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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | EEPROM 大小 | 片上程序 ROM 宽度 | 处理器系列 | 边界扫描 | 低功率模式 | 筛选水平 | 外部数据总线宽度 | 格式 | 集成缓存 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | MKL14Z64VFT4R | NXP USA Inc. | 数据表 | 268 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | YES | A/D 15x12b | 40 | 8192 | 65536 | -40°C~105°C TA | Tape & Reel (TR) | 2014 | Kinetis KL1 | 活跃 | 3 (168 Hours) | 48 | 3A991.A.2 | 12-BIT ADC AVAILABLE | 8542.31.00.01 | QUAD | 无铅 | 260 | 3.3V | 0.5mm | 40 | S-XQCC-N48 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, LINbus, SPI, UART/USART | 32 | YES | YES | YES | YES | CORTEX-M0 | 1mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||
 | LPC804M101JHI33Y | NXP USA Inc. | 数据表 | 832 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 32-VFQFN Exposed Pad | YES | A/D 12x12b; D/A 1x10b | 30 | -40°C~105°C TA | Tape & Reel (TR) | LPC80xM | 活跃 | 3 (168 Hours) | 32 | QUAD | 无铅 | 260 | 3.3V | 0.5mm | 未说明 | 3.6V | 1.71V | Internal | 15MHz | 4K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, POR, PWM, WDT | 15MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | 8 | YES | YES | YES | 5mm | 5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||
 | MK21FX512AVLQ12 | NXP USA Inc. | 数据表 | 17 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 144-LQFP | YES | A/D 42x16b; D/A 2x12b | 100 | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | 活跃 | 3 (168 Hours) | 144 | 3A991.A.2 | TIN | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | S-PQFP-G144 | 3.6V | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG | YES | YES | YES | YES | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||||||||||||
 | MCF52211CAE66 | NXP USA Inc. | 数据表 | 1500 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 64-LQFP | YES | 43 | 131072 | A/D 8x12b | -40°C~85°C TA | Tray | 2007 | MCF5221x | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MCF52211 | S-PQFP-G64 | 不合格 | 3.6V | 3/3.3V | 3V | Internal | 66MHz | 16K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | 66MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SPI, UART/USART, USB OTG | 32 | YES | YES | YES | NO | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||
 | MC9S12GC64MPBE | NXP USA Inc. | 数据表 | 2000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 52-LQFP | YES | 35 | 65536 | A/D 8x10b | -40°C~125°C TA | Tray | 2010 | HCS12 | e3 | 活跃 | 3 (168 Hours) | 52 | EAR99 | 哑光锡 | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.65mm | 40 | MC9S12GC64 | S-PQFP-G52 | 不合格 | 2.75V | 2.53.3/5V | Internal | 25MHz | 4K x 8 | 2.35V~5.5V | MICROCONTROLLER | POR, PWM, WDT | 50MHz | FLASH | 16-Bit | 64KB 64K x 8 | EBI/EMI, SCI, SPI | 16 | YES | NO | YES | NO | CPU12 | 1.7mm | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||
 | MK21FX512AVMC12 | NXP USA Inc. | 数据表 | 823 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 121-LFBGA | 81 | A/D 42x16b; D/A 2x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | 活跃 | 3 (168 Hours) | 3A991.A.2 | 8542.31.00.01 | 未说明 | 未说明 | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | MCF5274LVM166 | NXP USA Inc. | 数据表 | 31 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 196-LBGA | YES | 61 | 0°C~70°C TA | Tray | 1997 | MCF527x | e1 | 不用于新设计 | 3 (168 Hours) | 196 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF5274 | S-PBGA-B196 | 不合格 | 1.6V | 1.4V | External | 166MHz | 64K x 8 | 1.4V~1.6V | MICROPROCESSOR, RISC | Coldfire V2 | DMA, WDT | 83MHz | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | 32 | 24 | YES | YES | 32 | 固定点 | YES | 1.6mm | 15mm | 15mm | ROHS3 Compliant | |||||||||||||||||||
 | MK10DX128VMD10 | NXP USA Inc. | 数据表 | 10006 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 144-LBGA | YES | 104 | 131072 | A/D 46x16b; D/A 2x12b | -40°C~105°C TA | Tray | 2012 | Kinetis K10 | e1 | 活跃 | 3 (168 Hours) | 144 | 3A991.A.2 | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MK10DX128 | S-PBGA-B144 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | 32 | YES | YES | YES | YES | 4K x 8 | CORTEX-M4 | 1.7mm | 13mm | 13mm | ROHS3 Compliant | ||||||||||||||||
| MKE14Z256VLH7 | NXP USA Inc. | 数据表 | 3482 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 64-LQFP | YES | A/D 16x12b; D/A 1x8b | 58 | 32768 | 262144 | -40°C~105°C TA | Tray | 2016 | Kinetis KE1xZ | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Tin (Sn) | FLEXRAM WITH 2KB FOR EEPROM EMULATION | 8542.31.00.01 | QUAD | 鸥翼 | 未说明 | 3.3V | 0.5mm | 未说明 | S-PQFP-G64 | 5.5V | 2.7V | Internal | 72MHz | 32K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, LVD, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | FlexIO, I2C, SPI, UART/USART | 32 | YES | YES | YES | NO | 34K x 8 | 8 | 1.6mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||
 | MC9S08AC32CFDE | NXP USA Inc. | 数据表 | 1400 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | YES | 38 | 32768 | A/D 8x10b | -40°C~85°C TA | Tray | 2008 | S08 | 活跃 | 3 (168 Hours) | 48 | 3A991.A.2 | 8542.31.00.01 | QUAD | 无铅 | 260 | 5V | 0.5mm | 40 | MC9S08AC32 | S-XQCC-N48 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 1mm | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||
 | MCF51JM128EVLK | NXP USA Inc. | 数据表 | 2 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 80-LQFP | YES | 66 | 131072 | A/D 12x12b | -40°C~105°C TA | Tray | 2007 | MCF51JM | e3 | 活跃 | 3 (168 Hours) | 80 | 5A992 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.65mm | 40 | MCF51JM128 | S-PQFP-G80 | 不合格 | 5.5V | 3/5V | 2.7V | External | 50MHz | 16K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | Coldfire V1 | LVD, PWM, WDT | 16MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI, USB OTG | 32 | YES | NO | YES | NO | 1.74mm | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||
| MK40DX256VMC7 | NXP USA Inc. | 数据表 | 6 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 121-LFBGA | YES | 74 | 262144 | A/D 34x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K40 | e1 | 活跃 | 3 (168 Hours) | 121 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | 40 | MK40DX256 | S-PBGA-B121 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 2K x 8 | CORTEX-M4 | 8mm | 8mm | ROHS3 Compliant | |||||||||||||||||
| MC68331CAG16 | NXP USA Inc. | 数据表 | 1 In Stock | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | 表面贴装 | 144-LQFP | 18 | -40°C~85°C TA | Tray | 1996 | M683xx | 不用于新设计 | 3 (168 Hours) | MC68331 | Internal | 16MHz | 4.5V~5.5V | CPU32 | POR, PWM, WDT | ROMless | 32-Bit | EBI/EMI, SCI, SPI, UART/USART | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | MC9S08SH8CWJR | NXP USA Inc. | 数据表 | 31 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 22 Weeks | 表面贴装 | 20-SOIC (0.295, 7.50mm Width) | YES | 17 | 8192 | A/D 12x10b | -40°C~85°C TA | Tape & Reel (TR) | 2003 | S08 | e3 | 活跃 | 3 (168 Hours) | 20 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 3V | 1.27mm | 40 | MC9S08SH8 | R-PDSO-G20 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | 2.65mm | 12.8mm | 7.5mm | ROHS3 Compliant | |||||||||||||||||||
 | MC9S08DZ48ACLC | NXP USA Inc. | 数据表 | 1250 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 32-LQFP | 32-LQFP (7x7) | A/D 10x12b | 25 | -40°C~85°C TA | Tray | 2005 | S08 | 活跃 | 3 (168 Hours) | MC9S08DZ48 | External | 40MHz | 3K x 8 | 2.7V~5.5V | S08 | LVD, POR, PWM, WDT | FLASH | 8-Bit | 48KB 48K x 8 | CANbus, I2C, LINbus, SCI, SPI | 1.5K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | SPC5602BF2MLL4 | NXP USA Inc. | 数据表 | 43 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 100-LQFP | YES | A/D 28x10b | 79 | 262144 | Automotive grade | -40°C~125°C TA | Tray | 2004 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | 100 | 8542.31.00.01 | QUAD | 鸥翼 | 3.3V | 0.5mm | SPC5602 | S-PQFP-G100 | 不合格 | 3.6V | 3.3/5V | 3V | Internal | 48MHz | 24K x 8 | 3V~5.5V | MICROCONTROLLER | e200z0h | DMA, POR, PWM, WDT | 16MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, LINbus, SCI, SPI | 32 | YES | YES | YES | 64K x 8 | AEC-Q100 | 64 | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||
| S9S08DZ16F2CLC | NXP USA Inc. | 数据表 | 1250 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 32-LQFP | 25 | A/D 10x12b | -40°C~85°C TA | Tray | S08 | yes | 活跃 | 3 (168 Hours) | 260 | 40 | S9S08DZ16 | External | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | FLASH | 8-Bit | 16KB 16K x 8 | CANbus, I2C, LINbus, SCI, SPI | 512 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | MC9S12XEP768CAL | NXP USA Inc. | 数据表 | 3015 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 112-LQFP | YES | 91 | 786432 | A/D 16x12b | -40°C~85°C TA | Tray | 2012 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 112 | Matte Tin (Sn) | IT ALSO REQUIRES 5 V I/O SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.65mm | 40 | MC9S12XE768 | S-PQFP-G112 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 48K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 768KB 768K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 32 | YES | NO | YES | NO | 4K x 8 | CPU12 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||
| MCF51AC128ACLKE | NXP USA Inc. | 数据表 | 1000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 80-LQFP | YES | 69 | 131072 | A/D 24x12b | -40°C~85°C TA | Tray | 2007 | MCF51AC | e3 | 活跃 | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.65mm | 40 | MCF51AC128 | S-PQFP-G80 | 不合格 | 5.5V | 3/5V | 2.7V | External | 50MHz | 32K x 8 | 2.7V~5.5V | MICROCONTROLLER | Coldfire V1 | LVD, PWM, WDT | 16MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | 32 | YES | NO | YES | NO | 1.74mm | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||
| SPC5603PEF1MLL6R | NXP USA Inc. | 数据表 | 1000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 100-LQFP | YES | A/D 30x10b | 68 | 393216 | Automotive grade | -40°C~125°C TA | Tape & Reel (TR) | 2007 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | 100 | 8542.31.00.01 | QUAD | 鸥翼 | 5V | 0.5mm | SPC5603 | S-PQFP-G100 | 不合格 | 5.5V | 3.3/5V | 4.5V | Internal | 64MHz | 36K x 8 | 3V~5.5V | MICROCONTROLLER | e200z0h | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 384KB 384K x 8 | CANbus, FlexRay, LINbus, SPI, UART/USART | 89mA | 32 | YES | YES | YES | 64K x 8 | AEC-Q100 | 32 | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||
| S9KEAZN32ACLH | NXP USA Inc. | 数据表 | 68 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 20 Weeks | 表面贴装 | 64-LQFP | YES | A/D 16x12b | 57 | -40°C~85°C TA | Tray | 2012 | Kinetis KEA | yes | 活跃 | 3 (168 Hours) | 64 | QUAD | 鸥翼 | 260 | 3V | 0.5mm | 40 | 5.5V | 2.7V | Internal | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, POR, PWM, WDT | 20MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART | 32 | YES | NO | YES | 256 x 8 | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||
 | MK26FN2M0CAC18R | NXP USA Inc. | 数据表 | 951 In Stock | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 169-UFBGA, WLCSP | YES | A/D 5x12b, 6x16b; D/A 2x12b | 116 | 262144 | 2097152 | -40°C~85°C TA | Tape & Reel (TR) | 2002 | Kinetis K20 | 活跃 | 1 (Unlimited) | 169 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 3.3V | 0.4mm | 未说明 | R-PBGA-B169 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 180MHz | 256K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M4F | 5.6mm | 5.5mm | ROHS3 Compliant | ||||||||||||||||||||
 | SPC5675KFF0MMM2 | NXP USA Inc. | 数据表 | 83 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 257-LFBGA | YES | A/D 22x12b | 122 | 2097152 | Automotive grade | -40°C~125°C TA | Tray | 2007 | MPC56xx Qorivva | 最后一次购买 | 3 (168 Hours) | 257 | 8542.31.00.01 | BOTTOM | BALL | 3.3V | 0.8mm | SPC5675 | S-PBGA-B257 | 不合格 | 5.5V | 1.23.35V | 3V | Internal | 180MHz | 512K x 8 | 1.14V~5.5V | MICROCONTROLLER, RISC | e200z7d | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI | 900mA | 32 | YES | YES | YES | 64K x 8 | AEC-Q100 | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||
| FS32R274KBK2MMM | NXP USA Inc. | 数据表 | 5 In Stock | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | 表面贴装 | 257-LFBGA | A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b | -40°C~125°C TA | Tray | 2017 | S32R | Obsolete | 3 (168 Hours) | 8542.31.00.01 | 260 | 40 | Internal | 180MHz, 240MHz | 1.5M x 8 | 1.19V~5.5V | MICROPROCESSOR | e200z4, e200z7 (2) | POR, PWM, WDT | FLASH | 32-Bit Tri-Core | 2MB 2M x 8 | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | 64K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
| S9S12P128J0CLH | NXP USA Inc. | 数据表 | 2000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 64-LQFP | YES | A/D 10x12b | 49 | 131072 | Automotive grade | -40°C~85°C TA | Tray | 2006 | HCS12 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.5mm | 40 | S9S12P128 | S-PQFP-G64 | 不合格 | 5.5V | 1.83.3/5V | 3.13V | Internal | 32MHz | 6K x 8 | 1.72V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, SCI, SPI | 16 | YES | NO | YES | YES | 4K x 8 | CPU12 | AEC-Q100 | 16 | 1.6mm | 10mm | 10mm | ROHS3 Compliant |
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