Xilinx的片上系统（SoC）_正品采购_价格信息

品牌是'Xilinx' (1945)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	工厂交货时间	包装/外壳	表面安装	供应商器件包装	Core												操作温度	包装	已出版	系列	无铅代码	零件状态	湿度敏感性等级(MSL)	终止次数	附加功能	HTS代码	终端形式	峰值回流焊温度（摄氏度）	电源电压	端子间距	Reach合规守则	频率	时间@峰值回流温度-最大值(s)	基本部件号	JESD-30代码	工作电源电压	电源电压-最大值(Vsup)	电源电压-最小值(Vsup)	界面	内存大小	uPs/uCs/外围ICs类型	周边设备	时钟频率	连接方式	建筑学	核心架构	收发器数量	核数量
XCZU4CG-L2FBVB900E	Xilinx Inc.	数据表	16 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	YES		204		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG		活跃	4 (72 Hours)	900	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V				未说明		R-PBGA-B900	0.742V	0.698V		500MHz, 1.2GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 192K+ Logic Cells					ROHS3 Compliant
XCZU19EG-3FFVD1760E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1760-BBGA, FCBGA		308			0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明					未说明						600MHz, 667MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells					ROHS3 Compliant
XCZU17EG-3FFVB1517E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA		644			0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明					未说明						600MHz, 667MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 926K+ Logic Cells					ROHS3 Compliant
XCZU11EG-1FFVC1156I	Xilinx Inc.	数据表	424 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA		360			-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明					未说明						500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 653K+ Logic Cells					ROHS3 Compliant
XCZU17EG-L1FFVB1517I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA	YES		644		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V				未说明		R-PBGA-B1517	0.742V	0.698V		500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 926K+ Logic Cells					ROHS3 Compliant
XCZU7EG-2FBVB900E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA		204			0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG	yes	活跃	4 (72 Hours)			8542.31.00.01			未说明					未说明						533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 504K+ Logic Cells					ROHS3 Compliant
XCZU7CG-L2FFVF1517E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA	YES		464		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG		活跃	4 (72 Hours)		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V				未说明		R-PBGA-B1517	0.742V	0.698V		533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 504K+ Logic Cells					ROHS3 Compliant
XCZU17EG-1FFVD1760I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1760-BBGA, FCBGA		308			-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明					未说明						500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 926K+ Logic Cells					ROHS3 Compliant
XCZU19EG-3FFVB1517E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA		644			0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明					未说明						600MHz, 667MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells					ROHS3 Compliant
XAZU3EG-1SFVA625I	Xilinx Inc.	数据表	42 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA	YES		128		-40°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)	625		8542.31.00.01	BOTTOM	BALL	未说明	0.85V	0.8mm			未说明		S-PBGA-B625				500MHz, 1.2GHz	1.8MB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, I2C, SPI, UART/USART, USB	MPU, FPGA				Zynq®UltraScale+™ FPGA, 154K+ Logic Cells		3.43mm	21mm	21mm	ROHS3 Compliant
XCZU2CG-2SFVC784E	Xilinx Inc.	数据表	643 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA		252			0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG	yes	活跃	4 (72 Hours)			8542.31.00.01			未说明					未说明						533MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 103K+ Logic Cells					ROHS3 Compliant
XCZU11EG-1FFVF1517E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA		464			0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明					未说明						500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 653K+ Logic Cells					ROHS3 Compliant
XCZU7CG-1FBVB900I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA		204			-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG		活跃	4 (72 Hours)			8542.31.00.01			未说明					未说明						500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 504K+ Logic Cells					ROHS3 Compliant
XCZU15EG-1FFVC900I	Xilinx Inc.	数据表	692 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA		204			-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明					未说明						500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 747K+ Logic Cells					ROHS3 Compliant
XCZU17EG-2FFVD1760I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1760-BBGA, FCBGA		308			-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明					未说明						533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 926K+ Logic Cells					ROHS3 Compliant
XCZU17EG-2FFVE1924I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1924-BBGA, FCBGA		668			-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明					未说明						533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 926K+ Logic Cells					ROHS3 Compliant
XCZU7EG-2FFVF1517E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA		464			0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG	yes	活跃	4 (72 Hours)			8542.31.00.01			未说明					未说明						533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 504K+ Logic Cells					ROHS3 Compliant
XC7Z045-1FBG676CES	Xilinx Inc.	数据表	23 In Stock	-	最小起订量: 1 最小包装量: 1	676-BBGA, FCBGA	YES		130			0°C~85°C TJ	Tray	2010	Zynq®-7000		Obsolete	4 (72 Hours)	676			BOTTOM	BALL		1V	1mm		667MHz		XC7Z045	S-PBGA-B676	1.05V	0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	ARM	YES	256000	Kintex™-7 FPGA, 350K Logic Cells	CAN; ETHERNET; I2C; SPI; UART; USB	2.54mm	27mm	27mm	符合RoHS标准
XC7Z030-1FF676I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	676-BBGA, FCBGA	YES		4		-40°C~100°C TJ	Tray		Zynq®-7000		活跃	4 (72 Hours)	676	GPIO WITH FOUR 32-BIT BANKS	8542.39.00.01	BOTTOM	BALL								S-PBGA-B676				667MHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	667MHz	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		YES	256000	Kintex™-7 FPGA, 125K Logic Cells	CAN, ETHERNET, I2C, PCI, SPI, UART, USB				Non-RoHS Compliant
XCZU2EG-3SFVC784E	Xilinx Inc.	数据表	626 In Stock	-	最小起订量: 1 最小包装量: 1	25 Weeks	784-BFBGA, FCBGA	YES		252		0°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG		Obsolete	4 (72 Hours)	784		8542.31.00.01	BOTTOM	BALL		0.9V		compliant				S-PBGA-B784				600MHz, 667MHz, 1.5GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
XCZU17EG-3FFVC1760E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1760-BBGA, FCBGA		512			0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明					未说明						600MHz, 667MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 926K+ Logic Cells					ROHS3 Compliant
XC7Z045-3FFV676E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	10 Weeks	676-BBGA, FCBGA		130			0°C~100°C TJ	Bulk	2009	Zynq®-7000		活跃	4 (72 Hours)																	1GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Kintex™-7 FPGA, 350K Logic Cells					ROHS3 Compliant
XCZU17EG-2FFVC1760I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1760-BBGA, FCBGA		512			-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明					未说明						533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 926K+ Logic Cells					ROHS3 Compliant
XC7Z015-2CL485I	Xilinx Inc.	数据表	84 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	484-LFBGA, CSPBGA	484-CSPBGA (19x19)		130		-40°C~100°C TJ	Bulk	2010	Zynq®-7000		活跃	2A (4 Weeks)																	766MHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Artix™-7 FPGA, 74K Logic Cells					Non-RoHS Compliant
XCZU25DR-1FFVE1156I5040	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		FBGA-1156			ARM Cortex A53, ARM Cortex R5F	SMD/SMT	2 x 32 kB, 2 x 32 kB	2 x 32 kB, 2 x 32 kB	256 kB	678318 LE	394 I/O	- 40 C	+ 100 C	9.6 Mb	38761 LAB	1																				850 mV											8 Transceiver	6 Core