES | YES | NO | 8 | 0.58mm | 3.29mm | 3.29mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MCHC11F1CFNE3R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 68-LCC (J-Lead) | YES | A/D 8x8b | 30 | -40°C~85°C TA | Tape & Reel (TR) | 1993 | HC11 | e3 | 不用于新设计 | 3 (168 Hours) | 68 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | J BEND | 250 | 5V | 1.27mm | 30 | MCHC11 | S-PQCC-J68 | 5.25V | 4.75V | Internal | 3MHz | 1K x 8 | 4.75V~5.25V | MICROCONTROLLER | POR, WDT | 12MHz | ROMless | 8-Bit | SCI, SPI | 8 | YES | NO | NO | NO | 16 | 512 x 8 | 8 | 24.23mm | 24.23mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC9S08PT16AVLC | NXP USA Inc. | 数据表 | 15000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | 表面贴装 | 32-LQFP | A/D 12x12b | 28 | -40°C~105°C TA | Tray | 2002 | S08 | e3 | 活跃 | 3 (168 Hours) | 3A991.A.2 | Tin (Sn) | 8542.31.00.01 | 260 | 40 | Internal | 20MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SPI, UART/USART | 256 x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MK26FN2M0VMD18 | NXP USA Inc. | 数据表 | 10006 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 144-LBGA | YES | A/D 5x12b, 3x16b; D/A 2x12b | 100 | 262144 | 2097152 | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | 活跃 | 3 (168 Hours) | 144 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 3.3V | 1mm | 未说明 | S-PBGA-B144 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 180MHz | 256K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M4F | 13mm | 13mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S9S08SG8E2VTJR | NXP USA Inc. | 数据表 | 1500 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | YES | A/D 12x10b | 16 | 8192 | Automotive grade | -40°C~105°C TA | Tape & Reel (TR) | 2011 | S08 | e3 | 活跃 | 3 (168 Hours) | 20 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 5V | 0.65mm | 40 | S9S08SG8 | R-PDSO-G20 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SCI, SPI | 120mA | 8 | YES | NO | YES | NO | AEC-Q100 | 1.2mm | 6.5mm | 5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SPC5634MF2MLQ60 | NXP USA Inc. | 数据表 | 5 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 144-LQFP | YES | A/D 32x12b | 80 | 1572864 | Automotive grade | -40°C~125°C TA | Tray | 2007 | MPC56xx Qorivva | e3 | 活跃 | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 40 | SPC5634 | S-PQFP-G144 | 不合格 | 1.32V | 1.23.35V | 1.14V | Internal | 60MHz | 94K x 8 | 4.5V~5.25V | MICROCONTROLLER, RISC | e200z3 | DMA, POR, PWM, WDT | 20MHz | FLASH | 32-Bit | 1.5MB 1.5M x 8 | CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART | 195mA | 32 | YES | YES | YES | 32 | AEC-Q100 | 64 | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MC908GZ16MFAE | NXP USA Inc. | 数据表 | 1050 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 48-LQFP | YES | A/D 8x10b | 37 | -40°C~125°C TA | Tray | 2006 | HC08 | e3 | 不用于新设计 | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | OPERATES AT 3.3V SUPPLY AT 4MHZ | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.5mm | 40 | MC908GZ16 | S-PQFP-G48 | 不合格 | 5.5V | 4.5V | Internal | 8MHz | 1K x 8 | 3V~5.5V | MICROCONTROLLER | LVD, POR, PWM | 32MHz | FLASH | 8-Bit | 16KB 16K x 8 | CANbus, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MK64FN1M0CAJ12R | NXP USA Inc. | 数据表 | 2684 In Stock | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 142-UFBGA, WLCSP | YES | A/D 41x16b; D/A 2x12b | 100 | -40°C~85°C TA | Tape & Reel (TR) | 2014 | Kinetis K60 | 活跃 | 1 (Unlimited) | 142 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.4mm | 40 | R-PBGA-B142 | 3.6V | 1.71V | Internal | 120MHz | 256K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 5.58mm | 4.84mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MKL17Z256VFM4R | NXP Semiconductors | 数据表 | 20000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 3A991.a.2 | KL1x | RISC | 48 | 48 | 32 | 4GB | 有 | I2C/I2S/SPI/UART | 28 | 5 | Single | 16 | Single | 12 | 0 | 3 | 2 | 1 | 1 | 1 | 无 | 有 | 1.71 | 1.8|3.3|2.5 | 3.6 | -40 | 105 | QFN | HUQFN EP | 表面贴装 | 0.6(Max) | 5 | 5 | 32 | 5000 | 935315582528 | NXP | 恩智浦半导体 | Details | 卷带 | Microcontrollers - MCU | 32 | 32KB | Flash | 256KB | 1 | ARM Microcontrollers - MCU | ARM | 0 | 0 | 4 | 0 | 3 | ARM Microcontrollers - MCU | 16 | ARM Cortex M0+ | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MCF54452CVR200 | NXP USA Inc. | 数据表 | 17 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 360-BBGA | YES | 132 | -40°C~85°C TA | Tray | 2006 | MCF5445x | e2 | 活跃 | 3 (168 Hours) | 360 | 5A992 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF54452 | S-PBGA-B360 | 不合格 | 1.65V | 1.51.82.53.3V | 1.35V | Internal | 200MHz | 32K x 8 | 1.35V~3.6V | MICROPROCESSOR, RISC | Coldfire V4 | DMA, WDT | 66MHz | ROMless | 32-Bit | I2C, SPI, SSI, UART/USART, USB OTG | 32 | 32 | YES | YES | 32 | 固定点 | YES | 2.48mm | 23mm | 23mm | ROHS3 Compliant |
MC9S08QB8CGK
NXP USA Inc.
分类:Embedded - Microcontrollers
S9S12ZVL32F0MLCR
NXP USA Inc.
分类:Embedded - Microcontrollers
S912ZVHL64F1VLL
NXP USA Inc.
分类:Embedded - Microcontrollers
MK30DX64VLH7
NXP USA Inc.
分类:Embedded - Microcontrollers
116.389741
S912ZVMC25F1VKK
NXP USA Inc.
分类:Embedded - Microcontrollers
MC9S08GT60ACFDER
NXP USA Inc.
分类:Embedded - Microcontrollers
106.793118
MC9S08SH8MTG
NXP USA Inc.
分类:Embedded - Microcontrollers
34.914725
S9S12XS128J1MALR
NXP USA Inc.
分类:Embedded - Microcontrollers
107.527782
MC9S08AW60CFGE
NXP USA Inc.
分类:Embedded - Microcontrollers
MC9S08QG8CDTE
NXP USA Inc.
分类:Embedded - Microcontrollers
MC9S08DZ16AMLF
NXP USA Inc.
分类:Embedded - Microcontrollers
116.230611
MC908AP32CFBE
NXP USA Inc.
分类:Embedded - Microcontrollers
MKL02Z16VFK4
NXP USA Inc.
分类:Embedded - Microcontrollers
MC9S08GT8AMFBE
NXP USA Inc.
分类:Embedded - Microcontrollers
43.376942
S9S12GN48F0VLF
NXP USA Inc.
分类:Embedded - Microcontrollers
29.024646
LPC54102J512UK49Z
NXP USA Inc.
分类:Embedded - Microcontrollers
MCHC11F1CFNE3R
NXP USA Inc.
分类:Embedded - Microcontrollers
MC9S08PT16AVLC
NXP USA Inc.
分类:Embedded - Microcontrollers
MK26FN2M0VMD18
NXP USA Inc.
分类:Embedded - Microcontrollers
S9S08SG8E2VTJR
NXP USA Inc.
分类:Embedded - Microcontrollers
22.533527
SPC5634MF2MLQ60
NXP USA Inc.
分类:Embedded - Microcontrollers
269.027278
MC908GZ16MFAE
NXP USA Inc.
分类:Embedded - Microcontrollers
MK64FN1M0CAJ12R
NXP USA Inc.
分类:Embedded - Microcontrollers
MKL17Z256VFM4R
NXP Semiconductors
分类:Embedded - Microcontrollers
52.321570
MCF54452CVR200
NXP USA Inc.
分类:Embedded - Microcontrollers
