Xilinx的片上系统（SoC）_正品采购_价格信息

品牌是'Xilinx' (1945)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	工厂交货时间	触点镀层	底架	包装/外壳	表面安装	引脚数	供应商器件包装				操作温度	包装	已出版	系列	JESD-609代码	无铅代码	零件状态	湿度敏感性等级(MSL)	终止次数	ECCN 代码	端子表面处理	最高工作温度	最小工作温度	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	电源电压	端子间距	Reach合规守则	频率	时间@峰值回流温度-最大值(s)	基本部件号	JESD-30代码	资历状况	工作电源电压	电源电压-最大值(Vsup)	电源	电源电压-最小值(Vsup)	界面	最大电源电压	最小电源电压	速度	内存大小	uPs/uCs/外围ICs类型	核心处理器	周边设备	时钟频率	传播延迟	连接方式	建筑学	数据总线宽度	核心架构	最高频率	边界扫描	速度等级	内存(字)	主要属性	寄存器数量	总线兼容性	可擦除紫外线	座位高度(最大)	长度	宽度	辐射硬化
XC7Z035-3FBG676E	Xilinx Inc.	数据表	990 In Stock	1: ¥5,629.188718 10: ¥5,444.089669 25: ¥5,406.245948 50: ¥5,368.665290 查看所有的价格 -	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	676-BBGA, FCBGA		130			0°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	676							BOTTOM	BALL	未说明	1V	1mm		800MHz	未说明		S-PBGA-B676						CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		110 ps	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		ARM		YES	3	256000	Kintex™-7 FPGA, 275K Logic Cells	343800	CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	27mm	27mm		ROHS3 Compliant
XC7Z035-1FFG900C	Xilinx Inc.	数据表	990 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	900-BBGA, FCBGA	900-FCBGA (31x31)	130			0°C~85°C TJ	Tray	2010	Zynq®-7000			活跃	4 (72 Hours)				85°C	0°C									667MHz									CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV	667MHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		120 ps	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		ARM			1		Kintex™-7 FPGA, 275K Logic Cells	343800							ROHS3 Compliant
XC7Z035-L2FFG900I	Xilinx Inc.	数据表	591 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	900-BBGA, FCBGA	YES			130			-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	4 (72 Hours)	900	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)			PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	245	1V	1mm		800MHz	30		S-PBGA-B900			1.05V		0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		ARM		YES		256000	Kintex™-7 FPGA, 275K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB		3.35mm	31mm	31mm		ROHS3 Compliant
XC7Z030-3FBG676E	Xilinx Inc.	数据表	495 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	676-BBGA, FCBGA	YES	676	130			0°C~100°C TJ	Tray	2009	Zynq®-7000	e1		活跃	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)				8542.39.00.01	BOTTOM	BALL	245	1V	1mm		1GHz	30	XC7Z030			1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM		YES	-3	256000	Kintex™-7 FPGA, 125K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	27mm		无	ROHS3 Compliant
XC7Z045-1FFG676C	Xilinx Inc.	数据表	557 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	676-BBGA, FCBGA	YES			ROMless	130		0°C~85°C TJ	Tray	2009	Zynq®-7000	e1		活跃	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	BOTTOM	BALL	245	1V	1mm		667MHz	30	XC7Z045	S-PBGA-B676		1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM		YES	-1	256000	Kintex™-7 FPGA, 350K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB		3.37mm	27mm		无	ROHS3 Compliant
XCZU4EV-1SFVC784E	Xilinx Inc.	数据表	313 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA				252			0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)							8542.31.00.01			未说明					未说明											500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							Zynq®UltraScale+™ FPGA, 192K+ Logic Cells								ROHS3 Compliant
XCZU6CG-1FFVB1156I	Xilinx Inc.	数据表	513 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA				328			-40°C~100°C TJ	Bulk	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)							8542.31.00.01			未说明					未说明											500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							Zynq®UltraScale+™ FPGA, 469K+ Logic Cells								ROHS3 Compliant
XA7Z020-1CLG400Q	Xilinx Inc.	数据表	570 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	400-LFBGA, CSPBGA	400		130	Automotive grade		-40°C~125°C TJ	Tray	2010	Automotive, AEC-Q100, Zynq®-7000 XA	e1		活跃	3 (168 Hours)	400	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	BOTTOM	BALL	未说明		0.8mm		667MHz	未说明			不合格	1V		11.8V		CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB	微处理器电路	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM					Artix™-7 FPGA, 85K Logic Cells			N	1.6mm	17mm			ROHS3 Compliant
XC7Z010-L1CLG400I	Xilinx Inc.	数据表	495 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	400-LFBGA, CSPBGA		130			-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	400	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)			PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	未说明	1V	0.8mm		667MHz	未说明		S-PBGA-B400						CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		ARM		YES		256000	Artix™-7 FPGA, 28K Logic Cells	35200	CAN; ETHERNET; I2C; SPI; UART; USB		1.6mm	17mm	17mm		ROHS3 Compliant
XC7Z035-3FFG900E	Xilinx Inc.	数据表	948 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	900-BBGA, FCBGA		130			0°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	4 (72 Hours)	900		Tin/Silver/Copper (Sn/Ag/Cu)					BOTTOM	BALL	245	1V	1mm		800MHz	30		S-PBGA-B900						CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		90 ps	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		ARM		YES	3	256000	Kintex™-7 FPGA, 275K Logic Cells	343800	CAN; ETHERNET; I2C; SPI; UART; USB						ROHS3 Compliant
XCZU9EG-2FFVB1156E	Xilinx Inc.	数据表	869 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA				328			0°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG		yes	活跃	4 (72 Hours)							8542.31.00.01			未说明					未说明											533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							Zynq®UltraScale+™ FPGA, 599K+ Logic Cells								ROHS3 Compliant
XC7Z030-1FBG484C	Xilinx Inc.	数据表	980 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	484-BBGA, FCBGA	YES	484	130			0°C~85°C TJ	Tray	2009	Zynq®-7000	e1		活跃	4 (72 Hours)	484	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	BOTTOM	BALL	250	1V	1mm		667MHz	30	XC7Z030			1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM		YES	-1	256000	Kintex™-7 FPGA, 125K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	23mm		无	ROHS3 Compliant
XCZU11EG-2FFVC1760I	Xilinx Inc.	数据表	167 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1760-BBGA, FCBGA				512			-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)							8542.31.00.01			未说明					未说明											533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							Zynq®UltraScale+™ FPGA, 653K+ Logic Cells								ROHS3 Compliant
XC7Z007S-2CLG225I	Xilinx Inc.	数据表	744 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	225-LFBGA, CSPBGA	YES			54			-40°C~100°C TJ	Tray	2016	Zynq®-7000	e1	yes	活跃	3 (168 Hours)	225		Tin/Silver/Copper (Sn/Ag/Cu)					BOTTOM	BALL	260	1V	0.8mm			30		S-PBGA-B225			1.05V		0.95V				766MHz	256KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	800MHz		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				YES		256000	Artix™-7 FPGA, 23K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB		1.5mm	13mm	13mm		ROHS3 Compliant
XCZU4EG-1SFVC784E	Xilinx Inc.	数据表	285 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA				252			0°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)							8542.31.00.01			未说明					未说明											500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							Zynq®UltraScale+™ FPGA, 192K+ Logic Cells								ROHS3 Compliant
XCZU4EV-1FBVB900E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA				204			0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)							8542.31.00.01			未说明					未说明											500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							Zynq®UltraScale+™ FPGA, 192K+ Logic Cells								ROHS3 Compliant
XCZU3CG-1SFVC784I	Xilinx Inc.	数据表	252 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA				252			-40°C~100°C TJ	Bulk	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)							8542.31.00.01			未说明					未说明											500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							Zynq®UltraScale+™ FPGA, 154K+ Logic Cells								ROHS3 Compliant
XC7Z100-1FFG1156I	Xilinx Inc.	数据表	313 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	1156-BBGA, FCBGA		250			-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	4 (72 Hours)		3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	BOTTOM	BALL	245	1V	1mm	not_compliant	667MHz	30		S-PBGA-B1156			1.05V		0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM		YES	-1	256000	Kintex™-7 FPGA, 444K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB		3.1mm	35mm			ROHS3 Compliant
XCZU3CG-1SBVA484E	Xilinx Inc.	数据表	434 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	484-BFBGA, FCBGA				82			0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)							8542.31.00.01			未说明					未说明											500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							Zynq®UltraScale+™ FPGA, 154K+ Logic Cells								ROHS3 Compliant
XCZU9EG-2FFVB1156I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA				328			-40°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)							8542.31.00.01			未说明					未说明											533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							Zynq®UltraScale+™ FPGA, 599K+ Logic Cells								ROHS3 Compliant
XCZU4EV-1SFVC784I	Xilinx Inc.	数据表	656 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA				252			-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)							8542.31.00.01			未说明					未说明											500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							Zynq®UltraScale+™ FPGA, 192K+ Logic Cells								ROHS3 Compliant
XC7Z045-2FBG676E	Xilinx Inc.	数据表	182 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	676-BBGA, FCBGA			676-FCBGA (27x27)	130			0°C~100°C TJ	Tray	2009	Zynq®-7000			活跃	3 (168 Hours)				100°C	0°C									800MHz		XC7Z045							CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB			800MHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	733MHz		-2		Kintex™-7 FPGA, 350K Logic Cells							无	ROHS3 Compliant
XCZU9EG-1FFVB1156I	Xilinx Inc.	数据表	669 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA				328			-40°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)							8542.31.00.01			未说明					未说明											500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							Zynq®UltraScale+™ FPGA, 599K+ Logic Cells								ROHS3 Compliant
XCZU15EG-L1FFVB1156I	Xilinx Inc.	数据表	195 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA	YES			328			-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)						ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V				未说明		R-PBGA-B1156			0.742V		0.698V				500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							Zynq®UltraScale+™ FPGA, 747K+ Logic Cells								ROHS3 Compliant
XC7Z030-2SBG485E	Xilinx Inc.	数据表	795 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	484-FBGA, FCBGA	485	130			0°C~100°C TJ	Tray	2009	Zynq®-7000	e1		活跃	4 (72 Hours)	485	EAR99	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	未说明	1V	0.8mm		800MHz	未说明			不合格		1.05V	11.8V	0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB	微处理器电路	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM		YES		256000	Kintex™-7 FPGA, 125K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB	N	2.44mm	19mm			ROHS3 Compliant