AMD AM2971DEB

表面安装

NO

终端数量

24

Risk Rank

5.92

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Part Life Cycle Code

Obsolete

Manufacturer

AMD

Package Shape

RECTANGULAR

Package Code

DIP

Manufacturer Part Number

AM2971DEB

Rohs Code

无

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Equivalence Code

DIP24,.6

Package Body Material

CERAMIC

Package Style

IN-LINE

Package Description

DIP, DIP24,.6

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

现场可编程门阵列

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T24

温度等级

MILITARY

可编程逻辑类型

现场可编程门阵列