AMD 218S6ECLA13FG

表面安装

YES

终端数量

549

Package Description

FBGA,

Package Style

GRID ARRAY, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Supply Voltage-Nom

1.2 V

Supply Voltage-Min

1.14 V

Operating Temperature-Max

45 °C

Manufacturer Part Number

218S6ECLA13FG

Package Code

FBGA

Package Shape

SQUARE

Manufacturer

AMD

Part Life Cycle Code

活跃

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Supply Voltage-Max

1.26 V

Risk Rank

5.63

Part Package Code

BGA

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

compliant

引脚数量

549

JESD-30代码

S-PBGA-B549

资历状况

不合格

温度等级

COMMERCIAL

uPs/uCs/外围ICs类型

SYSTEM INTERFACE LOGIC, CONTROL AND COMMAND SIGNAL GENERATOR

座位高度-最大

2.48 mm

宽度

23 mm

长度

23 mm