Analog Devices, Inc. ADSP-21469KBCZ-ENG

表面安装

YES

终端数量

324

EU RoHS

Compliant

ECCN (US)

3A991.a.2

Automotive

无

PPAP

无

Family Name

ADSP-21xx

Instruction Set Architecture

Super Harvard

Numeric and Arithmetic Format

Floating-Point

Data Bus Width (bit)

40|32

Programmability

无

Interface Type

I2C/SPI/UART

Device Input Clock Speed (MHz)

450

USART

0

UART

1

I2C

1

I2S

0

Minimum Operating Supply Voltage (V)

3.13|1.7|1.05

Typical Operating Supply Voltage (V)

3.3|1.8|1.1

Maximum Operating Supply Voltage (V)

3.47|1.9|1.15

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

70

Supplier Temperature Grade

Commercial

Mounting

表面贴装

Package Height

1.21

Package Width

19

Package Length

19

PCB changed

324

Standard Package Name

BGA

Supplier Package

CSP-BGA

Lead Shape

Ball

Package Description

CSBGA-324

Package Style

网格排列

Package Body Material

PLASTIC/EPOXY

Supply Voltage-Min

1.05 V

Operating Temperature-Max

70 °C

Manufacturer Part Number

ADSP-21469KBCZ-ENG

Package Code

BGA

Package Shape

SQUARE

Manufacturer

Analog Devices Inc

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ANALOG DEVICES INC

Risk Rank

5.83

Part Package Code

BGA

零件状态

Unconfirmed

ECCN 代码

3A991.A.2

HTS代码

8542.31.00.01

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

1 mm

Reach合规守则

unknown

引脚数量

324

JESD-30代码

S-PBGA-B324

资历状况

不合格

温度等级

COMMERCIAL

速度

450 MHz

内存大小

640KB

uPs/uCs/外围ICs类型

MICROPROCESSOR

程序存储器类型

ROMLess

座位高度-最大

1.8 mm

地址总线宽度

16

边界扫描

YES

低功率模式

NO

外部数据总线宽度

16

格式

浮点

集成缓存

YES

以太网

0

USB

0

SPI,SPI

2

CAN

0

宽度

19 mm

长度

19 mm