Xilinx的片上系统（SoC）_正品采购_价格信息

品牌是'Xilinx' (1945)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	工厂交货时间	包装/外壳	表面安装	供应商器件包装				操作温度	包装	已出版	系列	零件状态	湿度敏感性等级(MSL)	终止次数	最高工作温度	最小工作温度	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	电源电压	端子间距	Reach合规守则	频率	时间@峰值回流温度-最大值(s)	基本部件号	电源电压-最大值(Vsup)	温度等级	电源电压-最小值(Vsup)	界面	速度	内存大小	uPs/uCs/外围ICs类型	核心处理器	周边设备	连接方式	建筑学	核心架构	主要属性	座位高度(最大)	长度	宽度
XAZU4EV-1SFVC784Q	Xilinx Inc.	数据表	23 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	YES		125°C	-40°C						活跃	3 (168 Hours)	784				8542.31.00.01	BOTTOM	BALL	未说明	0.85V	0.8mm			未说明		S-PBGA-B784	AUTOMOTIVE					微处理器电路							3.32mm	23mm	23mm	ROHS3 Compliant
XAZU2EG-1SFVA625I	Xilinx Inc.	数据表	232 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA	YES		128	-40°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG	活跃	4 (72 Hours)	625				8542.31.00.01	BOTTOM	BALL	未说明	0.85V	0.8mm			未说明		S-PBGA-B625				500MHz, 1.2GHz	1.2MB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, I2C, SPI, UART/USART, USB	MPU, FPGA		Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	3.43mm	21mm	21mm	ROHS3 Compliant
XCZU19EG-1FFVE1924I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1924-BBGA, FCBGA	668			-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG	活跃	4 (72 Hours)					8542.31.00.01			未说明					未说明						500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells				ROHS3 Compliant
XCZU3EG-3SFVC784E	Xilinx Inc.	数据表	692 In Stock	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	YES	252			0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG	Obsolete	4 (72 Hours)	784				8542.31.00.01	BOTTOM	BALL	未说明	0.9V				未说明		S-PBGA-B784				600MHz, 667MHz, 1.5GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 154K+ Logic Cells				Non-RoHS Compliant
XAZU4EV-L1SFVC784I	Xilinx Inc.	数据表	268 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	YES		100°C	-40°C						活跃	3 (168 Hours)	784				8542.31.00.01	BOTTOM	BALL	未说明	0.72V	0.8mm			未说明		S-PBGA-B784	INDUSTRIAL					微处理器电路							3.32mm	23mm	23mm	ROHS3 Compliant
XCZU7CG-L2FBVB900E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	YES		204	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG	活跃	4 (72 Hours)	900			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V				未说明		R-PBGA-B900	0.742V	0.698V		533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 504K+ Logic Cells				ROHS3 Compliant
XCZU7CG-L1FFVF1517I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA	YES		464	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG	活跃	4 (72 Hours)				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V				未说明		R-PBGA-B1517	0.742V	0.698V		500MHz, 1.2GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 504K+ Logic Cells				ROHS3 Compliant
XCZU17EG-L2FFVB1517E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA	YES		644	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG	活跃	4 (72 Hours)				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V				未说明		R-PBGA-B1517	0.742V	0.698V		533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 926K+ Logic Cells				ROHS3 Compliant
XCZU17EG-L1FFVC1760I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1760-BBGA, FCBGA	YES		512	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG	活跃	4 (72 Hours)				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V				未说明		R-PBGA-B1760	0.742V	0.698V		500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 926K+ Logic Cells				ROHS3 Compliant
XCZU19EG-L1FFVD1760I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1760-BBGA, FCBGA	YES		308	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG	活跃	4 (72 Hours)				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V				未说明		R-PBGA-B1760	0.742V	0.698V		500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells				ROHS3 Compliant
XCZU19EG-L2FFVE1924E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1924-BBGA, FCBGA	YES		668	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG	活跃	4 (72 Hours)				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V				未说明		R-PBGA-B1924	0.742V	0.698V		533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells				ROHS3 Compliant
XCZU4CG-L1FBVB900I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	YES		204	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG	活跃	4 (72 Hours)	900			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V				未说明		R-PBGA-B900	0.742V	0.698V		500MHz, 1.2GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 192K+ Logic Cells				ROHS3 Compliant
XCZU17EG-1FFVE1924I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1924-BBGA, FCBGA	668			-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG	活跃	4 (72 Hours)					8542.31.00.01			未说明					未说明						500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 926K+ Logic Cells				ROHS3 Compliant
XCZU2CG-L2SBVA484E	Xilinx Inc.	数据表	603 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	484-BFBGA, FCBGA	YES		82	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG	活跃	4 (72 Hours)	484			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V				未说明		R-PBGA-B484	0.742V	0.698V		533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 103K+ Logic Cells				ROHS3 Compliant
XCZU17EG-1FFVE1924E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1924-BBGA, FCBGA	668			0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG	活跃	4 (72 Hours)					8542.31.00.01			未说明					未说明						500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 926K+ Logic Cells				ROHS3 Compliant
XC7Z020-2CLG484CES	Xilinx Inc.	数据表	38 In Stock	-	最小起订量: 1 最小包装量: 1	484-LFBGA, CSPBGA	484-CSPBGA (19x19)	130			0°C~85°C TJ	Tray	2010	Zynq®-7000	Obsolete	3 (168 Hours)		85°C	0°C									766MHz		XC7Z020				CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	766MHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	ARM	Artix™-7 FPGA, 85K Logic Cells				符合RoHS标准
XCZU7CG-1FBVB900E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	204			0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG	活跃	4 (72 Hours)					8542.31.00.01			未说明					未说明						500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 504K+ Logic Cells				ROHS3 Compliant
XAZU3EG-1SBVA484Q	Xilinx Inc.	数据表	794 In Stock	-	最小起订量: 1 最小包装量: 1	6 Weeks	484-BFBGA, FCBGA	YES		128	-40°C~125°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG	活跃		484				8542.31.00.01	BOTTOM	BALL	未说明	0.85V	0.8mm			未说明		S-PBGA-B484				500MHz, 1.2GHz	1.8MB	微处理器电路	Quad ARM® Cortex®-A9 MPCore™ with CoreSight™, Dual ARM® Cortex®-R5 MPCore™ with CoreSight™	DMA, WDT	CANbus, I2C, SPI, UART/USART, USB	MPU, FPGA		Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	2.61mm	19mm	19mm	ROHS3 Compliant
XAZU4EV-1SFVC784I	Xilinx Inc.	数据表	264 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	YES		100°C	-40°C						活跃	3 (168 Hours)	784				8542.31.00.01	BOTTOM	BALL	未说明	0.85V	0.8mm			未说明		S-PBGA-B784	INDUSTRIAL					微处理器电路							3.32mm	23mm	23mm	ROHS3 Compliant
XAZU2EG-1SBVA484Q	Xilinx Inc.	数据表	93 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	484-BFBGA, FCBGA	YES		128	-40°C~125°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG	活跃		484				8542.31.00.01	BOTTOM	BALL	未说明	0.85V	0.8mm			未说明		S-PBGA-B484				500MHz, 1.2GHz	1.2MB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, I2C, SPI, UART/USART, USB	MPU, FPGA		Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	2.61mm	19mm	19mm	ROHS3 Compliant
XCZU7CG-L1FBVB900I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	YES		204	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG	活跃	4 (72 Hours)	900			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V				未说明		R-PBGA-B900	0.742V	0.698V		500MHz, 1.2GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 504K+ Logic Cells				ROHS3 Compliant
XCZU17EG-3FFVD1760E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1760-BBGA, FCBGA	308			0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG	活跃	4 (72 Hours)					8542.31.00.01			未说明					未说明						600MHz, 667MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 926K+ Logic Cells				ROHS3 Compliant
XCZU2EG-3SBVA484E	Xilinx Inc.	数据表	802 In Stock	-	最小起订量: 1 最小包装量: 1	484-BFBGA, FCBGA	YES	82			0°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG	Obsolete	4 (72 Hours)	484					BOTTOM	BALL		0.9V		compliant				S-PBGA-B484				600MHz, 667MHz, 1.5GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
XCZU19EG-3FFVE1924E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1924-BBGA, FCBGA	668			0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG	活跃	4 (72 Hours)					8542.31.00.01			未说明					未说明						600MHz, 667MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells				ROHS3 Compliant
XCZU2EG-3SFVA625E	Xilinx Inc.	数据表	652 In Stock	-	最小起订量: 1 最小包装量: 1	625-BFBGA, FCBGA	YES	180			0°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG	Obsolete	4 (72 Hours)	625					BOTTOM	BALL		0.9V		compliant				S-PBGA-B625				600MHz, 667MHz, 1.5GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 103K+ Logic Cells