AMD AM2909ADC

表面安装

NO

终端数量

28

Package Description

DIP,

Package Style

IN-LINE

Package Body Material

CERAMIC, GLASS-SEALED

Supply Voltage-Nom

5 V

Supply Voltage-Min

4.75 V

Operating Temperature-Max

70 °C

Risk Rank

5.57

Supply Voltage-Max

5.25 V

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Part Life Cycle Code

活跃

Manufacturer

Rochester Electronics LLC

Package Shape

RECTANGULAR

Package Code

DIP

Manufacturer Part Number

AM2909ADC

HTS代码

8542.31.00.01

技术

TTL

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

JESD-30代码

R-GDIP-T28

温度等级

COMMERCIAL

uPs/uCs/外围ICs类型

BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER

座位高度-最大

5.715 mm

外部数据总线宽度

4

宽度

15.24 mm

长度

37.211 mm

达到SVHC

unknown