Allegro MicroSystems ULS2803H883

表面安装

NO

终端数量

18

晶体管元件材料

SILICON

Manufacturer Part Number

ULS2803H883

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ALLEGRO MICROSYSTEMS LLC

Part Package Code

DIP

Package Description

HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-18

Risk Rank

5.3

Number of Elements

8

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Package Shape

RECTANGULAR

Package Style

IN-LINE

ECCN 代码

EAR99

端子位置

DUAL

终端形式

THROUGH-HOLE

Reach合规守则

compliant

引脚数量

18

JESD-30代码

R-CDIP-T18

资历状况

不合格

配置

8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR

晶体管应用

SWITCHING

极性/通道类型

NPN

集电极电流-最大值(IC)

0.5 A

集电极-发射器电压-最大值

50 V