AMD XCZU2CG-2LSBVA484I

表面安装

YES

终端数量

484

Rohs Code

有

Part Life Cycle Code

活跃

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Package Description

FCBGA-484

Operating Temperature-Max

100 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA484,22X22,32

Package Shape

SQUARE

Package Style

GRID ARRAY, FINE PITCH

Supply Voltage-Nom

0.85 V

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B484

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

PROGRAMMABLE SoC

座位高度-最大

2.61 mm

总线兼容性

CAN, I2C, SPI, UART

长度

19 mm

宽度

19 mm