AMD AM2953A/BLA

表面安装

NO

终端数量

24

Manufacturer Part Number

ACH550-BDR-08A8-4+B055+F267+K454+L512

Manufacturer

ABB

Package Description

DIP, DIP24,.3

Package Style

IN-LINE

Package Body Material

CERAMIC

Package Equivalence Code

DIP24,.3

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Rohs Code

无

Package Code

DIP

Package Shape

RECTANGULAR

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Risk Rank

5.9

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

并行 IO 端口

技术

ECL

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T24

资历状况

不合格

温度等级

MILITARY

比特数

8

筛选水平

38535Q/M;38534H;883B