Xilinx的片上系统（SoC）_正品采购_价格信息

品牌是'Xilinx' (1945)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	底架	安装类型	包装/外壳	越来越多的功能	引脚数	外壳材料	供应商器件包装	质量	插入材料	后壳材料，电镀											厂商										操作温度	包装	系列	尺寸/尺寸	终止次数	连接器类型	类型	电阻	定位的数量	组成	性别	功率(瓦特)	电容量	额定电流	电压 - 供电	方向	屏蔽/屏蔽	入口保护	额定电流	频率	频率稳定性	输出量	外壳完成	外壳尺寸-插入	终端样式	接头数量	工作电源电压	失败率	引线间距	电路数量	纹波电流	测试频率	速度	内存大小	外壳尺寸，MIL	周边设备	连接方式	电缆开口	建筑学	输入	产品类别	等效串联电阻	比率-输入：输出	消耗功率	差分 - 输入：输出	输出格式
XCVM1302-1MSEVFVB1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1									+ 100 C	0 C	Xilinx	Xilinx																						SOC - Systems on a Chip								800 mV													System-On-Modules - SOM										SoC FPGA
XCVM1502-1LSIVFVB1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1									Xilinx	Xilinx	- 40 C	+ 110 C																						SOC - Systems on a Chip								700 mV													System-On-Modules - SOM										SoC FPGA
XCVM1502-1MLIVFVB1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1									Xilinx	Xilinx	- 40 C	+ 110 C																						SOC - Systems on a Chip								800 mV													System-On-Modules - SOM										SoC FPGA
XCZU25DR-L2FSVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1			Molex				Bulk	075577	活跃							Tray	*			活跃
XCZU28DR-L1FFVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1			TE Connectivity Deutsch 连接器				Bag	AFD57	活跃							Tray	MIL-DTL-26482 G Series II, AFD			活跃
XCZU49DR-1FFVF1760I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	面板安装	1760-BBGA, FCBGA	Bulkhead - Front Side Nut	Aluminum	1760-FCBGA (42.5x42.5)	Thermoplastic	-	Amphenol Aerospace Operations		-	Bulk	Metal	TV07RQDZ	活跃	Copper Alloy	Gold	622			-65°C ~ 175°C		MIL-DTL-38999 Series III, Tri-Start™ TV					Crimp		Receptacle, Male Pins	39 (38 + 1 Quadrax)		Black	Aviation, Marine, Military		Threaded	N (Normal)	Unshielded	抗环境干扰	-		黑锌镍	17-2							500MHz, 1.2GHz	256KB	-	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	-	MCU, FPGA								Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-	-							50.0µin (1.27µm)	-
XCVC1802-1LSEVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1210 (3225 Metric)	1210	KOA Speer Electronics, Inc.		Tape & Reel (TR)	活跃	692								-55°C ~ 155°C		SG73S-RT	0.126 L x 0.102 W (3.20mm x 2.60mm)	±2%		2		±200ppm/°C			12 kOhms		厚膜		1W												-			400MHz, 1GHz	256KB		Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA								Versal™ AI Core FPGA, 1.5M Logic Cells	-		Anti-Sulfur, Automotive AEC-Q200, Moisture Resistant, Pulse Withstanding			0.028 (0.70mm)						-
XCVC1802-1MSEVSVA2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	Knowles Syfer		Tape & Reel (TR)	活跃	770								0°C ~ 100°C (TJ)		*																												600MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA								Versal™ AI Core FPGA, 1.5M Logic Cells	-
XCZU47DR-2FSVG1517E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)		AMD 赛灵思			Non-Compliant	561	Tray	活跃						0°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																												533MHz, 1.333GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU48DR-1FSVG1517E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD 赛灵思	活跃									561	0°C ~ 100°C (TJ)																														500MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU25DR-L2FSVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Flanges	Compliant												Bulk	*			活跃		Crimp									Female					Straight						18																													无
XCZU48DR-2FFVG1517E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	17.3 kg	AMD 赛灵思		Compliant	561	Tray	活跃							0°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																												533MHz, 1.333GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA					1.6 kW			Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU48DR-2FFVE1156E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)		AMD 赛灵思			Non-Compliant	366	Tray	活跃						0°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																												533MHz, 1.333GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCVM1302-2LSEVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	2 Pin	1760-FCBGA (40x40)	- 25 C	160	B43641A9187M57	EPCOS / TDK	400 VDC	EPCOS / TDK	Details	402	AMD 赛灵思	Tray	活跃								0.2	+ 105 C	0°C ~ 100°C (TJ)	Bulk	B43641		20 %				长寿命电容器				180 uF		Capacitors								卡入式		700 mV		10 mm		0.99 A	100 Hz	450MHz, 1.08GHz	-		Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA		电解电容器	520 mOhms				Versal™ Prime FPGA, 70k Logic Cells	-	通用电解电容器		Aluminum Electrolytic Capacitors - Snap In	22 mm			30 mm
XCVM1402-2LSEVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	7 mm x 5 mm	1760-FCBGA (40x40)	+ 85 C	2.62 V	- 40 C	1000	2.37 V	CTS	CTS电子元件	Details	726	AMD 赛灵思	Tray	活跃									55 %	0°C ~ 100°C (TJ)	Reel	637												Oscillators			45 mA	148.35 MHz	25 PPM		SMD/SMT		700 mV						450MHz, 1.08GHz	-		Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA		标准振荡器				LVDS	Versal™ Prime FPGA, 1.2M Logic Cells	-			标准时钟振荡器		1.7 mm		7 mm	5 mm
XCZU47DR-L2FSVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	Panduit Corp		Bulk	Obsolete	366								-40°C ~ 100°C (TJ)		*																												533MHz, 1.333GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU47DR-2FSVE1156E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	0805 (2012 Metric)	0805		KOA Speer Electronics, Inc.			Tape & Reel (TR)	RN732A	Obsolete	366						-55°C ~ 155°C		RN73	0.079 L x 0.049 W (2.00mm x 1.25mm)	±0.5%		2		±25ppm/°C			1.18 kOhms		Thin Film		0.1W, 1/10W															533MHz, 1.333GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-		Moisture Resistant			0.024 (0.60mm)
XCZU47DR-L2FFVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)		Molex			Bulk	505433	活跃	561						-40°C ~ 100°C (TJ)		*																												533MHz, 1.333GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU48DR-1FFVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	Pulse Electronics		Bulk	Obsolete	366								-40°C ~ 100°C (TJ)		-																												500MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU46DR-2FSVH1760E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)		NXP USA Inc.			Tube	BLF6	活跃	574						0°C ~ 100°C (TJ)		*																												533MHz, 1.333GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU47DR-L2FFVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	24-VFQFN Exposed Pad	24-QFN (4x4)		Skyworks Solutions Inc.			Tray	SI5330	Obsolete	350 MHz	366					-40°C ~ 85°C		-								Fanout Buffer (Distribution), Translator								1.71V ~ 3.63V					LVPECL				1			533MHz, 1.333GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	CMOS, HSTL, LVTTL, SSTL			1:4		No/Yes		Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU48DR-L1FSVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)		Molex			Bulk	120084	活跃	366						-40°C ~ 100°C (TJ)		*																												500MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU48DR-L1FFVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)		TE Connectivity Deutsch 连接器			Bag	YDL68G	活跃	366						-40°C ~ 100°C (TJ)		*																												500MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU49DR-L1FSVF1760I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)		Molex			Bulk	073404	活跃	622						-40°C ~ 100°C (TJ)		*																												500MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU48DR-2FSVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)		Molex			Bulk	098853	活跃	561						-40°C ~ 100°C (TJ)		*																												533MHz, 1.333GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-