Xilinx的片上系统（SoC）_正品采购_价格信息

品牌是'Xilinx' (1945)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	包装/外壳	供应商器件包装								厂商									操作温度	系列	子类别	工作电源电压	速度	内存大小	核心处理器	周边设备
XCVM1502-2MSIVFVC1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	+ 110 C	- 40 C	1	Xilinx	Xilinx						SOC - Systems on a Chip	800 mV							System-On-Modules - SOM				SoC FPGA
XCVC1502-1LSIVSVG1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Xilinx	Xilinx			+ 110 C		- 40 C			SOC - Systems on a Chip	700 mV							System-On-Modules - SOM				SoC FPGA
XCVM1402-1MSEVSVF1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Xilinx	Xilinx			+ 100 C		0 C			SOC - Systems on a Chip	800 mV							System-On-Modules - SOM				SoC FPGA
XCVM1402-1MSIVSVF1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Xilinx	Xilinx			+ 110 C		- 40 C			SOC - Systems on a Chip	800 mV							System-On-Modules - SOM				SoC FPGA
XCVM1502-1LSEVFVB1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Xilinx	Xilinx			+ 100 C		0 C			SOC - Systems on a Chip	700 mV							System-On-Modules - SOM				SoC FPGA
XCVC1702-2HSIVSVG1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Xilinx	Xilinx			+ 110 C		- 40 C			SOC - Systems on a Chip	880 mV							System-On-Modules - SOM				SoC FPGA
XCZU48DR-2FFVG1517I	Xilinx	数据表	630 In Stock	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD 赛灵思	561	Tray	活跃	-40°C ~ 100°C (TJ)	Zynq® UltraScale+™ RFSoC			533MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 930K+ Logic Cells		-
XCZU2CG-1UBVA530E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	530-WFBGA, FCBGA	530-FCBGA (16x9.5)	SMD/SMT	AMD 赛灵思	2 x 32 kB, 2 x 32 kB	256 kB	82	活跃	2 x 32 kB, 2 x 32 kB	103320 LE	+ 100 C	0 C	0°C ~ 100°C (TJ)			850 mV	500MHz, 1.2GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	4 Core	-
XCVC1802-2LLEVSVA2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD 赛灵思	770	Tray	活跃	0°C ~ 100°C (TJ)	Versal™ AI Core			450MHz, 1.08GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		Versal™ AI Core FPGA, 1.5M Logic Cells		-
XCVM1802-1MSEVSVD1760	Xilinx	数据表	3000 In Stock	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD 赛灵思	726	Tray	活跃	0°C ~ 100°C (TJ)	Versal™ Prime			600MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		Versal™ Prime FPGA, 1.9M Logic Cells		-
XAZU4EV-1SFVC784I4942	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1
XCZU2CG-1SFVC784E5074	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1
XCVM1802-2MSIVSVA2197-5200	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	+ 110 C	- 40 C	1	Xilinx	Xilinx						SOC - Systems on a Chip	800 mV							System-On-Modules - SOM				SoC FPGA
XCVC1802-1MSIVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD 赛灵思	692	Tray	活跃	-40°C ~ 100°C (TJ)	Versal™ AI Core			600MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA		Versal™ AI Core FPGA, 1.5M Logic Cells		-
XCVM1402-1MSENBVB1024-ES9919	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	0 C				1	Amphenol	Amphenol Aerospace	38999	Details	+ 100 C		D38999 III	Circular Connectors	800 mV							军规圆形连接器				军规圆形连接器
XCZU48DR-2FSVE1156E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD 赛灵思	Positronic	Amphenol Positronic	Details	366	Tray	活跃	5	0°C ~ 100°C (TJ)	Zynq® UltraScale+™ RFSoC	D-Sub Connectors		533MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Mixed Contact D-Sub Connectors	Zynq®UltraScale+™ FPGA, 930K+ Logic Cells		-	D-Sub Mixed Contact Connectors
XCZU47DR-L2FSVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD 赛灵思	Non-Compliant	561	活跃	-40°C ~ 100°C (TJ)				533MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 930K+ Logic Cells		-
XCZU43DR-1FSVE1156E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD 赛灵思	活跃	366	0°C ~ 100°C (TJ)				500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 930K+ Logic Cells		-
XCZU43DR-1FFVE1156E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD 赛灵思	活跃	366	0°C ~ 100°C (TJ)				500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 930K+ Logic Cells		-
XCZU49DR-2FSVF1760I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	AMD 赛灵思	622	Tray	活跃	-40°C ~ 100°C (TJ)	Zynq® UltraScale+™ RFSoC			533MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 930K+ Logic Cells		-
XCZU46DR-L2FSVH1760I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	AMD 赛灵思	574	Tray	活跃	-40°C ~ 100°C (TJ)	Zynq® UltraScale+™ RFSoC			533MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 930K+ Logic Cells		-
XCZU47DR-1FSVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD 赛灵思	366	Tray	活跃	-40°C ~ 100°C (TJ)	Zynq® UltraScale+™ RFSoC			500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 930K+ Logic Cells		-
XCVH1582-2LLELSVA4737	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	+ 110 C	0 C	1	Xilinx	Xilinx						SOC - Systems on a Chip	700 mV							System-On-Modules - SOM				SoC FPGA
XCZU57DR-2FSVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD 赛灵思	-	Tray	活跃	1	Xilinx	Xilinx	-40°C ~ 100°C (TJ)	Zynq® UltraScale+™ RFSoC DR	SOC - Systems on a Chip		533MHz, 1.3GHz	-	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA	Zynq® UltraScale+™ RFSoC		-	SoC FPGA
XCVM1802-2MSIVFVC1760-5189	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	+ 110 C	- 40 C	1	Xilinx	Xilinx						SOC - Systems on a Chip	800 mV							System-On-Modules - SOM				SoC FPGA