Xilinx的片上系统（SoC）_正品采购_价格信息

品牌是'Xilinx' (1945)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	工厂交货时间	触点镀层	底架	包装/外壳	表面安装	引脚数				操作温度	包装	已出版	系列	JESD-609代码	无铅代码	零件状态	湿度敏感性等级(MSL)	终止次数	ECCN 代码	端子表面处理	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	电源电压	端子间距	频率	时间@峰值回流温度-最大值(s)	基本部件号	JESD-30代码	资历状况	工作电源电压	电源电压-最大值(Vsup)	电源	电源电压-最小值(Vsup)	界面	最大电源电压	最小电源电压	速度	内存大小	uPs/uCs/外围ICs类型	核心处理器	周边设备	时钟频率	传播延迟	连接方式	建筑学	数据总线宽度	核心架构	边界扫描	速度等级	内存(字)	主要属性	寄存器数量	总线兼容性	可擦除紫外线	座位高度(最大)	长度	宽度	辐射硬化
XCZU2EG-2SFVC784I	Xilinx Inc.	数据表	480 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	YES		252			-40°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	784				8542.31.00.01	BOTTOM	BALL	未说明	0.85V			未说明		R-PBGA-B784			0.876V		0.825V				533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 103K+ Logic Cells								ROHS3 Compliant
XCZU15EG-2FFVB1156I	Xilinx Inc.	数据表	444 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA			328			-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明											533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 747K+ Logic Cells								ROHS3 Compliant
XCZU4EV-2SFVC784E	Xilinx Inc.	数据表	404 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA			252			0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV		yes	活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明											533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 192K+ Logic Cells								ROHS3 Compliant
XC7Z045-3FBG676E	Xilinx Inc.	数据表	553 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	676-BBGA, FCBGA	YES		ROMless	130		0°C~100°C TJ	Tray	2009	Zynq®-7000	e1		活跃	3 (168 Hours)	676	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		8542.39.00.01	BOTTOM	BALL	245	1V	1mm	1GHz	30	XC7Z045	S-PBGA-B676		1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	YES	-3	256000	Kintex™-7 FPGA, 350K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	27mm		无	ROHS3 Compliant
XCZU4EV-2SFVC784I	Xilinx Inc.	数据表	457 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA			252			-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明											533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 192K+ Logic Cells								ROHS3 Compliant
XC7Z015-L1CLG485I	Xilinx Inc.	数据表	495 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	484-LFBGA, CSPBGA	130			-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	485	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	未说明	1V	0.8mm	667MHz	未说明		S-PBGA-B485						CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		120 ps	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		ARM	YES		256000	Artix™-7 FPGA, 74K Logic Cells	92400	CAN; ETHERNET; I2C; SPI; UART; USB		1.6mm	19mm	19mm		ROHS3 Compliant
XC7Z035-1FFG676C	Xilinx Inc.	数据表	990 In Stock	1: ¥1,161.054689 10: ¥1,095.334612 100: ¥1,033.334540 500: ¥974.843906 查看所有的价格 -	最小起订量: 1 最小包装量: 1	10 Weeks	676-BBGA, FCBGA	YES		130			0°C~85°C TJ	Tray	2010	Zynq®-7000	e1		活跃	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	未说明	1V	1mm	667MHz	未说明		S-PBGA-B676			1.05V		0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		ARM	YES		256000	Kintex™-7 FPGA, 275K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB		3.37mm	27mm	27mm		ROHS3 Compliant
XCZU4CG-1SFVC784I	Xilinx Inc.	数据表	600 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA			252			-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明											500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 192K+ Logic Cells								ROHS3 Compliant
XCZU9EG-2FFVC900I	Xilinx Inc.	数据表	566 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA			204			-40°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG	e1		活跃	4 (72 Hours)			Tin/Silver/Copper (Sn/Ag/Cu)		8542.31.00.01			未说明				未说明											533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 599K+ Logic Cells								ROHS3 Compliant
XC7Z020-L1CLG400I	Xilinx Inc.	数据表	495 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	400-LFBGA, CSPBGA	130			-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	400	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	未说明	1V	0.8mm	667MHz	未说明		S-PBGA-B400						CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		ARM	YES		256000	Artix™-7 FPGA, 85K Logic Cells	106400	CAN; ETHERNET; I2C; SPI; UART; USB		1.6mm	17mm	17mm		ROHS3 Compliant
XC7Z030-L2FFG676I	Xilinx Inc.	数据表	64 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	676-BBGA, FCBGA	130			-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	未说明	1V	1mm	800MHz	未说明		S-PBGA-B676						CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		100 ps	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		ARM	YES		256000	Kintex™-7 FPGA, 125K Logic Cells	157200	CAN; ETHERNET; I2C; SPI; UART; USB		3.24mm	27mm	27mm		ROHS3 Compliant
XCZU4EG-1SFVC784I	Xilinx Inc.	数据表	802 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA			252			-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明											500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 192K+ Logic Cells								ROHS3 Compliant
XCZU7EV-2FFVC1156I	Xilinx Inc.	数据表	893 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA			360			-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明											533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 504K+ Logic Cells								ROHS3 Compliant
XCZU3CG-1SFVA625E	Xilinx Inc.	数据表	205 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA			180			0°C~100°C TJ	Bulk	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明											500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 154K+ Logic Cells								ROHS3 Compliant
XCZU19EG-L1FFVC1760I	Xilinx Inc.	数据表	707 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1760-BBGA, FCBGA	YES		512			-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明		R-PBGA-B1760			0.742V		0.698V				500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells								ROHS3 Compliant
XCZU2CG-1SFVC784E	Xilinx Inc.	数据表	949 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA			252			0°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明											500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 103K+ Logic Cells								ROHS3 Compliant
XC7Z014S-1CLG484I	Xilinx Inc.	数据表	664 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	484-LFBGA, CSPBGA	YES		200			-40°C~100°C TJ	Tray	2016	Zynq®-7000	e3	yes	活跃	3 (168 Hours)	484		Matte Tin (Sn)		8542.31.00.01	BOTTOM	BALL	未说明	1V	0.8mm		未说明		S-PBGA-B484			1.05V		0.95V				667MHz	256KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	667MHz		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			YES		256000	Artix™-7 FPGA, 65K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB		1.6mm	19mm	19mm		ROHS3 Compliant
XC7Z045-L2FFG900I	Xilinx Inc.	数据表	879 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	900-BBGA, FCBGA	YES		130			-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	4 (72 Hours)	900	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	245	1V	1mm	800MHz	30		S-PBGA-B900			1.05V		0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		ARM	YES		256000	Kintex™-7 FPGA, 350K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB		3.35mm	31mm	31mm		ROHS3 Compliant
XC7Z030-3FFG676E	Xilinx Inc.	数据表	423 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	676-BBGA, FCBGA	YES	676		130	0°C~100°C TJ	Tray	2009	Zynq®-7000	e1		活跃	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	BOTTOM	BALL	245	1V	1mm	1GHz	30	XC7Z030			1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	YES	-3	256000	Kintex™-7 FPGA, 125K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB		3.24mm	27mm		无	ROHS3 Compliant
XCZU2EG-1SFVC784E	Xilinx Inc.	数据表	780 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA			252			0°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明											500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 103K+ Logic Cells								ROHS3 Compliant
XCZU3EG-1SFVC784I	Xilinx Inc.	数据表	725 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA			252			-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明											500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 154K+ Logic Cells								ROHS3 Compliant
XC7Z030-3SBG485E	Xilinx Inc.	数据表	990 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	484-FBGA, FCBGA	485		130	0°C~100°C TJ	Tray	2009	Zynq®-7000	e1		活跃	4 (72 Hours)	485	EAR99	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	未说明	1V	0.8mm	1GHz	未说明			不合格		1.05V	11.8V	0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB	微处理器电路	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	YES		256000	Kintex™-7 FPGA, 125K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB	N	2.44mm	19mm			ROHS3 Compliant
XCZU3CG-1SFVC784E	Xilinx Inc.	数据表	681 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA			252			0°C~100°C TJ	Bulk	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明											500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 154K+ Logic Cells								ROHS3 Compliant
XCZU3EG-2SFVC784I	Xilinx Inc.	数据表	963 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	YES		252			-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	784				8542.31.00.01	BOTTOM	BALL	未说明	0.85V			未说明		R-PBGA-B784			0.876V		0.825V				533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 154K+ Logic Cells								ROHS3 Compliant
XA7Z020-1CLG400I	Xilinx Inc.	数据表	990 In Stock	1: ¥207.428043 10: ¥195.686833 100: ¥184.610220 500: ¥174.160586 查看所有的价格 -	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	400-LFBGA, CSPBGA	400	130	Automotive grade		-40°C~100°C TJ	Tray	2010	Automotive, AEC-Q100, Zynq®-7000 XA	e1		活跃	4 (72 Hours)	400	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	BOTTOM	BALL	未说明		0.8mm	667MHz	未说明			不合格	1V		11.8V		CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB	微处理器电路	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM				Artix™-7 FPGA, 85K Logic Cells			N	1.6mm	17mm			ROHS3 Compliant