Bourns HT9305AT

表面安装

NO

终端数量

20

Package Description

DIP, DIP20(UNSPEC)

Package Style

IN-LINE

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP20(UNSPEC)

Operating Temperature-Min

-20 °C

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

HT9305AT

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Holtek Semiconductor Inc

Part Life Cycle Code

活跃

Ihs Manufacturer

HOLTEK SEMICONDUCTOR INC

Risk Rank

5.78

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

电话回路

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

Reach合规守则

unknown

JESD-30代码

R-PDIP-T20

资历状况

不合格

电源

2.5/5 V

温度等级

COMMERCIAL

电源电流-最大值

2 mA

晶振频率

3.58 MHz