3M Interconnect Solutions 567/BPA

表面安装

NO

终端数量

8

Manufacturer Part Number

567/BPA

Rohs Code

无

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Package Description

DIP, DIP8,.3

Risk Rank

5.87

Supply Voltage-Nom (Vsup)

5 V

Package Style

IN-LINE

Package Shape

RECTANGULAR

Package Equivalence Code

DIP8,.3

Package Code

DIP

Package Body Material

CERAMIC

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T8

资历状况

不合格

电源

5 V

温度等级

MILITARY

筛选水平

38535Q/M;38534H;883B