AMD AM27S13DM

表面安装

NO

终端数量

16

RoHS

Non-Compliant

Package Description

DIP, DIP16,.3

Package Style

IN-LINE

Number of Words Code

512

Package Body Material

CERAMIC

Package Equivalence Code

DIP16,.3

Operating Temperature-Min

-55 °C

Access Time-Max

60 ns

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

AM27S13DM

Number of Words

512 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

AMD

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Risk Rank

8.75

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

OTP ROM

技术

TTL

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T16

资历状况

不合格

电源

5 V

温度等级

MILITARY

组织结构

512X4

内存宽度

4

记忆密度

2048 bit

筛选水平

MIL-STD-883 Class C

内存IC类型

OTP ROM