AMD Xilinx XC6SLX45-1LCSG324C

表面安装

YES

终端数量

324

Rohs Code

有

Part Life Cycle Code

Transferred

Ihs Manufacturer

XILINX INC

Part Package Code

BGA

Package Description

15 X 15 MM, 0.80 MM PITCH, LEAD FREE, MO-275, CSBGA-324

Clock Frequency-Max

500 MHz

Moisture Sensitivity Levels

3

Operating Temperature-Max

85 °C

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Equivalence Code

BGA324,18X18,32

Package Shape

SQUARE

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Supply Voltage-Max

1.26 V

Supply Voltage-Min

1.14 V

Supply Voltage-Nom

1.2 V

JESD-609代码

e1

端子表面处理

锡银铜

HTS代码

8542.39.00.01

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

compliant

引脚数量

324

JESD-30代码

S-PBGA-B324

资历状况

不合格

温度等级

OTHER

座位高度-最大

1.5 mm

可编程逻辑类型

现场可编程门阵列

长度

15 mm

宽度

15 mm