AMD AM9708DM-B

表面安装

NO

终端数量

24

Package Description

DIP, DIP24,.6

Package Style

IN-LINE

Number of Words Code

1000

Package Body Material

CERAMIC

Package Equivalence Code

DIP24,.6

Operating Temperature-Min

-55 °C

Access Time-Max

480 ns

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

AM9708DMB

Number of Words

1024 words

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

AMD

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Risk Rank

5.87

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

其他存储器集成电路

技术

MOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T24

资历状况

不合格

温度等级

MILITARY

组织结构

1KX8

输出特性

3-STATE

内存宽度

8

记忆密度

8192 bit

筛选水平

MIL-STD-883 Class B (Modified)