参数名
参数值
参数名
参数值
ECCN (US)
EAR99
Channel Mode
Enhancement
Number of Elements per Chip
1
Process Technology
LDMOS
Maximum Drain Source Voltage (V)
104
Maximum Gate Source Voltage (V)
11
Maximum Gate Threshold Voltage (V)
2.25
Maximum VSWR
35
Maximum Gate Source Leakage Current (nA)
140
Maximum IDSS (uA)
1.4
Maximum Drain Source Resistance (mOhm)
9000(Typ)@6V
Typical Input Capacitance @ Vds (pF)
3.4@0V
Typical Reverse Transfer Capacitance @ Vds (pF)
0.03@50V
Typical Output Capacitance @ Vds (pF)
1.12@50V
Output Power (W)
2.5
Typical Power Gain (dB)
22.8
Maximum Frequency (MHz)
1400
Minimum Frequency (MHz)
10
Typical Drain Efficiency (%)
62
Minimum Operating Temperature (°C)
-65
Maximum Operating Temperature (°C)
150
Supplier Package
HVSON EP
Military
无
Mounting
表面贴装
Package Height
0.82
Package Length
6
Package Width
5
PCB changed
12
Package Description
,
Manufacturer Part Number
BLP10H603
Manufacturer
恩智浦半导体
Part Life Cycle Code
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
Risk Rank
5.69
零件状态
活跃
Reach合规守则
unknown
引脚数量
12
配置
Single
信道型
N
操作方式
CW
RoHS状态
符合RoHS标准