AMD ID82C55A

表面安装

NO

终端数量

40

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Part Package Code

DIP

Package Description

HERMETIC SEALED, CERAMIC, DIP-40

Clock Frequency-Max

2.5 MHz

Number of I/O Lines

24

Operating Temperature-Max

70 °C

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Package Code

DIP

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Max

5.5 V

Supply Voltage-Min

4.5 V

Supply Voltage-Nom

5 V

ECCN 代码

EAR99

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

引脚数量

40

JESD-30代码

R-CDIP-T40

资历状况

不合格

温度等级

COMMERCIAL

端口的数量

3

uPs/uCs/外围ICs类型

PARALLEL IO PORT, GENERAL PURPOSE

座位高度-最大

5.715 mm

外部数据总线宽度

8

长度

52.324 mm

宽度

15.24 mm