AMD XC7K410T-1FBG900E

表面安装

YES

Contact plating

gold-plated

Number of pins

7

终端数量

900

Rohs Code

有

Part Life Cycle Code

活跃

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Package Description

FBGA-900

Operating Temperature-Max

100 °C

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA900,30X30,40

Package Shape

SQUARE

Package Style

网格排列

Supply Voltage-Max

1.03 V

Supply Voltage-Min

0.97 V

Supply Voltage-Nom

1 V

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

1x7

Gross weight

0.41 g

Operating temperature

-40...163°C

JESD-609代码

e1

端子表面处理

锡银铜

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

245

端子间距

1 mm

Reach合规守则

compliant

Current rating

1.5A

时间@峰值回流温度-最大值(s)

30

JESD-30代码

S-PBGA-B900

资历状况

不合格

温度等级

OTHER

座位高度-最大

2.54 mm

可编程逻辑类型

现场可编程门阵列

CLB-Max的组合延时

0.74 ns

Rated voltage

60V

个人资料

beryllium copper

饱和电流

4

长度

31 mm

宽度

31 mm

Plating thickness

0.75µm

Flammability rating

UL94V-0