Belden 934851004

包装/外壳

-

供应商器件包装

-

Number of I/Os

744

Package

Tray

厂商

Intel

Product Status

活跃

Permitted cable outer temperature after assembling without vibration

-40 - 125

Rated current In

16

Permitted cable outer temperature during assembling/handling

-40 - 125

Degree of protection (IP)

IP69K

Material of contact surface

Other

操作温度

0°C ~ 100°C (TJ)

系列

Agilex F

速度

1.4GHz

内存大小

256KB

核心处理器

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

周边设备

DMA, WDT

连接方式

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

建筑学

MPU, FPGA

主要属性

FPGA - 2.7M Logic Elements

闪光大小

-