AMD 3341APC

表面安装

NO

终端数量

16

Package Description

DIP, DIP16,.3

Package Style

IN-LINE

Number of Words Code

64

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP16,.3

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

3341APC

Clock Frequency-Max (fCLK)

0.75 MHz

Number of Words

64 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

AMD

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Risk Rank

8.68

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

FIFOs

技术

MOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T16

资历状况

不合格

电源

5 V

温度等级

COMMERCIAL

操作模式

ASYNCHRONOUS

组织结构

64X4

内存宽度

4

内存IC类型

其他先进先出