AMD AM9130CDC-B

表面安装

NO

终端数量

22

Manufacturer

Miscellaneous

Package Description

DIP, DIP22,.4

Package Style

IN-LINE

Number of Words Code

1000

Package Body Material

CERAMIC

Package Equivalence Code

DIP22,.4

Access Time-Max

300 ns

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

AM9130CDCB

Number of Words

1024 words

Package Code

DIP

Package Shape

RECTANGULAR

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Risk Rank

5.92

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

SRAMs

技术

MOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T22

温度等级

COMMERCIAL

操作模式

ASYNCHRONOUS

组织结构

1KX4

输出特性

3-STATE

内存宽度

4

记忆密度

4096 bit

并行/串行

PARALLEL

I/O类型

COMMON

内存IC类型

标准SRAM