品牌是'Xilinx' (1835)

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

表面安装

终端数量

JESD-609代码

无铅代码

ECCN 代码

端子表面处理

附加功能

HTS代码

端子位置

终端形式

峰值回流焊温度(摄氏度)

功能数量

端子间距

Reach合规守则

引脚数量

JESD-30代码

输出的数量

资历状况

电源电压-最大值(Vsup)

电源

温度等级

电源电压-最小值(Vsup)

操作模式

传播延迟

输入数量

组织结构

输出特性

座位高度-最大

内存宽度

可编程逻辑类型

记忆密度

并行/串行

内存IC类型

输出功能

串行总线类型

宏细胞数

写入周期时间 - 最大值

CLB-Max的组合延时

数据保持时间

逻辑块数量

JTAG BST

逻辑单元数

等效门数

系统内可编程

长度

宽度

XCV1000E-6BGG560I
XCV1000E-6BGG560I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

560

3

357 MHz

5.8

BGA-560

BGA

XILINX INC

Obsolete

XCV1000E-6BGG560I

1.71 V

30

1.8 V

1.89 V

GRID ARRAY, LOW PROFILE

SQUARE

BGA560,33X33,50

LBGA

PLASTIC/EPOXY

e1

EAR99

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

8542.39.00.01

BOTTOM

BALL

260

1.27 mm

unknown

560

S-PBGA-B560

404

不合格

1.2/3.6,1.8 V

404

6144 CLBS, 331776 GATES

1.7 mm

现场可编程门阵列

0.47 ns

6144

27648

331776

42.5 mm

42.5 mm

XCR3032XL-5PCG44C
XCR3032XL-5PCG44C
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

5.66

175 MHz

3

36

70 °C

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

3.6 V

3.3 V

30

3 V

XCR3032XL-5PCG44C

Obsolete

XILINX INC

LCC

LEAD FREE, PLASTIC, LCC-44

e3

Matte Tin (Sn)

YES

8542.39.00.01

QUAD

J BEND

245

1.27 mm

unknown

44

S-PQCC-J44

不合格

3.3 V

COMMERCIAL

5 ns

0 DEDICATED INPUTS, 36 I/O

4.57 mm

EE PLD

MACROCELL

32

YES

YES

16.5862 mm

16.5862 mm

XC95216-15BGG352I
XC95216-15BGG352I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

352

5.8

55.6 MHz

3

166

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

5.5 V

5 V

30

4.5 V

XC95216-15BGG352I

Obsolete

XILINX INC

BGA

LBGA,

e1

EAR99

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

216 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

8542.39.00.01

BOTTOM

BALL

260

1.27 mm

compliant

352

S-PBGA-B352

不合格

INDUSTRIAL

15 ns

0 DEDICATED INPUTS, 166 I/O

1.4 mm

闪存 PLD

MACROCELL

35 mm

35 mm

XCV1600E-7BGG560C
XCV1600E-7BGG560C
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

560

400 MHz

3

85 °C

PLASTIC/EPOXY

LBGA

BGA560,33X33,50

SQUARE

GRID ARRAY, LOW PROFILE

1.89 V

1.8 V

30

1.71 V

XCV1600E-7BGG560C

Obsolete

XILINX INC

BGA

LBGA, BGA560,33X33,50

5.81

e1

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

8542.39.00.01

BOTTOM

BALL

260

1.27 mm

compliant

560

S-PBGA-B560

404

不合格

1.2/3.6,1.8 V

OTHER

404

7776 CLBS, 419904 GATES

1.7 mm

现场可编程门阵列

0.42 ns

7776

34992

419904

42.5 mm

42.5 mm

X25320S8I-2.7
X25320S8I-2.7
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

8

SOP

RECTANGULAR

小概要

5 V

X25320S8I-2.7

Obsolete

XICOR INC

SOP,

5.83

2 MHz

4096 words

4000

85 °C

-40 °C

PLASTIC/EPOXY

DATA RETENTION > 100 YEARS

DUAL

鸥翼

1

1.27 mm

unknown

R-PDSO-G8

不合格

5.5 V

INDUSTRIAL

2.7 V

SYNCHRONOUS

4KX8

3-STATE

1.75 mm

8

32768 bit

SERIAL

EEPROM

SPI

10 ms

100

4.9 mm

3.9 mm

XC4013XL-3PQG208I
XC4013XL-3PQG208I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

208

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

3.6 V

3.3 V

30

3 V

XC4013XL-3PQG208I

Obsolete

XILINX INC

QFP

FQFP,

5.78

166 MHz

3

e3

Matte Tin (Sn)

MAX USABLE 13000 LOGIC GATES

8542.39.00.01

QUAD

鸥翼

245

0.5 mm

compliant

208

S-PQFP-G208

不合格

576 CLBS, 10000 GATES

4.1 mm

现场可编程门阵列

1.6 ns

576

10000

28 mm

28 mm

XC3042A-7VQG100I
XC3042A-7VQG100I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

100

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

5.5 V

5 V

4.5 V

XC3042A-7VQG100I

Obsolete

XILINX INC

QFP

TFQFP,

5.81

113 MHz

3

PLASTIC/EPOXY

e3

Matte Tin (Sn)

MAX USABLE 3000 LOGIC GATES

QUAD

鸥翼

0.5 mm

compliant

100

S-PQFP-G100

144 CLBS, 2000 GATES

1.2 mm

现场可编程门阵列

5.1 ns

144

2000

14 mm

14 mm

XCV1000E-6FGG860C
XCV1000E-6FGG860C
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

860

357 MHz

3

85 °C

PLASTIC/EPOXY

BGA

BGA860,42X42,40

SQUARE

网格排列

1.89 V

1.8 V

30

1.71 V

XCV1000E-6FGG860C

Obsolete

XILINX INC

BGA

BGA, BGA860,42X42,40

5.79

e1

3A001.A.7.A

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

8542.39.00.01

BOTTOM

BALL

245

1 mm

compliant

860

S-PBGA-B860

660

不合格

1.2/3.6,1.8 V

OTHER

660

6144 CLBS, 331776 GATES

2.2 mm

现场可编程门阵列

0.47 ns

6144

27648

331776

42.5 mm

42.5 mm

XCV1600E-8FGG900I
XCV1600E-8FGG900I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

900

3

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

网格排列

1.89 V

1.8 V

30

1.71 V

XCV1600E-8FGG900I

Obsolete

XILINX INC

BGA

BGA, BGA900,30X30,40

5.82

416 MHz

e1

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

8542.39.00.01

BOTTOM

BALL

250

1 mm

compliant

900

S-PBGA-B900

700

不合格

1.2/3.6,1.8 V

700

7776 CLBS, 419904 GATES

2.6 mm

现场可编程门阵列

0.4 ns

7776

34992

419904

31 mm

31 mm

XCV1600E-6FGG680I
XCV1600E-6FGG680I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

680

3

PLASTIC/EPOXY

BGA

BGA680,39X39,40

SQUARE

网格排列

1.89 V

1.8 V

30

1.71 V

XCV1600E-6FGG680I

Obsolete

XILINX INC

BGA

BGA, BGA680,39X39,40

5.8

357 MHz

e1

3A001.A.7.A

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

8542.39.00.01

BOTTOM

BALL

260

1 mm

compliant

680

S-PBGA-B680

512

不合格

1.2/3.6,1.8 V

512

7776 CLBS, 419904 GATES

1.9 mm

现场可编程门阵列

0.47 ns

7776

34992

419904

40 mm

40 mm

XCV1000E-8BGG560I
XCV1000E-8BGG560I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

560

3

PLASTIC/EPOXY

LBGA

BGA560,33X33,50

SQUARE

GRID ARRAY, LOW PROFILE

1.89 V

1.8 V

30

1.71 V

XCV1000E-8BGG560I

Obsolete

XILINX INC

BGA

LBGA, BGA560,33X33,50

5.8

416 MHz

e1

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

8542.39.00.01

BOTTOM

BALL

260

1.27 mm

compliant

560

S-PBGA-B560

404

不合格

1.2/3.6,1.8 V

404

6144 CLBS, 331776 GATES

1.7 mm

现场可编程门阵列

0.4 ns

6144

27648

331776

42.5 mm

42.5 mm

XCV1600E-6FGG900I
XCV1600E-6FGG900I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

900

3

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

网格排列

1.89 V

1.8 V

30

1.71 V

XCV1600E-6FGG900I

Obsolete

XILINX INC

BGA

BGA, BGA900,30X30,40

5.81

357 MHz

e1

3A991.D

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

8542.39.00.01

BOTTOM

BALL

250

1 mm

compliant

900

S-PBGA-B900

700

不合格

1.2/3.6,1.8 V

700

7776 CLBS, 419904 GATES

2.6 mm

现场可编程门阵列

0.47 ns

7776

34992

419904

31 mm

31 mm

XCV1000E-8FGG860I
XCV1000E-8FGG860I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

860

3

PLASTIC/EPOXY

BGA

BGA860,42X42,40

SQUARE

网格排列

1.89 V

1.8 V

30

1.71 V

XCV1000E-8FGG860I

Obsolete

XILINX INC

BGA

BGA, BGA860,42X42,40

5.8

416 MHz

e1

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

8542.39.00.01

BOTTOM

BALL

245

1 mm

compliant

860

S-PBGA-B860

660

不合格

1.2/3.6,1.8 V

660

6144 CLBS, 331776 GATES

2.2 mm

现场可编程门阵列

0.4 ns

6144

27648

331776

42.5 mm

42.5 mm

XCV1600E-7FGG900C
XCV1600E-7FGG900C
Xilinx 数据表

677 In Stock

-

最小起订量: 1

最小包装量: 1

YES

900

400 MHz

3

85 °C

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

网格排列

1.89 V

1.8 V

30

1.71 V

XCV1600E-7FGG900C

Obsolete

XILINX INC

BGA

BGA, BGA900,30X30,40

5.8

e1

3A991.D

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

8542.39.00.01

BOTTOM

BALL

250

1 mm

compliant

900

S-PBGA-B900

700

不合格

1.2/3.6,1.8 V

OTHER

700

7776 CLBS, 419904 GATES

2.6 mm

现场可编程门阵列

0.42 ns

7776

34992

419904

31 mm

31 mm

XCR3032XL-7PCG44C
XCR3032XL-7PCG44C
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

5.67

119 MHz

3

36

70 °C

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

3.6 V

3.3 V

30

3 V

XCR3032XL-7PCG44C

Obsolete

XILINX INC

LCC

LEAD FREE, PLASTIC, LCC-44

e3

Matte Tin (Sn)

YES

8542.39.00.01

QUAD

J BEND

245

1.27 mm

unknown

44

S-PQCC-J44

不合格

3.3 V

COMMERCIAL

7.5 ns

0 DEDICATED INPUTS, 36 I/O

4.57 mm

EE PLD

MACROCELL

32

YES

YES

16.5862 mm

16.5862 mm

XC4010XL-1BGG256C
XC4010XL-1BGG256C
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

256

3

85 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

3.6 V

3.3 V

30

3 V

XC4010XL-1BGG256C

Obsolete

XILINX INC

BGA

BGA,

5.8

200 MHz

e1

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

MAX USABLE 10000 LOGIC GATES

8542.39.00.01

BOTTOM

BALL

250

1.27 mm

compliant

256

S-PBGA-B256

不合格

OTHER

400 CLBS, 7000 GATES

2.55 mm

现场可编程门阵列

1.3 ns

400

7000

27 mm

27 mm

XC4036XL-09BG352I
XC4036XL-09BG352I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

352

3.3 V

30

XC4036XL-09BG352I

Obsolete

XILINX INC

5.87

217 MHz

3

PLASTIC/EPOXY

BGA

BGA352,26X26,50

SQUARE

网格排列

e0

Tin/Lead (Sn63Pb37)

BOTTOM

BALL

225

1.27 mm

not_compliant

S-PBGA-B352

288

不合格

3.3 V

288

现场可编程门阵列

1296

XC95216-15HQG208I
XC95216-15HQG208I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

208

5.81

55.6 MHz

3

166

85 °C

-40 °C

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

5.5 V

5 V

30

4.5 V

XC95216-15HQG208I

Obsolete

XILINX INC

QFP

FQFP,

e3

EAR99

Matte Tin (Sn)

216 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

8542.39.00.01

QUAD

鸥翼

245

0.4 mm

compliant

208

S-PQFP-G208

不合格

INDUSTRIAL

15 ns

0 DEDICATED INPUTS, 166 I/O

4.1 mm

闪存 PLD

MACROCELL

28 mm

28 mm

XC95288-15HQG208C
XC95288-15HQG208C
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

208

55.6 MHz

3

168

70 °C

PLASTIC/EPOXY

HFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

5.25 V

5 V

30

4.75 V

XC95288-15HQG208C

Obsolete

XILINX INC

QFP

HFQFP,

5.6

e3

Matte Tin (Sn)

8542.39.00.01

QUAD

鸥翼

245

0.5 mm

compliant

208

S-PQFP-G208

不合格

COMMERCIAL

15 ns

0 DEDICATED INPUTS, 168 I/O

4.1 mm

闪存 PLD

MACROCELL

28 mm

28 mm

XCV2000E-8FGG680I
XCV2000E-8FGG680I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

680

3

PLASTIC/EPOXY

BGA

BGA680,39X39,40

SQUARE

网格排列

1.89 V

1.8 V

30

1.71 V

XCV2000E-8FGG680I

Obsolete

XILINX INC

BGA

BGA, BGA680,39X39,40

5.82

416 MHz

e1

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

8542.39.00.01

BOTTOM

BALL

260

1 mm

compliant

680

S-PBGA-B680

512

不合格

1.2/3.6,1.8 V

512

9600 CLBS, 518400 GATES

1.9 mm

现场可编程门阵列

0.4 ns

9600

43200

518400

40 mm

40 mm

XCV1600E-6BGG560I
XCV1600E-6BGG560I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

560

3

PLASTIC/EPOXY

LBGA

BGA560,33X33,50

SQUARE

GRID ARRAY, LOW PROFILE

1.89 V

1.8 V

30

1.71 V

XCV1600E-6BGG560I

Obsolete

XILINX INC

BGA

LBGA, BGA560,33X33,50

5.8

357 MHz

e1

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

8542.39.00.01

BOTTOM

BALL

260

1.27 mm

compliant

560

S-PBGA-B560

404

不合格

1.2/3.6,1.8 V

404

7776 CLBS, 419904 GATES

1.7 mm

现场可编程门阵列

0.47 ns

7776

34992

419904

42.5 mm

42.5 mm

XC3195A-09PG175C
XC3195A-09PG175C
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

175

CERAMIC, METAL-SEALED COFIRED

HPGA

PGA175,16X16

SQUARE

GRID ARRAY, HEAT SINK/SLUG

5.25 V

5 V

4.75 V

XC3195A-09PG175C

Obsolete

XILINX INC

PGA

HPGA, PGA175,16X16

5.77

370 MHz

85 °C

MAX USABLE 7500 LOGIC GATES

8542.39.00.01

PERPENDICULAR

PIN/PEG

2.54 mm

unknown

175

S-CPGA-P175

144

不合格

5 V

OTHER

144

484 CLBS, 6500 GATES

4.318 mm

现场可编程门阵列

1.5 ns

484

484

6500

42.164 mm

42.164 mm

XC3190A-09PG175C
XC3190A-09PG175C
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

175

85 °C

CERAMIC, METAL-SEALED COFIRED

HPGA

PGA175,16X16

SQUARE

GRID ARRAY, HEAT SINK/SLUG

5.25 V

5 V

未说明

4.75 V

XC3190A-09PG175C

Obsolete

XILINX INC

PGA

HPGA, PGA175,16X16

5.8

370 MHz

MAX USABLE 6000 LOGIC GATES

8542.39.00.01

PERPENDICULAR

PIN/PEG

未说明

2.54 mm

compliant

175

S-CPGA-P175

144

不合格

5 V

OTHER

144

320 CLBS, 5000 GATES

4.318 mm

现场可编程门阵列

1.5 ns

320

320

5000

42.164 mm

42.164 mm

XCV400E-6PQG240C
XCV400E-6PQG240C
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

240

357 MHz

3

85 °C

PLASTIC/EPOXY

FQFP

QFP240,1.3SQ,20

SQUARE

FLATPACK, FINE PITCH

1.89 V

1.8 V

30

1.71 V

XCV400E-6PQG240C

Obsolete

XILINX INC

QFP

PLASTIC, QFP-240

5.79

e3

EAR99

Matte Tin (Sn)

8542.39.00.01

QUAD

鸥翼

245

0.5 mm

unknown

240

S-PQFP-G240

158

不合格

1.2/3.6,1.8 V

OTHER

158

2400 CLBS, 129600 GATES

4.1 mm

现场可编程门阵列

0.47 ns

2400

10800

129600

32 mm

32 mm

XC3195A-09PP175C
XC3195A-09PP175C
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

175

5 V

4.75 V

XC3195A-09PP175C

接触制造商

ROCHESTER ELECTRONICS LLC

PGA,

5.79

370 MHz

85 °C

PLASTIC/EPOXY

PGA

SQUARE

网格排列

5.25 V

MAX USABLE 7500 LOGIC GATES

8542.39.00.01

PERPENDICULAR

PIN/PEG

2.54 mm

unknown

S-PPGA-P175

OTHER

484 CLBS, 6500 GATES

4.191 mm

现场可编程门阵列

1.5 ns

484

6500

42.164 mm

42.164 mm