AMD Xilinx 5962R9957401NUX

表面安装

YES

终端数量

560

Part Life Cycle Code

Transferred

Ihs Manufacturer

XILINX INC

Part Package Code

BGA

Package Description

PLASTIC, BGA-560

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

PLASTIC/EPOXY

Package Code

LBGA

Package Shape

SQUARE

Package Style

GRID ARRAY, LOW PROFILE

Supply Voltage-Max

2.625 V

Supply Voltage-Min

2.375 V

Supply Voltage-Nom

2.5 V

ECCN 代码

3A001.A.2.C

HTS代码

8542.39.00.01

端子位置

BOTTOM

终端形式

BALL

端子间距

1.27 mm

Reach合规守则

compliant

引脚数量

560

JESD-30代码

S-PBGA-B560

资历状况

Qualified

温度等级

MILITARY

组织结构

1124022 GATES

座位高度-最大

1.7 mm

可编程逻辑类型

现场可编程门阵列

等效门数

1124022

长度

42.5 mm

宽度

42.5 mm