AMD 3341DCB

表面安装

NO

终端数量

16

Manufacturer Part Number

3341DCB

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Package Description

DIP, DIP16,.3

Risk Rank

5.8

Clock Frequency-Max (fCLK)

0.75 MHz

Number of Words

64 words

Number of Words Code

64

Operating Temperature-Max

70 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP16,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Nom (Vsup)

5 V

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T16

电源

5 V

温度等级

COMMERCIAL

操作模式

ASYNCHRONOUS

组织结构

64X4

内存宽度

4

内存IC类型

其他先进先出