AMD 8200801JA

表面安装

NO

终端数量

24

Manufacturer Part Number

8200801JA

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Part Package Code

DIP

Package Description

DIP,

Risk Rank

7.57

Access Time-Max

95 ns

Number of Words

4096 words

Number of Words Code

4000

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC, GLASS-SEALED

Package Code

DIP

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Nom (Vsup)

5 V

Usage Level

Military grade

ECCN 代码

EAR99

HTS代码

8542.32.00.71

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

Reach合规守则

unknown

引脚数量

24

JESD-30代码

R-GDIP-T24

电源电压-最大值(Vsup)

5.5 V

温度等级

MILITARY

电源电压-最小值(Vsup)

4.5 V

操作模式

ASYNCHRONOUS

组织结构

4KX8

内存宽度

8

记忆密度

32768 bit

筛选水平

MIL-STD-883

并行/串行

PARALLEL

内存IC类型

OTP ROM