AMD AM27S33ADM

表面安装

NO

终端数量

18

RoHS

Non-Compliant

Package Description

DIP,

Package Style

IN-LINE

Number of Words Code

1000

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Operating Temperature-Min

-55 °C

Access Time-Max

45 ns

Operating Temperature-Max

125 °C

Manufacturer Part Number

AM27S33ADM

Number of Words

1024 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Rochester Electronics LLC

Part Life Cycle Code

活跃

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Risk Rank

5.45

技术

BIPOLAR

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

Reach合规守则

unknown

JESD-30代码

R-CDIP-T18

电源电压-最大值(Vsup)

5.5 V

温度等级

MILITARY

电源电压-最小值(Vsup)

4.5 V

操作模式

ASYNCHRONOUS

组织结构

1KX4

内存宽度

4

记忆密度

4096 bit

并行/串行

PARALLEL

内存IC类型

OTP ROM