NXP的微处理器_正品采购_价格信息

品牌是'NXP' (5316)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	工厂交货时间	包装/外壳	表面安装			操作温度	包装	已出版	系列	JESD-609代码	零件状态	湿度敏感性等级(MSL)	终止次数	ECCN 代码	端子表面处理	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	电源电压	端子间距	时间@峰值回流温度-最大值(s)	基本部件号	JESD-30代码	资历状况	电源	速度	uPs/uCs/外围ICs类型	核心处理器	时钟频率	位元大小	地址总线宽度	边界扫描	低功率模式	外部数据总线宽度	格式	集成缓存	内存(字)	电压 - I/O	以太网	核数/总线宽度	图形加速	内存控制器	USB	附加接口	串行I/O数	协处理器/DSP	电压 - 供电（最大值）	电压 - 供电（最小值）	总线兼容性	保安功能	显示和界面控制器	萨塔	座位高度(最大)	长度	RoHS状态
MPC8347VRADDB	NXP USA Inc.	数据表	47 In Stock	-	最小起订量: 1 最小包装量: 1	12 Weeks	620-BBGA Exposed Pad	YES		0°C~105°C TA	Tray	2002	MPC83xx	e2	活跃	3 (168 Hours)	620	3A991.A.2	Tin/Silver (Sn/Ag)	8542.31.00.01	BOTTOM	BALL	260	1.2V	1mm	40	MPC8347	S-PBGA-B620		1.2V	266MHz	MICROPROCESSOR	PowerPC e300	66MHz	32	32	YES	YES	32	浮点	YES		2.5V 3.3V	10/100/1000Mbps (2)	1 Core 32-Bit	无	DDR	USB 2.0 + PHY (2)	DUART, I2C, PCI, SPI			1.26V	1.14V					2.46mm	29mm	ROHS3 Compliant
MPC855TZQ50D4	NXP USA Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	12 Weeks	357-BBGA	YES		0°C~95°C TA	Tray	1997	MPC8xx	e0	不用于新设计	3 (168 Hours)	357	3A991.A.2	Tin/Lead (Sn/Pb)	8542.31.00.01	BOTTOM	BALL	245	3.3V	1.27mm	30	MPC855	S-PBGA-B357		3.3V	50MHz	MICROPROCESSOR, RISC		50MHz	32	32	YES	YES	32	固定点	YES		3.3V	10Mbps (1), 10/100Mbps (1)	1 Core 32-Bit	无	DRAM		HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART		Communications; CPM	3.465V	3.135V					2.52mm	25mm	Non-RoHS Compliant
MPC8572ELVTAVNE	NXP USA Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	26 Weeks	1023-BFBGA, FCBGA	YES		0°C~105°C TA	Tray	2008	MPC85xx		Obsolete	3 (168 Hours)		5A002		8542.31.00.01	BOTTOM	BALL		1.1V	1mm		MPC8572	S-PBGA-B1023			1.5GHz	MICROPROCESSOR, RISC	PowerPC e500	133MHz	32	32	YES	YES	32	浮点	YES		1.5V 1.8V 2.5V 3.3V	10/100/1000Mbps (4)	2 Core 32-Bit	无	DDR2, DDR3		DUART, HSSI, I2C, RapidIO		Signal Processing; SPE, Security; SEC	1.155V	1.045V		Cryptography, Random Number Generator			3.38mm	33mm	ROHS3 Compliant
MCIMX6U8DVM10AB	NXP USA Inc.	数据表	126 In Stock	-	最小起订量: 1 最小包装量: 1	15 Weeks	624-LFBGA	YES		0°C~95°C TJ	Tray	2002	i.MX6DL		不用于新设计	3 (168 Hours)	624				BOTTOM	BALL	未说明		0.8mm	未说明	MCIMX6	S-PBGA-B624			1.0GHz	MICROPROCESSOR, RISC	ARM® Cortex®-A9			26	YES	YES	64	固定点	YES		1.8V 2.5V 2.8V 3.3V	10/100/1000Mbps (1)	2 Core 32-Bit	有	LPDDR2, LVDDR3, DDR3	USB 2.0 + PHY (4)	CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART		Multimedia; NEON™ SIMD	1.5V	1.35V		ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection	Keypad, LCD		1.6mm	21mm	ROHS3 Compliant
LS2088AXE7V1B	NXP USA Inc.	数据表	2028 In Stock	-	最小起订量: 1 最小包装量: 1	18 Weeks	1292-BFBGA, FCBGA		-40°C~105°C			QorIQ® Layerscape		活跃	3 (168 Hours)															2.0GHz		ARM® Cortex®-A72											10GbE (8) or 1GbE (16) & 2.5GbE (1)	8 Core 64-Bit		DDR4	USB 3.0 (2) + PHY									SATA 6Gbps (2)			ROHS3 Compliant
MCIMX6X1EVO10AB	NXP USA Inc.	数据表	5 In Stock	-	最小起订量: 1 最小包装量: 1	15 Weeks	400-LFBGA	YES	179	Commercial grade	-20°C~105°C TJ	Tray	2014	i.MX6SX		活跃	3 (168 Hours)	400	5A992		8542.31.00.01	BOTTOM	BALL			0.8mm			S-PBGA-B400			227MHz, 1GHz	MICROPROCESSOR, RISC	ARM® Cortex®-A9, ARM® Cortex®-M4	1000MHz		15	YES		32				1.8V 2.5V 2.8V 3.15V	10/100/1000Mbps (2)	2 Core 32-Bit	无	LPDDR2, LVDDR3, DDR3	USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)	AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART	6	Multimedia; NEON™ MPE	1.5V	1.35V	CAN, ETHERNET, I2C, I2S, PCI, SPI, UART, USB	A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE	Keypad, LCD		1.53mm	17mm	ROHS3 Compliant
MCIMX6Y0DVM05AB	NXP USA Inc.	数据表	5364 In Stock	-	最小起订量: 1 最小包装量: 1	12 Weeks	289-LFBGA		0°C~95°C TJ	Tray	2015	i.MX6		活跃	3 (168 Hours)				8542.39.00.01			260			40					528MHz		ARM® Cortex®-A7										1.8V 2.8V 3.3V	10/100Mbps (1)	1 Core 32-Bit	无	LPDDR2, DDR3, DDR3L	USB 2.0 OTG + PHY (1)	I2C, SPI, UART		Multimedia; NEON™ MPE				A-HAB, ARM TZ, CSU, SJC, SNVS	Electrophoretic, LCD				ROHS3 Compliant
MCIMX6S6AVM10AD	NXP USA Inc.	数据表	3000 In Stock	-	最小起订量: 1 最小包装量: 1	14 Weeks	624-LFBGA	YES		-40°C~125°C TJ	Tray		i.MX6S	e1	活跃	3 (168 Hours)	624		Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	260		0.8mm	40		S-PBGA-B624			1GHz	MICROPROCESSOR, RISC	ARM® Cortex®-A9			16	YES	YES	32	浮点	YES		1.8V 2.5V 2.8V 3.3V	10/100/1000Mbps (1)	1 Core 32-Bit	有	LPDDR2, LVDDR3, DDR3	USB 2.0 + PHY (4)	CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART		Multimedia; NEON™ SIMD	1.5V	1.4V		ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection	Keypad, LCD		1.6mm	21mm	ROHS3 Compliant
MCIMX6Q5EYM10ACR	NXP USA Inc.	数据表	47 In Stock	-	最小起订量: 1 最小包装量: 1	15 Weeks	624-LFBGA, FCBGA	YES		-20°C~105°C TJ	Tape & Reel (TR)	2002	i.MX6Q	e1	不用于新设计	3 (168 Hours)	624	5A992	Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	260	1.4V	0.8mm	40	MCIMX6	S-PBGA-B624			1.0GHz	MICROPROCESSOR	ARM® Cortex®-A9			16	YES	YES	64	固定点	YES		1.8V 2.5V 2.8V 3.3V	10/100/1000Mbps (1)	4 Core 32-Bit	有	LPDDR2, LVDDR3, DDR3	USB 2.0 + PHY (4)	CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART		Multimedia; NEON™ SIMD	1.5V	1.35V		ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection	Keypad, LCD	SATA 3Gbps (1)	1.6mm	21mm	ROHS3 Compliant
MCIMX6X1CVK08AB	NXP USA Inc.	数据表	30 In Stock	-	最小起订量: 1 最小包装量: 1	15 Weeks	400-LFBGA	YES		-40°C~105°C TA	Tray	2002	i.MX6SX	e1	活跃	3 (168 Hours)	400	5A992	Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	260		0.8mm	40		S-PBGA-B400			200MHz, 800MHz	MICROPROCESSOR, RISC	ARM® Cortex®-A9, ARM® Cortex®-M4			15	YES	YES	32	浮点	YES		1.8V 2.5V 2.8V 3.15V	10/100/1000Mbps (2)	2 Core 32-Bit	无	LPDDR2, LVDDR3, DDR3	USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)	AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART		Multimedia; NEON™ MPE	1.5V	1.275V		A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE	Keypad, LCD		1.3mm	14mm	ROHS3 Compliant
MPC860PCVR66D4	NXP USA Inc.	数据表	2023 In Stock	-	最小起订量: 1 最小包装量: 1	357-BBGA	YES		-40°C~95°C TA	Tray	1995	MPC8xx	e1	不用于新设计	3 (168 Hours)	357	3A991.A.2	Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	245	3.3V	1.27mm	30	MPC860	S-PBGA-B357		3.3V	66MHz	MICROPROCESSOR, RISC		50MHz	32	32	YES	YES	32	固定点	YES		3.3V	10Mbps (4), 10/100Mbps (1)	1 Core 32-Bit	无	DRAM		HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART		Communications; CPM	3.465V	3.135V					2.52mm	25mm	ROHS3 Compliant
MPC850SRVR50BU	NXP USA Inc.	数据表	42 In Stock	-	最小起订量: 1 最小包装量: 1	256-BBGA	YES		0°C~95°C TA	Tray	1997	MPC8xx	e1	Obsolete	3 (168 Hours)	256	3A991.A.2	Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	260	3.3V	1.27mm	40	MPC850	S-PBGA-B256		3.3V	50MHz	MICROPROCESSOR, RISC			32	26	YES	YES	32	固定点	YES		3.3V	10Mbps (1)	1 Core 32-Bit	无	DRAM	USB 1.x (1)	HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART		Communications; CPM	3.6V	3V					2.54mm	23mm	ROHS3 Compliant
MPC866TZP133A	NXP USA Inc.	数据表	8750 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	357-BBGA	YES		0°C~95°C TA	Tray	1999	MPC8xx	e0	Obsolete	3 (168 Hours)	357	3A991.A.2	Tin/Lead (Sn/Pb)	8542.31.00.01	BOTTOM	BALL	220	1.8V	1.27mm	30	MPC866	S-PBGA-B357		1.83.3V	133MHz	MICROPROCESSOR, RISC		133MHz	32	32	YES	YES	32	固定点	YES		3.3V	10Mbps (4), 10/100Mbps (1)	1 Core 32-Bit	无	DRAM		HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART		Communications; CPM	1.9V	1.7V					2.52mm	25mm	Non-RoHS Compliant
MPC8347VVALFB	NXP USA Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	12 Weeks	672-LBGA	YES		0°C~105°C TA	Tray	2002	MPC83xx	e2	活跃	3 (168 Hours)	672	3A991.A.2	TIN COPPER/TIN SILVER	8542.31.00.01	BOTTOM	BALL	260	1.2V	1mm	40	MPC8347	S-PBGA-B672		1.3V	667MHz	MICROPROCESSOR	PowerPC e300	66MHz	32	32	YES	YES	32	浮点	YES		2.5V 3.3V	10/100/1000Mbps (2)	1 Core 32-Bit	无	DDR	USB 2.0 + PHY (2)	DUART, I2C, PCI, SPI			1.26V	1.14V					1.69mm	35mm	ROHS3 Compliant
MCIMX6D6AVT08AE	NXP USA Inc.	数据表	341 In Stock	-	最小起订量: 1 最小包装量: 1	12 Weeks	624-FBGA, FCBGA		-40°C~125°C TJ	Tray	2002	i.MX6D		活跃	3 (168 Hours)							260			40					852MHz		ARM® Cortex®-A9										1.8V 2.5V 2.8V 3.3V	10/100/1000Mbps (1)	2 Core 32-Bit	有	LPDDR2, LVDDR3, DDR3	USB 2.0 + PHY (4)	CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART		Multimedia; NEON™ SIMD				ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection	Keypad, LCD	SATA 3Gbps (1)			ROHS3 Compliant
MCIMX31LCVMN4C	NXP USA Inc.	数据表	80 In Stock	-	最小起订量: 1 最小包装量: 1	15 Weeks	473-LFBGA	YES	Industrial grade	-40°C~85°C TA	Tray	2004	i.MX31	e1	活跃	3 (168 Hours)	473	5A992	Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	260	1.4V	0.8mm	40	MCIMX31	S-PBGA-B473	不合格	1.53.3V	400MHz	MICROPROCESSOR	ARM1136JF-S	75MHz	32	26	YES	YES	16	浮点	YES		1.8V 2.0V 2.5V 2.7V 3.0V		1 Core 32-Bit	有	DDR	USB 2.0 (3)	1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART		Multimedia; GPU, IPU, MPEG-4, VFP	1.47V	1.22V		Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory	Keyboard, Keypad, LCD		1.54mm	19mm	ROHS3 Compliant
MPC8241TVR200D	NXP USA Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	12 Weeks	357-BBGA	YES		-40°C~105°C TA	Tray	1998	MPC82xx	e1	Obsolete	3 (168 Hours)	357	3A991.A.2	Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	245	1.8V	1.27mm	30	MPC8241	S-PBGA-B357			200MHz	MICROPROCESSOR, RISC	PowerPC 603e	66MHz	32	32	YES	YES	64	浮点	YES		3.3V		1 Core 32-Bit	无	SDRAM		I2C, I2O, PCI, UART			1.9V	1.7V					2.56mm	25mm	ROHS3 Compliant
MPC8541EVTAQF	NXP USA Inc.	数据表	714 In Stock	-	最小起订量: 1 最小包装量: 1	12 Weeks	783-BBGA, FCBGA	YES		0°C~105°C TA	Tray	2002	MPC85xx	e2	Obsolete	3 (168 Hours)	783	5A002.A.1	TIN COPPER/TIN SILVER	8542.31.00.01	BOTTOM	BALL	260	1.3V	1mm	40	MPC8541	R-PBGA-B783			1.0GHz	MICROPROCESSOR, RISC	PowerPC e500	166MHz	32	64	YES	YES	64	浮点	YES		2.5V 3.3V	10/100/1000Mbps (2)	1 Core 32-Bit	无	DDR, SDRAM		DUART, I2C, PCI		Security; SEC	1.35V	1.25V		Cryptography, Random Number Generator			3.75mm	29mm	ROHS3 Compliant
P1014NSN5HFA	NXP USA Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	425-FBGA	YES		0°C~105°C TA	Tray	2010	QorIQ P1	e2	Obsolete	3 (168 Hours)	425	3A991.A.2	TIN COPPER/TIN SILVER	8542.31.00.01	BOTTOM	BALL	260	1V	0.8mm	40	P1014	S-PBGA-B425			800MHz	MICROPROCESSOR, RISC	PowerPC e500v2	100MHz	32		YES	YES		浮点	YES			10/100/1000Mbps (2)	1 Core 32-Bit	无	DDR3, DDR3L	USB 2.0 + PHY (1)	DUART, I2C, MMC/SD, SPI			1.05V	0.95V				SATA 3Gbps (2)	1.9mm	19mm	ROHS3 Compliant
MPC853TVR66A	NXP USA Inc.	数据表	2700 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	256-BBGA	YES		0°C~95°C TA	Tray	1999	MPC8xx	e1	最后一次购买	3 (168 Hours)	256	3A991.A.2	Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	245	1.8V	1.27mm	30	MPC853	S-PBGA-B256			66MHz	MICROPROCESSOR, RISC		66MHz	32	32	YES	YES	32	固定点	YES		3.3V	10Mbps (1)	1 Core 32-Bit	无	DRAM		HDLC/SDLC, PCMCIA, SPI, TDM, UART		Communications; CPM	1.9V	1.7V					2.54mm	23mm	ROHS3 Compliant
MCIMX6S4AVM08AB	NXP USA Inc.	数据表	18 In Stock	-	最小起订量: 1 最小包装量: 1	15 Weeks	624-LFBGA	YES		-40°C~125°C TJ	Tray	2002	i.MX6S	e1	不用于新设计	3 (168 Hours)	624	5A992	Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	260	1.35V	0.8mm	40	MCIMX6	S-PBGA-B624			800MHz	MICROPROCESSOR, RISC	ARM® Cortex®-A9	24MHz	64	16	YES	YES	32	固定点	YES		1.8V 2.5V 2.8V 3.3V	10/100/1000Mbps (1)	1 Core 32-Bit	有	LPDDR2, LVDDR3, DDR3	USB 2.0 + PHY (4)	CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART		Multimedia; NEON™ SIMD	1.5V	1.275V		ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection	Keypad, LCD		1.6mm	21mm	ROHS3 Compliant
MPC850DEZQ50BU	NXP USA Inc.	数据表	1 In Stock	-	最小起订量: 1 最小包装量: 1	12 Weeks	256-BBGA	YES		0°C~95°C TA	Tray	1997	MPC8xx	e0	Obsolete	3 (168 Hours)	256	3A991.A.2	Tin/Lead (Sn/Pb)	8542.31.00.01	BOTTOM	BALL	260	3.3V	1.27mm	40	MPC850	S-PBGA-B256		3.3V	50MHz	MICROPROCESSOR, RISC			32	26	YES	YES	32	固定点	YES		3.3V	10Mbps (1)	1 Core 32-Bit	无	DRAM	USB 1.x (1)	HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART		Communications; CPM	3.6V	3V					2.54mm	23mm	Non-RoHS Compliant
MCIMX31LDVMN5D	NXP USA Inc.	数据表	2059 In Stock	-	最小起订量: 1 最小包装量: 1	15 Weeks	473-LFBGA	YES	Commercial grade	-20°C~70°C TA	Tray	2004	i.MX31	e1	活跃	3 (168 Hours)	473	5A992	Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	260		0.8mm	40	MCIMX31	S-PBGA-B473	不合格	1.2/1.51.8/3.3V	532MHz	MICROPROCESSOR	ARM1136JF-S	75MHz	32	26	YES	YES	16	固定点	YES		1.8V 2.0V 2.5V 2.7V 3.0V		1 Core 32-Bit	有	DDR	USB 2.0 (3)	1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART		Multimedia; GPU, IPU, MPEG-4, VFP	1.65V	1.52V		Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory	Keyboard, Keypad, LCD		1.54mm	14mm	ROHS3 Compliant
MCIMX507CVM8B	NXP USA Inc.	数据表	7600 In Stock	-	最小起订量: 1 最小包装量: 1	15 Weeks	400-LFBGA	YES		0°C~70°C TA	Tray	2008	i.MX50	e1	活跃	3 (168 Hours)	400	5A992	Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	260	1.225V	0.8mm	40	MCIMX507	S-PBGA-B400	不合格		800MHz	微处理器电路	ARM® Cortex®-A8	800MHz			YES					131072	1.2V 1.875V 2.775V 3.0V	10/100Mbps (1)	1 Core 32-Bit	有	LPDDR, LPDDR2, DDR2	USB 2.0 + PHY (2)	1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART		Multimedia; NEON™ SIMD	1.275V	1.175V		Boot Security, Cryptography, Secure JTAG	LCD		1.6mm	17mm	ROHS3 Compliant
MCIMX7D3EVK10SD	NXP USA Inc.	数据表	23 In Stock	-	最小起订量: 1 最小包装量: 1	16 Weeks	488-TFBGA	YES		-20°C~105°C TJ	Tray	2012	i.MX7D		活跃	3 (168 Hours)	488			8542.31.00.01	BOTTOM	BALL	260	1.1V	0.4mm	40		S-PBGA-B488			1.0GHz	MICROPROCESSOR, RISC	ARM® Cortex®-A7, ARM® Cortex®-M4		32	16	YES	YES	32	浮点	YES		1.8V 3.3V	10/100/1000Mbps (2)	2 Core 32-Bit	无	LPDDR2, LPDDR3, DDR3, DDR3L	USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)	AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART		Multimedia; NEON™ MPE	1.25V	1.045V		A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS	Keypad, LCD, MIPI		1.1mm	12mm	ROHS3 Compliant