AMD AM2964BDM

表面安装

NO

终端数量

40

Manufacturer Part Number

AM2964BDM

Part Life Cycle Code

活跃

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Package Description

DIP,

Risk Rank

5.59

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Package Code

DIP

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Max

5.5 V

Supply Voltage-Nom

5 V

Supply Voltage-Min

4.5 V

ECCN 代码

3A001.A.2.C

HTS代码

8542.31.00.01

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-CDIP-T40

温度等级

MILITARY

uPs/uCs/外围ICs类型

MEMORY CONTROLLER, DRAM

座位高度-最大

5.715 mm

地址总线宽度

16

边界扫描

NO

低功率模式

NO

库存数量

4

组织的记忆

176K X 8

长度

52.324 mm

宽度

15.24 mm