参数名
参数值
参数名
参数值
表面安装
YES
终端数量
144
EU RoHS
不合规
ECCN (US)
3A991.a.2
SVHC
有
SVHC Exceeds Threshold
有
Automotive
无
PPAP
无
Family Name
ADSP-2184
Instruction Set Architecture
Enhanced Harvard
Numeric and Arithmetic Format
Fixed-Point
Data Bus Width (bit)
16
Device Million Instructions per Second (MIPS)
80
Programmability
无
Interface Type
UART
Device Input Clock Speed (MHz)
80
USART
0
UART
1
I2C
0
I2S
0
Minimum Operating Supply Voltage (V)
1.8
Typical Operating Supply Voltage (V)
3.3|2.5
Maximum Operating Supply Voltage (V)
3.6|2
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
85
Supplier Temperature Grade
Industrial
Mounting
表面贴装
Package Height
1(Max)
Package Width
10
Package Length
10
PCB changed
144
Standard Package Name
BGA
Supplier Package
CSP-BGA
Lead Shape
Ball
Package Description
LFBGA,
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
Moisture Sensitivity Levels
3
Package Body Material
PLASTIC/EPOXY
Operating Temperature-Min
-40 °C
Supply Voltage-Nom
1.8 V
Reflow Temperature-Max (s)
30
Supply Voltage-Min
1.71 V
Operating Temperature-Max
85 °C
Rohs Code
无
Manufacturer Part Number
ADSP-2185NBCA-320
Clock Frequency-Max
40 MHz
Package Code
LFBGA
Package Shape
SQUARE
Manufacturer
Rochester Electronics LLC
Part Life Cycle Code
活跃
Ihs Manufacturer
ROCHESTER ELECTRONICS INC
Supply Voltage-Max
1.89 V
Risk Rank
5.65
Part Package Code
BGA
JESD-609代码
e0
无铅代码
无
零件状态
Obsolete
端子表面处理
锡铅
技术
CMOS
端子位置
BOTTOM
终端形式
BALL
峰值回流焊温度(摄氏度)
240
端子间距
0.8 mm
Reach合规守则
unknown
引脚数量
144
JESD-30代码
S-PBGA-B144
资历状况
COMMERCIAL
温度等级
INDUSTRIAL
内存大小
80KB
uPs/uCs/外围ICs类型
DIGITAL SIGNAL PROCESSOR, OTHER
程序存储器类型
ROMLess
座位高度-最大
1.4 mm
地址总线宽度
14
边界扫描
NO
低功率模式
YES
外部数据总线宽度
24
格式
固定点
以太网
0
USB
0
桶式移位器
YES
内部总线架构
MULTIPLE
SPI,SPI
0
CAN
0
宽度
10 mm
长度
10 mm